JP2508660Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2508660Y2
JP2508660Y2 JP11884990U JP11884990U JP2508660Y2 JP 2508660 Y2 JP2508660 Y2 JP 2508660Y2 JP 11884990 U JP11884990 U JP 11884990U JP 11884990 U JP11884990 U JP 11884990U JP 2508660 Y2 JP2508660 Y2 JP 2508660Y2
Authority
JP
Japan
Prior art keywords
semiconductor device
heat dissipation
board
wiring
laminated substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP11884990U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0476048U (en, 2012
Inventor
亮一 長岡
隆芳 真壁
栄一 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP11884990U priority Critical patent/JP2508660Y2/ja
Publication of JPH0476048U publication Critical patent/JPH0476048U/ja
Application granted granted Critical
Publication of JP2508660Y2 publication Critical patent/JP2508660Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP11884990U 1990-11-15 1990-11-15 半導体装置 Expired - Lifetime JP2508660Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11884990U JP2508660Y2 (ja) 1990-11-15 1990-11-15 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11884990U JP2508660Y2 (ja) 1990-11-15 1990-11-15 半導体装置

Publications (2)

Publication Number Publication Date
JPH0476048U JPH0476048U (en, 2012) 1992-07-02
JP2508660Y2 true JP2508660Y2 (ja) 1996-08-28

Family

ID=31866817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11884990U Expired - Lifetime JP2508660Y2 (ja) 1990-11-15 1990-11-15 半導体装置

Country Status (1)

Country Link
JP (1) JP2508660Y2 (en, 2012)

Also Published As

Publication number Publication date
JPH0476048U (en, 2012) 1992-07-02

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