JP2513268Y2 - 半導体用冷却器 - Google Patents
半導体用冷却器Info
- Publication number
- JP2513268Y2 JP2513268Y2 JP1989115646U JP11564689U JP2513268Y2 JP 2513268 Y2 JP2513268 Y2 JP 2513268Y2 JP 1989115646 U JP1989115646 U JP 1989115646U JP 11564689 U JP11564689 U JP 11564689U JP 2513268 Y2 JP2513268 Y2 JP 2513268Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- heat
- convex edge
- joined
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 46
- 230000017525 heat dissipation Effects 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 15
- 238000001816 cooling Methods 0.000 description 10
- 238000005219 brazing Methods 0.000 description 7
- 230000002950 deficient Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000005304 joining Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989115646U JP2513268Y2 (ja) | 1989-09-29 | 1989-09-29 | 半導体用冷却器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989115646U JP2513268Y2 (ja) | 1989-09-29 | 1989-09-29 | 半導体用冷却器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0353851U JPH0353851U (enrdf_load_stackoverflow) | 1991-05-24 |
| JP2513268Y2 true JP2513268Y2 (ja) | 1996-10-02 |
Family
ID=31663967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989115646U Expired - Lifetime JP2513268Y2 (ja) | 1989-09-29 | 1989-09-29 | 半導体用冷却器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2513268Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6695101B2 (ja) * | 2015-05-20 | 2020-05-20 | 三菱電機株式会社 | エレベータの制御装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61151393U (enrdf_load_stackoverflow) * | 1985-03-08 | 1986-09-18 | ||
| JPH0310695Y2 (enrdf_load_stackoverflow) * | 1985-08-21 | 1991-03-15 |
-
1989
- 1989-09-29 JP JP1989115646U patent/JP2513268Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0353851U (enrdf_load_stackoverflow) | 1991-05-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |