JP2514430Y2 - ハイブリッドｉｃ - Google Patents

ハイブリッドｉｃ

Info

Publication number
JP2514430Y2
JP2514430Y2 JP1988020926U JP2092688U JP2514430Y2 JP 2514430 Y2 JP2514430 Y2 JP 2514430Y2 JP 1988020926 U JP1988020926 U JP 1988020926U JP 2092688 U JP2092688 U JP 2092688U JP 2514430 Y2 JP2514430 Y2 JP 2514430Y2
Authority
JP
Japan
Prior art keywords
hybrid
insulating sheet
terminals
base ribbon
ribbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988020926U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01125573U (is
Inventor
忠文 田代
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1988020926U priority Critical patent/JP2514430Y2/ja
Publication of JPH01125573U publication Critical patent/JPH01125573U/ja
Application granted granted Critical
Publication of JP2514430Y2 publication Critical patent/JP2514430Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1988020926U 1988-02-19 1988-02-19 ハイブリッドｉｃ Expired - Lifetime JP2514430Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988020926U JP2514430Y2 (ja) 1988-02-19 1988-02-19 ハイブリッドｉｃ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988020926U JP2514430Y2 (ja) 1988-02-19 1988-02-19 ハイブリッドｉｃ

Publications (2)

Publication Number Publication Date
JPH01125573U JPH01125573U (is) 1989-08-28
JP2514430Y2 true JP2514430Y2 (ja) 1996-10-16

Family

ID=31237706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988020926U Expired - Lifetime JP2514430Y2 (ja) 1988-02-19 1988-02-19 ハイブリッドｉｃ

Country Status (1)

Country Link
JP (1) JP2514430Y2 (is)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01120856A (ja) * 1987-11-04 1989-05-12 Sony Corp リードフレーム

Also Published As

Publication number Publication date
JPH01125573U (is) 1989-08-28

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