JP2523512Y2 - フラットパッケ−ジ型ｉｃ - Google Patents
フラットパッケ−ジ型ｉｃInfo
- Publication number
- JP2523512Y2 JP2523512Y2 JP1989119789U JP11978989U JP2523512Y2 JP 2523512 Y2 JP2523512 Y2 JP 2523512Y2 JP 1989119789 U JP1989119789 U JP 1989119789U JP 11978989 U JP11978989 U JP 11978989U JP 2523512 Y2 JP2523512 Y2 JP 2523512Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- concave portion
- flat package
- package type
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000007723 die pressing method Methods 0.000 description 1
- 210000004907 gland Anatomy 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989119789U JP2523512Y2 (ja) | 1989-10-13 | 1989-10-13 | フラットパッケ−ジ型ｉｃ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989119789U JP2523512Y2 (ja) | 1989-10-13 | 1989-10-13 | フラットパッケ−ジ型ｉｃ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0359648U JPH0359648U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-06-12 |
| JP2523512Y2 true JP2523512Y2 (ja) | 1997-01-29 |
Family
ID=31667887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989119789U Expired - Lifetime JP2523512Y2 (ja) | 1989-10-13 | 1989-10-13 | フラットパッケ−ジ型ｉｃ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2523512Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06270452A (ja) * | 1993-03-19 | 1994-09-27 | Sharp Corp | シリアルプリンタ |
| JP4384073B2 (ja) * | 2005-03-17 | 2009-12-16 | 第一電子工業株式会社 | 電子部品の製造方法 |
| JP2006278663A (ja) * | 2005-03-29 | 2006-10-12 | Tokyo Coil Engineering Kk | 表面実装部品 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01140647A (ja) * | 1987-11-27 | 1989-06-01 | Hitachi Ltd | 面装着型半導体パッケージ |
-
1989
- 1989-10-13 JP JP1989119789U patent/JP2523512Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0359648U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-06-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |