JP2505661Y2 - 接着剤塗布装置 - Google Patents

接着剤塗布装置

Info

Publication number
JP2505661Y2
JP2505661Y2 JP1990053159U JP5315990U JP2505661Y2 JP 2505661 Y2 JP2505661 Y2 JP 2505661Y2 JP 1990053159 U JP1990053159 U JP 1990053159U JP 5315990 U JP5315990 U JP 5315990U JP 2505661 Y2 JP2505661 Y2 JP 2505661Y2
Authority
JP
Japan
Prior art keywords
nozzle
adhesive
nozzle member
holder
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990053159U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0412639U (cs
Inventor
泰雄 岩城
Original Assignee
東芝精機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東芝精機株式会社 filed Critical 東芝精機株式会社
Priority to JP1990053159U priority Critical patent/JP2505661Y2/ja
Publication of JPH0412639U publication Critical patent/JPH0412639U/ja
Application granted granted Critical
Publication of JP2505661Y2 publication Critical patent/JP2505661Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Die Bonding (AREA)
JP1990053159U 1990-05-22 1990-05-22 接着剤塗布装置 Expired - Fee Related JP2505661Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990053159U JP2505661Y2 (ja) 1990-05-22 1990-05-22 接着剤塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990053159U JP2505661Y2 (ja) 1990-05-22 1990-05-22 接着剤塗布装置

Publications (2)

Publication Number Publication Date
JPH0412639U JPH0412639U (cs) 1992-01-31
JP2505661Y2 true JP2505661Y2 (ja) 1996-07-31

Family

ID=31574109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990053159U Expired - Fee Related JP2505661Y2 (ja) 1990-05-22 1990-05-22 接着剤塗布装置

Country Status (1)

Country Link
JP (1) JP2505661Y2 (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0197729U (cs) * 1987-12-21 1989-06-29
JP3004951U (ja) * 1994-06-03 1994-12-06 株式会社山口工業 自動車の塗装面前処理装置

Also Published As

Publication number Publication date
JPH0412639U (cs) 1992-01-31

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees