JP2517002Y2 - 半導体素子収納用パッケージ - Google Patents

半導体素子収納用パッケージ

Info

Publication number
JP2517002Y2
JP2517002Y2 JP1989051155U JP5115589U JP2517002Y2 JP 2517002 Y2 JP2517002 Y2 JP 2517002Y2 JP 1989051155 U JP1989051155 U JP 1989051155U JP 5115589 U JP5115589 U JP 5115589U JP 2517002 Y2 JP2517002 Y2 JP 2517002Y2
Authority
JP
Japan
Prior art keywords
package
positioning
lead
plan
positioning member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989051155U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02142538U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
定 加治佐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP1989051155U priority Critical patent/JP2517002Y2/ja
Publication of JPH02142538U publication Critical patent/JPH02142538U/ja
Application granted granted Critical
Publication of JP2517002Y2 publication Critical patent/JP2517002Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1989051155U 1989-04-28 1989-04-28 半導体素子収納用パッケージ Expired - Lifetime JP2517002Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989051155U JP2517002Y2 (ja) 1989-04-28 1989-04-28 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989051155U JP2517002Y2 (ja) 1989-04-28 1989-04-28 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH02142538U JPH02142538U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-12-04
JP2517002Y2 true JP2517002Y2 (ja) 1996-11-13

Family

ID=31570338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989051155U Expired - Lifetime JP2517002Y2 (ja) 1989-04-28 1989-04-28 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JP2517002Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5794952U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1980-12-01 1982-06-11
JPS6151849A (ja) * 1984-08-21 1986-03-14 Toshiba Corp フラツトパツケ−ジ形集積回路素子
JP2506989Y2 (ja) * 1988-06-03 1996-08-14 新光電気工業株式会社 高周波素子用パッケ―ジ

Also Published As

Publication number Publication date
JPH02142538U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-12-04

Similar Documents

Publication Publication Date Title
US5643835A (en) Process for manufacturing and mounting a semiconductor device leadframe having alignment tabs
JPH11289024A (ja) 半導体装置及びその製造方法
KR970067801A (ko) 반도체 장치 및 그 제조방법
US5728601A (en) Process for manufacturing a single in-line package for surface mounting
JPH10242374A (ja) 半導体装置
JP2517002Y2 (ja) 半導体素子収納用パッケージ
JP3656861B2 (ja) 半導体集積回路装置及び半導体集積回路装置の製造方法
JPH0126111Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH05259372A (ja) ハイブリッドｉｃ
JP2687493B2 (ja) 半導体装置の表面実装構造
JP2003051562A (ja) 半導体装置
JP2003123922A (ja) 半導体装置とソケットまたは実装基板との接続構造
JPH10340773A (ja) Ｉｃ用ソケット
JP4577686B2 (ja) 半導体装置及びその製造方法
JP2000357757A (ja) 半導体装置および電子回路装置
JP2593416Y2 (ja) チップ基板用ｉｃソケット
JPH05327161A (ja) 電子回路モジュール
JPH0631723Y2 (ja) 半導体装置
JP2536568B2 (ja) リ―ドフレ―ム
JP3170033B2 (ja) 電子回路装置
JP2004327912A (ja) 半導体パッケージおよび半導体装置
JPH03205859A (ja) 半導体装置
JPH09184850A (ja) 半導体加速度センサの基板実装方法
JP2885285B1 (ja) 集積回路パッケージ
JP2818700B2 (ja) 半導体装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term