JP2025520676A5 - - Google Patents

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Publication number
JP2025520676A5
JP2025520676A5 JP2024575355A JP2024575355A JP2025520676A5 JP 2025520676 A5 JP2025520676 A5 JP 2025520676A5 JP 2024575355 A JP2024575355 A JP 2024575355A JP 2024575355 A JP2024575355 A JP 2024575355A JP 2025520676 A5 JP2025520676 A5 JP 2025520676A5
Authority
JP
Japan
Prior art keywords
bonding
substrate
optical device
semiconductor optical
joining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024575355A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025520676A (ja
Filing date
Publication date
Priority claimed from FI20225594A external-priority patent/FI20225594A1/en
Application filed filed Critical
Publication of JP2025520676A publication Critical patent/JP2025520676A/ja
Publication of JP2025520676A5 publication Critical patent/JP2025520676A5/ja
Pending legal-status Critical Current

Links

JP2024575355A 2022-06-29 2023-05-31 半導体光デバイスの光軸と基板上の光回路の光軸とをアクティブアライメントするための接合構造、フォトニック集積回路、及び方法 Pending JP2025520676A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI20225594A FI20225594A1 (en) 2022-06-29 2022-06-29 Connector structure, optical integrated circuit, and method for actively aligning an optical axis of an optical semiconductor device and an optical axis of an optical circuit on a substrate
FI20225594 2022-06-29
PCT/FI2023/050304 WO2024003442A1 (en) 2022-06-29 2023-05-31 Bonding structure, photonic integrated circuit, and method for active alignment of optical axis of semiconductor optical device with optical axis of optical circuit on substrate

Publications (2)

Publication Number Publication Date
JP2025520676A JP2025520676A (ja) 2025-07-03
JP2025520676A5 true JP2025520676A5 (https=) 2025-08-26

Family

ID=86732556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024575355A Pending JP2025520676A (ja) 2022-06-29 2023-05-31 半導体光デバイスの光軸と基板上の光回路の光軸とをアクティブアライメントするための接合構造、フォトニック集積回路、及び方法

Country Status (4)

Country Link
EP (1) EP4548139A1 (https=)
JP (1) JP2025520676A (https=)
FI (1) FI20225594A1 (https=)
WO (1) WO2024003442A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5568892A (en) * 1994-06-16 1996-10-29 Lucent Technologies Inc. Alignment and bonding techniques
JP3447690B2 (ja) * 2000-12-04 2003-09-16 日本電気株式会社 半導体チップの積層実装方法
JP2004012803A (ja) * 2002-06-06 2004-01-15 Fujitsu Ltd 光伝送用プリント板ユニット及び実装方法
US8934259B2 (en) * 2011-06-08 2015-01-13 Semprius, Inc. Substrates with transferable chiplets
US10998297B1 (en) * 2018-05-15 2021-05-04 Facebook Technologies, Llc Nano-porous metal interconnect for light sources

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JP2025520676A (ja) 半導体光デバイスの光軸と基板上の光回路の光軸とをアクティブアライメントするための接合構造、フォトニック集積回路、及び方法