JPH0474462U - - Google Patents
Info
- Publication number
- JPH0474462U JPH0474462U JP1990118177U JP11817790U JPH0474462U JP H0474462 U JPH0474462 U JP H0474462U JP 1990118177 U JP1990118177 U JP 1990118177U JP 11817790 U JP11817790 U JP 11817790U JP H0474462 U JPH0474462 U JP H0474462U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- die pad
- solder
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/736—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990118177U JPH0474462U (enExample) | 1990-11-09 | 1990-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990118177U JPH0474462U (enExample) | 1990-11-09 | 1990-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0474462U true JPH0474462U (enExample) | 1992-06-30 |
Family
ID=31866081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990118177U Pending JPH0474462U (enExample) | 1990-11-09 | 1990-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0474462U (enExample) |
-
1990
- 1990-11-09 JP JP1990118177U patent/JPH0474462U/ja active Pending