JP2525354Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2525354Y2
JP2525354Y2 JP1990009483U JP948390U JP2525354Y2 JP 2525354 Y2 JP2525354 Y2 JP 2525354Y2 JP 1990009483 U JP1990009483 U JP 1990009483U JP 948390 U JP948390 U JP 948390U JP 2525354 Y2 JP2525354 Y2 JP 2525354Y2
Authority
JP
Japan
Prior art keywords
tab tape
wiring board
semiconductor element
bonding position
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990009483U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03101528U (en:Method
Inventor
久夫 新井
憲司 坊野
幸治 今井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chichibu Fuji Co Ltd
Original Assignee
Chichibu Fuji Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chichibu Fuji Co Ltd filed Critical Chichibu Fuji Co Ltd
Priority to JP1990009483U priority Critical patent/JP2525354Y2/ja
Publication of JPH03101528U publication Critical patent/JPH03101528U/ja
Application granted granted Critical
Publication of JP2525354Y2 publication Critical patent/JP2525354Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP1990009483U 1990-01-31 1990-01-31 半導体装置 Expired - Fee Related JP2525354Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990009483U JP2525354Y2 (ja) 1990-01-31 1990-01-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990009483U JP2525354Y2 (ja) 1990-01-31 1990-01-31 半導体装置

Publications (2)

Publication Number Publication Date
JPH03101528U JPH03101528U (en:Method) 1991-10-23
JP2525354Y2 true JP2525354Y2 (ja) 1997-02-12

Family

ID=31513083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990009483U Expired - Fee Related JP2525354Y2 (ja) 1990-01-31 1990-01-31 半導体装置

Country Status (1)

Country Link
JP (1) JP2525354Y2 (en:Method)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1124644C (zh) 1996-10-17 2003-10-15 精工爱普生株式会社 半导体器件及其制造方法、电路基板和薄膜载带

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03129745A (ja) * 1989-10-16 1991-06-03 Sumitomo Bakelite Co Ltd 半導体装置の実装方法

Also Published As

Publication number Publication date
JPH03101528U (en:Method) 1991-10-23

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Legal Events

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