JP2516394Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2516394Y2
JP2516394Y2 JP1988146753U JP14675388U JP2516394Y2 JP 2516394 Y2 JP2516394 Y2 JP 2516394Y2 JP 1988146753 U JP1988146753 U JP 1988146753U JP 14675388 U JP14675388 U JP 14675388U JP 2516394 Y2 JP2516394 Y2 JP 2516394Y2
Authority
JP
Japan
Prior art keywords
lead
semiconductor device
solder
burr
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988146753U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0267653U (cg-RX-API-DMAC10.html
Inventor
正博 上川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP1988146753U priority Critical patent/JP2516394Y2/ja
Publication of JPH0267653U publication Critical patent/JPH0267653U/ja
Application granted granted Critical
Publication of JP2516394Y2 publication Critical patent/JP2516394Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/0198—
    • H10W72/5449—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1988146753U 1988-11-10 1988-11-10 半導体装置 Expired - Lifetime JP2516394Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988146753U JP2516394Y2 (ja) 1988-11-10 1988-11-10 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988146753U JP2516394Y2 (ja) 1988-11-10 1988-11-10 半導体装置

Publications (2)

Publication Number Publication Date
JPH0267653U JPH0267653U (cg-RX-API-DMAC10.html) 1990-05-22
JP2516394Y2 true JP2516394Y2 (ja) 1996-11-06

Family

ID=31416536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988146753U Expired - Lifetime JP2516394Y2 (ja) 1988-11-10 1988-11-10 半導体装置

Country Status (1)

Country Link
JP (1) JP2516394Y2 (cg-RX-API-DMAC10.html)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS635912A (ja) * 1986-06-27 1988-01-11 Mitsubishi Plastics Ind Ltd 金属被覆合成樹脂成形品の製造方法
JPS6318853U (cg-RX-API-DMAC10.html) * 1986-07-23 1988-02-08

Also Published As

Publication number Publication date
JPH0267653U (cg-RX-API-DMAC10.html) 1990-05-22

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