JP2513437Y2 - ワイヤボンディング装置 - Google Patents

ワイヤボンディング装置

Info

Publication number
JP2513437Y2
JP2513437Y2 JP1990077847U JP7784790U JP2513437Y2 JP 2513437 Y2 JP2513437 Y2 JP 2513437Y2 JP 1990077847 U JP1990077847 U JP 1990077847U JP 7784790 U JP7784790 U JP 7784790U JP 2513437 Y2 JP2513437 Y2 JP 2513437Y2
Authority
JP
Japan
Prior art keywords
lead frame
wire bonding
vertical movement
heating
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990077847U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0459141U (en)
Inventor
聡蔵 鳥越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP1990077847U priority Critical patent/JP2513437Y2/ja
Publication of JPH0459141U publication Critical patent/JPH0459141U/ja
Application granted granted Critical
Publication of JP2513437Y2 publication Critical patent/JP2513437Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1990077847U 1990-07-24 1990-07-24 ワイヤボンディング装置 Expired - Lifetime JP2513437Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990077847U JP2513437Y2 (ja) 1990-07-24 1990-07-24 ワイヤボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990077847U JP2513437Y2 (ja) 1990-07-24 1990-07-24 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JPH0459141U JPH0459141U (en)) 1992-05-21
JP2513437Y2 true JP2513437Y2 (ja) 1996-10-09

Family

ID=31809536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990077847U Expired - Lifetime JP2513437Y2 (ja) 1990-07-24 1990-07-24 ワイヤボンディング装置

Country Status (1)

Country Link
JP (1) JP2513437Y2 (en))

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2817080B2 (ja) * 1992-11-27 1998-10-27 株式会社カイジョー ボンディング装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0237732A (ja) * 1988-07-27 1990-02-07 Toshiba Corp ワイヤボンディング装置

Also Published As

Publication number Publication date
JPH0459141U (en)) 1992-05-21

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