JPH0438043U - - Google Patents
Info
- Publication number
- JPH0438043U JPH0438043U JP1990079932U JP7993290U JPH0438043U JP H0438043 U JPH0438043 U JP H0438043U JP 1990079932 U JP1990079932 U JP 1990079932U JP 7993290 U JP7993290 U JP 7993290U JP H0438043 U JPH0438043 U JP H0438043U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- lead pattern
- lead
- stages
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/50—
-
- H10W72/07554—
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/5445—
-
- H10W72/547—
-
- H10W90/754—
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990079932U JP2506606Y2 (ja) | 1990-07-25 | 1990-07-25 | ワイヤ―ボンディングリ―ドパタ―ン |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990079932U JP2506606Y2 (ja) | 1990-07-25 | 1990-07-25 | ワイヤ―ボンディングリ―ドパタ―ン |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0438043U true JPH0438043U (enExample) | 1992-03-31 |
| JP2506606Y2 JP2506606Y2 (ja) | 1996-08-14 |
Family
ID=31624542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990079932U Expired - Fee Related JP2506606Y2 (ja) | 1990-07-25 | 1990-07-25 | ワイヤ―ボンディングリ―ドパタ―ン |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2506606Y2 (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63140627U (enExample) * | 1987-03-07 | 1988-09-16 | ||
| JPH0256942A (ja) * | 1988-08-23 | 1990-02-26 | Fuji Xerox Co Ltd | 半導体装置 |
-
1990
- 1990-07-25 JP JP1990079932U patent/JP2506606Y2/ja not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63140627U (enExample) * | 1987-03-07 | 1988-09-16 | ||
| JPH0256942A (ja) * | 1988-08-23 | 1990-02-26 | Fuji Xerox Co Ltd | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2506606Y2 (ja) | 1996-08-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0438043U (enExample) | ||
| JPH01171047U (enExample) | ||
| JPS60183439U (ja) | 集積回路 | |
| JPS60181051U (ja) | リ−ドフレ−ムの構造 | |
| JPH0415856U (enExample) | ||
| JPS6013737U (ja) | 半導体集積回路装置 | |
| JPS6112249U (ja) | 半導体装置 | |
| JPH0480045U (enExample) | ||
| JPH0388337U (enExample) | ||
| JPS609235U (ja) | ボンデイングパツド | |
| JPS63182533U (enExample) | ||
| JPH0472651U (enExample) | ||
| JPH0211336U (enExample) | ||
| JPH0390442U (enExample) | ||
| JPH0399461U (enExample) | ||
| JPH03117928U (enExample) | ||
| JPH0474455U (enExample) | ||
| JPS59135662U (ja) | 配線パタ−ン構造 | |
| JPS6049663U (ja) | 配線基板 | |
| JPS585362U (ja) | リ−ドフレ−ム基板 | |
| JPS61109164U (enExample) | ||
| JPS60153543U (ja) | 半導体装置用リ−ドフレ−ム | |
| JPS6059541U (ja) | 集積回路用リ−ドフレ−ム | |
| JPH0440542U (enExample) | ||
| JPH0474462U (enExample) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |