JP2506606Y2 - ワイヤ―ボンディングリ―ドパタ―ン - Google Patents

ワイヤ―ボンディングリ―ドパタ―ン

Info

Publication number
JP2506606Y2
JP2506606Y2 JP1990079932U JP7993290U JP2506606Y2 JP 2506606 Y2 JP2506606 Y2 JP 2506606Y2 JP 1990079932 U JP1990079932 U JP 1990079932U JP 7993290 U JP7993290 U JP 7993290U JP 2506606 Y2 JP2506606 Y2 JP 2506606Y2
Authority
JP
Japan
Prior art keywords
lead
wire bonding
bonding lead
pattern
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990079932U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0438043U (enExample
Inventor
俊明 庄司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1990079932U priority Critical patent/JP2506606Y2/ja
Publication of JPH0438043U publication Critical patent/JPH0438043U/ja
Application granted granted Critical
Publication of JP2506606Y2 publication Critical patent/JP2506606Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP1990079932U 1990-07-25 1990-07-25 ワイヤ―ボンディングリ―ドパタ―ン Expired - Fee Related JP2506606Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990079932U JP2506606Y2 (ja) 1990-07-25 1990-07-25 ワイヤ―ボンディングリ―ドパタ―ン

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990079932U JP2506606Y2 (ja) 1990-07-25 1990-07-25 ワイヤ―ボンディングリ―ドパタ―ン

Publications (2)

Publication Number Publication Date
JPH0438043U JPH0438043U (enExample) 1992-03-31
JP2506606Y2 true JP2506606Y2 (ja) 1996-08-14

Family

ID=31624542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990079932U Expired - Fee Related JP2506606Y2 (ja) 1990-07-25 1990-07-25 ワイヤ―ボンディングリ―ドパタ―ン

Country Status (1)

Country Link
JP (1) JP2506606Y2 (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140627U (enExample) * 1987-03-07 1988-09-16
JP2840948B2 (ja) * 1988-08-23 1998-12-24 富士ゼロックス株式会社 半導体装置

Also Published As

Publication number Publication date
JPH0438043U (enExample) 1992-03-31

Similar Documents

Publication Publication Date Title
EP1034942A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
US5742009A (en) Printed circuit board layout to minimize the clock delay caused by mismatch in length of metal lines and enhance the thermal performance of microeletronics packages via condution through the package leads
JPS6046040A (ja) 半導体装置
JP2506606Y2 (ja) ワイヤ―ボンディングリ―ドパタ―ン
JP2681427B2 (ja) 半導体装置
JP2685037B2 (ja) セラミックケース
JPH04199552A (ja) Ｉｃパッケージ
JPH01191433A (ja) 集積回路素子
JPS6393125A (ja) 半導体集積回路
JPH0563331A (ja) 印刷回路基板
KR970013290A (ko) 적층형 볼 그리드 어레이 패키지
JPS62191161A (ja) 感熱記録ヘツド
JPH0774307A (ja) 半導体装置
JPH05190674A (ja) 半導体集積回路装置
JPH01200971A (ja) サーマルヘッド
JPH025561A (ja) 半導体装置
JPH01316948A (ja) 半導体集積回路
JPS6292456A (ja) 集積回路装置
JPH03241887A (ja) 実装回路装置
JPS62229951A (ja) 半導体集積回路装置
JPS62121070A (ja) サ−マルヘツド
JPH01165247U (enExample)
JPH0645338U (ja) 半導体装置
KR930001358A (ko) 반도체 장치
JPH0478150A (ja) Ｔａｂテープ

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees