JP2526169Y2 - 半導体装置用リードフレーム - Google Patents

半導体装置用リードフレーム

Info

Publication number
JP2526169Y2
JP2526169Y2 JP1990095923U JP9592390U JP2526169Y2 JP 2526169 Y2 JP2526169 Y2 JP 2526169Y2 JP 1990095923 U JP1990095923 U JP 1990095923U JP 9592390 U JP9592390 U JP 9592390U JP 2526169 Y2 JP2526169 Y2 JP 2526169Y2
Authority
JP
Japan
Prior art keywords
lead
lead frame
inner leads
tip
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990095923U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0452755U (enExample
Inventor
仁 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP1990095923U priority Critical patent/JP2526169Y2/ja
Publication of JPH0452755U publication Critical patent/JPH0452755U/ja
Application granted granted Critical
Publication of JP2526169Y2 publication Critical patent/JP2526169Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1990095923U 1990-09-12 1990-09-12 半導体装置用リードフレーム Expired - Fee Related JP2526169Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990095923U JP2526169Y2 (ja) 1990-09-12 1990-09-12 半導体装置用リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990095923U JP2526169Y2 (ja) 1990-09-12 1990-09-12 半導体装置用リードフレーム

Publications (2)

Publication Number Publication Date
JPH0452755U JPH0452755U (enExample) 1992-05-06
JP2526169Y2 true JP2526169Y2 (ja) 1997-02-19

Family

ID=31835043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990095923U Expired - Fee Related JP2526169Y2 (ja) 1990-09-12 1990-09-12 半導体装置用リードフレーム

Country Status (1)

Country Link
JP (1) JP2526169Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7132735B2 (en) * 2005-03-07 2006-11-07 Agere Systems Inc. Integrated circuit package with lead fingers extending into a slot of a die paddle

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2606330B2 (ja) * 1988-11-02 1997-04-30 日本電気株式会社 半導体装置
JPH02156661A (ja) * 1988-12-09 1990-06-15 Mitsui High Tec Inc リードフレームおよびその製造方法
JPH02189944A (ja) * 1989-01-18 1990-07-25 Nec Ic Microcomput Syst Ltd 半導体集積回路装置
JPH02209760A (ja) * 1989-02-09 1990-08-21 Shinko Electric Ind Co Ltd 多重リードフレーム

Also Published As

Publication number Publication date
JPH0452755U (enExample) 1992-05-06

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