JP2510585Y2 - 半導体素子収納用パッケ―ジ - Google Patents

半導体素子収納用パッケ―ジ

Info

Publication number
JP2510585Y2
JP2510585Y2 JP5423090U JP5423090U JP2510585Y2 JP 2510585 Y2 JP2510585 Y2 JP 2510585Y2 JP 5423090 U JP5423090 U JP 5423090U JP 5423090 U JP5423090 U JP 5423090U JP 2510585 Y2 JP2510585 Y2 JP 2510585Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
coating layer
metal base
insulating coating
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP5423090U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0412637U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
博司 土岐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP5423090U priority Critical patent/JP2510585Y2/ja
Publication of JPH0412637U publication Critical patent/JPH0412637U/ja
Application granted granted Critical
Publication of JP2510585Y2 publication Critical patent/JP2510585Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Die Bonding (AREA)
JP5423090U 1990-05-24 1990-05-24 半導体素子収納用パッケ―ジ Expired - Lifetime JP2510585Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5423090U JP2510585Y2 (ja) 1990-05-24 1990-05-24 半導体素子収納用パッケ―ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5423090U JP2510585Y2 (ja) 1990-05-24 1990-05-24 半導体素子収納用パッケ―ジ

Publications (2)

Publication Number Publication Date
JPH0412637U JPH0412637U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-01-31
JP2510585Y2 true JP2510585Y2 (ja) 1996-09-11

Family

ID=31576111

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5423090U Expired - Lifetime JP2510585Y2 (ja) 1990-05-24 1990-05-24 半導体素子収納用パッケ―ジ

Country Status (1)

Country Link
JP (1) JP2510585Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPH0412637U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-01-31

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term