JP2506915Y2 - 混成集積回路モジュ―ル - Google Patents

混成集積回路モジュ―ル

Info

Publication number
JP2506915Y2
JP2506915Y2 JP1989062525U JP6252589U JP2506915Y2 JP 2506915 Y2 JP2506915 Y2 JP 2506915Y2 JP 1989062525 U JP1989062525 U JP 1989062525U JP 6252589 U JP6252589 U JP 6252589U JP 2506915 Y2 JP2506915 Y2 JP 2506915Y2
Authority
JP
Japan
Prior art keywords
circuit board
hybrid integrated
integrated circuit
circuit module
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989062525U
Other languages
English (en)
Japanese (ja)
Other versions
JPH032670U (US07608600-20091027-C00054.png
Inventor
忠彦 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP1989062525U priority Critical patent/JP2506915Y2/ja
Publication of JPH032670U publication Critical patent/JPH032670U/ja
Application granted granted Critical
Publication of JP2506915Y2 publication Critical patent/JP2506915Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP1989062525U 1989-05-31 1989-05-31 混成集積回路モジュ―ル Expired - Lifetime JP2506915Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989062525U JP2506915Y2 (ja) 1989-05-31 1989-05-31 混成集積回路モジュ―ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989062525U JP2506915Y2 (ja) 1989-05-31 1989-05-31 混成集積回路モジュ―ル

Publications (2)

Publication Number Publication Date
JPH032670U JPH032670U (US07608600-20091027-C00054.png) 1991-01-11
JP2506915Y2 true JP2506915Y2 (ja) 1996-08-14

Family

ID=31591753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989062525U Expired - Lifetime JP2506915Y2 (ja) 1989-05-31 1989-05-31 混成集積回路モジュ―ル

Country Status (1)

Country Link
JP (1) JP2506915Y2 (US07608600-20091027-C00054.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002259713A (ja) * 2001-02-27 2002-09-13 Honda Motor Co Ltd チューブ・ホース部品の統合管理システム
JP5974428B2 (ja) * 2011-07-14 2016-08-23 三菱電機株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0737337Y2 (ja) * 1988-04-20 1995-08-23 株式会社村田製作所 回路部品

Also Published As

Publication number Publication date
JPH032670U (US07608600-20091027-C00054.png) 1991-01-11

Similar Documents

Publication Publication Date Title
JP3042431B2 (ja) 電子部品の封止構造および封止方法
JP2017103321A (ja) 電子部品及びその製造方法、並びに回路基板
JPH0744320B2 (ja) 樹脂回路基板及びその製造方法
JP2019165043A (ja) 電子回路装置および回路基板の製造方法
JP2002043717A (ja) 電子部品およびその製造方法
JP2506915Y2 (ja) 混成集積回路モジュ―ル
US20070119911A1 (en) Method of forming a composite standoff on a circuit board
JP3118509B2 (ja) チップ抵抗器
JP3042682B2 (ja) サーマルヘッド及びサーマルヘッドの製造方法
JP3447728B2 (ja) チップ抵抗器
JPH02102563A (ja) 半導体装置とその製法
WO1997008773A1 (fr) Filtre dielectrique, procede de production correspondant et circuit en boitier realise par montage du filtre en boitier
JP3297642B2 (ja) チップ抵抗器
JPH04372101A (ja) 角形チップ抵抗器及びその製造方法
JP2806802B2 (ja) チップ抵抗器
JP2501668Y2 (ja) 表面実装用電気部品
JPH0514548Y2 (US07608600-20091027-C00054.png)
JP2866808B2 (ja) チップ抵抗器の製造方法
JPH05190302A (ja) チップ抵抗体及びその製造方法
JPH0751807Y2 (ja) フレキシブル回路基板
JP2591106B2 (ja) プリント配線板の製造方法
JPH10172806A (ja) 温度センサ及びその製造方法
JP2000261123A (ja) チップ抵抗器の実装構造およびチップ抵抗器の実装方法
JPS62291086A (ja) 配線回路基板
JPH03167890A (ja) プリント配線板ユニットの形成方法