JP2508634Y2 - 樹脂封止ピンヘッド型半導体素子 - Google Patents
樹脂封止ピンヘッド型半導体素子Info
- Publication number
- JP2508634Y2 JP2508634Y2 JP1990060310U JP6031090U JP2508634Y2 JP 2508634 Y2 JP2508634 Y2 JP 2508634Y2 JP 1990060310 U JP1990060310 U JP 1990060310U JP 6031090 U JP6031090 U JP 6031090U JP 2508634 Y2 JP2508634 Y2 JP 2508634Y2
- Authority
- JP
- Japan
- Prior art keywords
- header
- semiconductor substrate
- solder
- diameter
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990060310U JP2508634Y2 (ja) | 1990-06-07 | 1990-06-07 | 樹脂封止ピンヘッド型半導体素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990060310U JP2508634Y2 (ja) | 1990-06-07 | 1990-06-07 | 樹脂封止ピンヘッド型半導体素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0418456U JPH0418456U (US06521211-20030218-C00004.png) | 1992-02-17 |
| JP2508634Y2 true JP2508634Y2 (ja) | 1996-08-28 |
Family
ID=31587565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990060310U Expired - Lifetime JP2508634Y2 (ja) | 1990-06-07 | 1990-06-07 | 樹脂封止ピンヘッド型半導体素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2508634Y2 (US06521211-20030218-C00004.png) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60129137U (ja) * | 1984-02-03 | 1985-08-30 | 新電元工業株式会社 | 樹脂モ−ルド型半導体装置 |
| JPS6356946A (ja) * | 1986-08-28 | 1988-03-11 | Fuji Electric Co Ltd | 半導体素子 |
-
1990
- 1990-06-07 JP JP1990060310U patent/JP2508634Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0418456U (US06521211-20030218-C00004.png) | 1992-02-17 |
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