JP2527661Y2 - キャリアテーピング装置 - Google Patents
キャリアテーピング装置Info
- Publication number
- JP2527661Y2 JP2527661Y2 JP1990016517U JP1651790U JP2527661Y2 JP 2527661 Y2 JP2527661 Y2 JP 2527661Y2 JP 1990016517 U JP1990016517 U JP 1990016517U JP 1651790 U JP1651790 U JP 1651790U JP 2527661 Y2 JP2527661 Y2 JP 2527661Y2
- Authority
- JP
- Japan
- Prior art keywords
- carrier tape
- semiconductor package
- mount head
- carrier
- taping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 37
- 230000001070 adhesive effect Effects 0.000 claims description 37
- 229920002050 silicone resin Polymers 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000011144 upstream manufacturing Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 description 52
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000012050 conventional carrier Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000007791 dehumidification Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990016517U JP2527661Y2 (ja) | 1990-02-21 | 1990-02-21 | キャリアテーピング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990016517U JP2527661Y2 (ja) | 1990-02-21 | 1990-02-21 | キャリアテーピング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03108603U JPH03108603U (cs) | 1991-11-08 |
| JP2527661Y2 true JP2527661Y2 (ja) | 1997-03-05 |
Family
ID=31519780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990016517U Expired - Lifetime JP2527661Y2 (ja) | 1990-02-21 | 1990-02-21 | キャリアテーピング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2527661Y2 (cs) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59172798A (ja) * | 1983-03-22 | 1984-09-29 | 松下電器産業株式会社 | 電子部品のテ−ピング装置 |
| JPS63258717A (ja) * | 1987-04-10 | 1988-10-26 | ホ−プ精機株式会社 | ヒユ−ズクリツプのテ−ピング装置 |
-
1990
- 1990-02-21 JP JP1990016517U patent/JP2527661Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03108603U (cs) | 1991-11-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |