JP2509365Y2 - ワイヤボンディング装置 - Google Patents

ワイヤボンディング装置

Info

Publication number
JP2509365Y2
JP2509365Y2 JP1990130274U JP13027490U JP2509365Y2 JP 2509365 Y2 JP2509365 Y2 JP 2509365Y2 JP 1990130274 U JP1990130274 U JP 1990130274U JP 13027490 U JP13027490 U JP 13027490U JP 2509365 Y2 JP2509365 Y2 JP 2509365Y2
Authority
JP
Japan
Prior art keywords
wire
capillary
lead
wire bonding
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990130274U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0487646U (enExample
Inventor
千比呂 小池
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1990130274U priority Critical patent/JP2509365Y2/ja
Publication of JPH0487646U publication Critical patent/JPH0487646U/ja
Application granted granted Critical
Publication of JP2509365Y2 publication Critical patent/JP2509365Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1990130274U 1990-11-30 1990-11-30 ワイヤボンディング装置 Expired - Lifetime JP2509365Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990130274U JP2509365Y2 (ja) 1990-11-30 1990-11-30 ワイヤボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990130274U JP2509365Y2 (ja) 1990-11-30 1990-11-30 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JPH0487646U JPH0487646U (enExample) 1992-07-30
JP2509365Y2 true JP2509365Y2 (ja) 1996-09-04

Family

ID=31877630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990130274U Expired - Lifetime JP2509365Y2 (ja) 1990-11-30 1990-11-30 ワイヤボンディング装置

Country Status (1)

Country Link
JP (1) JP2509365Y2 (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0427168Y2 (enExample) * 1986-12-27 1992-06-30

Also Published As

Publication number Publication date
JPH0487646U (enExample) 1992-07-30

Similar Documents

Publication Publication Date Title
US8123108B2 (en) Method of manufacturing semiconductor device and wire bonding apparatus
US6595400B2 (en) Wire bonding apparatus
KR102411252B1 (ko) 와이어 본딩 장치
JPH0547860A (ja) ワイヤボンデイング方法
WO2023042333A1 (ja) ピンワイヤ形成方法、及びワイヤボンディング装置
JPH0530058B2 (enExample)
JPH02199846A (ja) ワイヤボンディング方法
JP3478510B2 (ja) ワイヤボンディング装置
JPH07105407B2 (ja) ダイボンディング方法
JPWO2020235211A1 (ja) ピン状ワイヤ成形方法及びワイヤボンディング装置
CN224223563U (zh) 一种键合铜丝的表面处理抛光机
JP2773541B2 (ja) ワイヤボンディング方法およびその装置
JP3417659B2 (ja) ワイヤボンディング装置
JP3255801B2 (ja) ワイヤボンディング方法
JPH0696978A (ja) コイル及びコイルの製造装置及び製造方法
JP3292770B2 (ja) ワイヤボンディング方法およびその装置
JP3369764B2 (ja) ワイヤボンディング装置における放電用トーチ電極体
JPH05160190A (ja) ワイヤボンディング装置及びワイヤボンディング方法
JPH0611066B2 (ja) ワイヤボンデイング装置
JP2925392B2 (ja) ボール式ワイヤボンディング方法
JPS6298629A (ja) ワイヤボンデイング方法
JP2905303B2 (ja) ワイヤボンディング方法および装置
JPH06132344A (ja) ワイヤボンディング装置
JPH0220833Y2 (enExample)
JP2591000Y2 (ja) 自動配線装置の電線供給機構