JP2524308Y2 - プローブカード - Google Patents
プローブカードInfo
- Publication number
- JP2524308Y2 JP2524308Y2 JP1989152350U JP15235089U JP2524308Y2 JP 2524308 Y2 JP2524308 Y2 JP 2524308Y2 JP 1989152350 U JP1989152350 U JP 1989152350U JP 15235089 U JP15235089 U JP 15235089U JP 2524308 Y2 JP2524308 Y2 JP 2524308Y2
- Authority
- JP
- Japan
- Prior art keywords
- probe
- insulating resin
- contact
- ring
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000523 sample Substances 0.000 title claims description 57
- 239000011347 resin Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 210000001015 abdomen Anatomy 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989152350U JP2524308Y2 (ja) | 1989-12-27 | 1989-12-27 | プローブカード |
US07/548,401 US5055778A (en) | 1989-10-02 | 1990-07-05 | Probe card in which contact pressure and relative position of each probe end are correctly maintained |
US07/735,214 US5134365A (en) | 1989-07-11 | 1991-07-24 | Probe card in which contact pressure and relative position of each probe end are correctly maintained |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989152350U JP2524308Y2 (ja) | 1989-12-27 | 1989-12-27 | プローブカード |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0390081U JPH0390081U (enrdf_load_stackoverflow) | 1991-09-13 |
JP2524308Y2 true JP2524308Y2 (ja) | 1997-01-29 |
Family
ID=31698619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989152350U Expired - Lifetime JP2524308Y2 (ja) | 1989-07-11 | 1989-12-27 | プローブカード |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2524308Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3624570B2 (ja) * | 1996-09-02 | 2005-03-02 | セイコーエプソン株式会社 | 液晶表示パネルの検査装置、液晶表示パネルの検査方法及び集積回路の実装方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59135739A (ja) * | 1983-01-25 | 1984-08-04 | Toshiba Corp | 半導体素子の測定装置 |
-
1989
- 1989-12-27 JP JP1989152350U patent/JP2524308Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0390081U (enrdf_load_stackoverflow) | 1991-09-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |