JP2012529776A - タイトピッチのフリップチップ集積回路のパッケージを作る方法 - Google Patents
タイトピッチのフリップチップ集積回路のパッケージを作る方法 Download PDFInfo
- Publication number
- JP2012529776A JP2012529776A JP2012515188A JP2012515188A JP2012529776A JP 2012529776 A JP2012529776 A JP 2012529776A JP 2012515188 A JP2012515188 A JP 2012515188A JP 2012515188 A JP2012515188 A JP 2012515188A JP 2012529776 A JP2012529776 A JP 2012529776A
- Authority
- JP
- Japan
- Prior art keywords
- package substrate
- solder paste
- die
- conductive bumps
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 86
- 229910000679 solder Inorganic materials 0.000 claims abstract description 77
- 238000005476 soldering Methods 0.000 claims abstract description 10
- 230000004907 flux Effects 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 239000011295 pitch Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1131—Manufacturing methods by local deposition of the material of the bump connector in liquid form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/118—Post-treatment of the bump connector
- H01L2224/1182—Applying permanent coating, e.g. in-situ coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/118—Post-treatment of the bump connector
- H01L2224/1182—Applying permanent coating, e.g. in-situ coating
- H01L2224/11822—Applying permanent coating, e.g. in-situ coating by dipping, e.g. in a solder bath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7515—Means for applying permanent coating, e.g. in-situ coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/756—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/75611—Feeding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/79—Apparatus for Tape Automated Bonding [TAB]
- H01L2224/7901—Means for cleaning, e.g. brushes, for hydro blasting, for ultrasonic cleaning, for dry ice blasting, using gas-flow, by etching, by applying flux or plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81009—Pre-treatment of the bump connector or the bonding area
- H01L2224/8101—Cleaning the bump connector, e.g. oxide removal step, desmearing
- H01L2224/81011—Chemical cleaning, e.g. etching, flux
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81009—Pre-treatment of the bump connector or the bonding area
- H01L2224/8102—Applying permanent coating to the bump connector in the bonding apparatus, e.g. in-situ coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81009—Pre-treatment of the bump connector or the bonding area
- H01L2224/81024—Applying flux to the bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
- H01L2224/81815—Reflow soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
104、202、302、402 ツール
106、204 フラックス樹脂
108、114、208、212、306、308、310、406 矢印
110 導電バンプ
112 はんだで湿潤した導電バンプ
116 パッケージ基板
118 波線
206 はんだペースト
304、404 ニードル
405 パッド
Claims (18)
- パッケージ基板にダイを取り付ける方法であって、
前記ダイの少なくとも一部をはんだペーストに浸すステップと、
前記パッケージ基板上に前記ダイを配置するステップと、
前記パッケージ基板に前記ダイを取り付けるために前記はんだペーストをリフローするステップと、
を含む、パッケージ基板にダイを取り付ける方法。 - 前記ダイが導電バンプを有し、前記ダイを前記はんだペーストに浸すステップが、前記導電バンプを前記はんだペーストに浸すステップを含む、請求項1に記載の方法。
- 前記パッケージ基板がパッドを有し、前記パッケージ基板に前記ダイを取り付けるために前記はんだペーストをリフローするステップが、前記導電バンプを前記パッドにはんだ付けするステップを含む、請求項2に記載の方法。
- 前記パッケージ基板がパッドを有し、前記ダイが導電バンプを有し、前記パッケージ基板に前記ダイを取り付けるために前記はんだペーストをリフローするステップが、前記導電バンプを前記パッドにはんだ付けするステップを含む、請求項1に記載の方法。
- 前記パッケージ基板上に前記ダイを配置する前に、フラックス樹脂を前記パッケージ基板に付けるステップを更に含む、請求項1に記載の方法。
- パッケージ基板にダイを取り付ける方法であって、
はんだペーストを前記パッケージ基板に付けるステップと、
前記はんだペーストをリフローする前に、前記パッケージ基板上に前記ダイを配置するステップと、
前記パッケージ基板に前記ダイを取り付けるために前記はんだペーストをリフローするステップと、
を含む、パッケージ基板にダイを取り付ける方法。 - 前記パッケージ基板がパッドを有し、前記はんだペーストを前記パッケージ基板に付けるステップが、前記パッケージ基板上の前記パッド上にはんだペーストの滴を形成するステップを含む、請求項6に記載の方法。
- 前記ダイが導電バンプを有し、前記はんだペーストをリフローする前に、前記パッケージ基板上に前記ダイを配置するステップが、前記導電バンプを前記はんだペーストの滴と接触するように配置するステップを含む、請求項7に記載の方法。
- 前記はんだペーストを前記パッケージ基板に付けるステップが、ツールを前記はんだペーストに浸すステップを含む、請求項6に記載の方法。
- 前記パッケージ基板がパッドを有し、前記はんだペーストを前記パッケージ基板に付けるステップが、前記パッケージ基板上の前記パッド上に前記はんだペーストの滴を形成するステップを含む、請求項9に記載の方法。
- 前記ダイが導電バンプを有し、前記はんだペーストをリフローする前に、前記パッケージ基板上に前記ダイを配置するステップが、前記導電バンプを前記はんだペーストの滴と接触するように配置するステップを含む、請求項10に記載の方法。
- 前記パッケージ基板がパッドを有し、前記はんだペーストを前記パッケージ基板に付けるステップが、前記パッケージ基板上の前記パッド上に前記はんだペーストの滴を形成するために、ツールの開口を通り抜けて前記はんだペーストを分注するステップを含む、請求項6に記載の方法。
- 前記ダイが導電バンプを有し、前記はんだペーストをリフローする前に、前記パッケージ基板上に前記ダイを配置するステップが、前記導電バンプを前記はんだペーストの滴と接触するように配置するステップを含む、請求項12に記載の方法。
- パッケージ基板にダイを取り付ける方法であって、
はんだペーストを前記パッケージ基板上のパッド上に分注するステップと、
前記はんだペーストをリフローする前に、前記パッケージ基板上に前記ダイを配置するステップと、
前記パッケージ基板に前記ダイを取り付けるために前記はんだペーストをリフローするステップと、
を含む、パッケージ基板にダイを取り付ける方法。 - 前記はんだペーストを前記パッケージ基板上の前記パッド上に分注するステップが、前記パッド上にはんだペーストの滴を形成するためにツールを前記はんだペーストに浸すステップを含む、請求項14に記載の方法。
- 前記ダイが導電バンプを有し、前記はんだペーストをリフローする前に、前記パッケージ基板上に前記ダイを配置するステップが、前記導電バンプを前記はんだペーストの滴と接触するように配置するステップを含む、請求項15に記載の方法。
- 前記はんだペーストを前記パッケージ基板上の前記パッド上に分注するステップが、前記パッド上にはんだペーストの滴を形成するために、ツールの開口を通り抜けて前記はんだペーストを分注するステップを含む、請求項14に記載の方法。
- 前記ダイが導電バンプを有し、前記はんだペーストをリフローする前に、前記パッケージ基板上に前記ダイを配置するステップが、前記導電バンプを前記はんだペーストの滴と接触するように配置するステップを含む、請求項17に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/482,668 | 2009-06-11 | ||
US12/482,668 US8371497B2 (en) | 2009-06-11 | 2009-06-11 | Method for manufacturing tight pitch, flip chip integrated circuit packages |
PCT/US2010/038344 WO2010144823A2 (en) | 2009-06-11 | 2010-06-11 | Method for manufacturing tight pitch, flip chip integrated circuit packages |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014010331A Division JP2014123752A (ja) | 2009-06-11 | 2014-01-23 | タイトピッチのフリップチップ集積回路のパッケージを作る方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2012529776A true JP2012529776A (ja) | 2012-11-22 |
Family
ID=42548950
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012515188A Pending JP2012529776A (ja) | 2009-06-11 | 2010-06-11 | タイトピッチのフリップチップ集積回路のパッケージを作る方法 |
JP2014010331A Pending JP2014123752A (ja) | 2009-06-11 | 2014-01-23 | タイトピッチのフリップチップ集積回路のパッケージを作る方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014010331A Pending JP2014123752A (ja) | 2009-06-11 | 2014-01-23 | タイトピッチのフリップチップ集積回路のパッケージを作る方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8371497B2 (ja) |
EP (1) | EP2441087A2 (ja) |
JP (2) | JP2012529776A (ja) |
CN (1) | CN102804371B (ja) |
TW (1) | TW201110252A (ja) |
WO (1) | WO2010144823A2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI452660B (zh) * | 2011-03-29 | 2014-09-11 | Powertech Technology Inc | 非陣列凸塊之覆晶模封構造 |
WO2013153616A1 (ja) * | 2012-04-10 | 2013-10-17 | 富士機械製造株式会社 | ボール搭載方法、および、対基板作業機 |
TWI460776B (zh) * | 2012-06-27 | 2014-11-11 | D Tek Technology Co Ltd | 應用於晶圓的銅柱焊料的製造方法及其設備 |
KR102555721B1 (ko) * | 2018-08-20 | 2023-07-17 | 삼성전자주식회사 | 플립 칩 본딩 방법 |
CN109623080A (zh) * | 2019-01-24 | 2019-04-16 | 合肥巨动力系统有限公司 | 一种高效率扁线电机绕组端部焊接装置及焊接工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61159270A (ja) * | 1984-12-20 | 1986-07-18 | ハロルド・ジエイ・エンゲル | 半田ペ−ストの供給装置 |
JP2002026505A (ja) * | 2000-07-07 | 2002-01-25 | Ueno Seiki Kk | ペースト材料の転写装置 |
JP2008205321A (ja) * | 2007-02-22 | 2008-09-04 | Fujitsu Ltd | 電子部品および電子装置の製造方法 |
JP2009117530A (ja) * | 2007-11-05 | 2009-05-28 | Alps Electric Co Ltd | 電子回路モジュール及び電子回路モジュールの製造方法 |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6160264A (ja) | 1984-08-29 | 1986-03-27 | Aasunikusu Kk | プリント基板のハンダ付方法およびその方法の実施に用いるハンダゴテ装置 |
JP2671005B2 (ja) * | 1988-04-13 | 1997-10-29 | 株式会社 新川 | ディスペンサー装置 |
US5186982A (en) | 1990-09-18 | 1993-02-16 | Minnesota Mining And Manufacturing Company | Pin transfer applicator and method |
US5111991A (en) * | 1990-10-22 | 1992-05-12 | Motorola, Inc. | Method of soldering components to printed circuit boards |
US5435481A (en) * | 1994-01-18 | 1995-07-25 | Motorola, Inc. | Soldering process |
US5492266A (en) | 1994-08-31 | 1996-02-20 | International Business Machines Corporation | Fine pitch solder deposits on printed circuit board process and product |
JPH09232372A (ja) * | 1996-02-26 | 1997-09-05 | Toshiba Microelectron Corp | 半導体装置の製造方法 |
US5985043A (en) * | 1997-07-21 | 1999-11-16 | Miguel Albert Capote | Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
JP3279940B2 (ja) * | 1996-11-27 | 2002-04-30 | シャープ株式会社 | 電子回路装置の製造方法、半田残渣均一化治具、金属ロウペースト転写用治具及び電子回路装置の製造装置 |
EP0954208A4 (en) * | 1996-12-27 | 2002-09-11 | Matsushita Electric Ind Co Ltd | METHOD AND DEVICE FOR FIXING AN ELECTRONIC COMPONENT ON A CIRCUIT BOARD |
US5909839A (en) * | 1997-05-15 | 1999-06-08 | Ford Motor Company | Method for dispensing solder paste on a non-planar substrate using an array of ultrasonically agitated pins |
US6335571B1 (en) * | 1997-07-21 | 2002-01-01 | Miguel Albert Capote | Semiconductor flip-chip package and method for the fabrication thereof |
JP3420917B2 (ja) | 1997-09-08 | 2003-06-30 | 富士通株式会社 | 半導体装置 |
JP3591344B2 (ja) * | 1998-11-27 | 2004-11-17 | 松下電器産業株式会社 | バンプ付電子部品の実装方法 |
JP2001025699A (ja) * | 1999-07-12 | 2001-01-30 | Toshiba Corp | 塗布ノズル及びそれによる塗布方法と装置、それを用いた半導体製造装置 |
SG99331A1 (en) * | 2000-01-13 | 2003-10-27 | Hitachi Ltd | Method of producing electronic part with bumps and method of producing elctronic part |
JP2001291740A (ja) * | 2000-04-05 | 2001-10-19 | Sony Corp | 半導体素子の実装方法 |
JP4609617B2 (ja) * | 2000-08-01 | 2011-01-12 | 日本電気株式会社 | 半導体装置の実装方法及び実装構造体 |
KR100315158B1 (ko) | 2000-08-02 | 2001-11-26 | 윤덕용 | 비솔더 플립 칩 본딩용 고신뢰성 비전도성 접착제 및 이를이용한 플립 칩 본딩 방법 |
JP2004096042A (ja) * | 2002-09-04 | 2004-03-25 | Fuji Electric Holdings Co Ltd | 回路基板上への接続材料の供給方法及び供給装置 |
JP2004114142A (ja) * | 2002-09-30 | 2004-04-15 | Ricoh Microelectronics Co Ltd | 半田ペースト、該半田ペーストを用いた印刷方法及び印刷装置 |
JP2004134645A (ja) * | 2002-10-11 | 2004-04-30 | Seiko Epson Corp | バンプ付き半導体素子の実装方法、バンプ付き半導体素子の実装構造、及び電気光学装置、並びに電子機器 |
US7271497B2 (en) * | 2003-03-10 | 2007-09-18 | Fairchild Semiconductor Corporation | Dual metal stud bumping for flip chip applications |
JP4046658B2 (ja) * | 2003-07-28 | 2008-02-13 | 新日鉄マテリアルズ株式会社 | バンプ形成方法およびフラックス被覆装置 |
WO2005081602A1 (ja) * | 2004-02-24 | 2005-09-01 | Matsushita Electric Industrial Co., Ltd. | 電子部品実装方法とそれに用いる回路基板及び回路基板ユニット |
JP2007173406A (ja) * | 2005-12-20 | 2007-07-05 | Matsushita Electric Ind Co Ltd | はんだペースト塗布装置 |
SG136004A1 (en) | 2006-03-27 | 2007-10-29 | Micron Techonology Inc | Semiconductor constructions having interconnect structures, methods of forming interconnect structures, and methods of forming semiconductor constructions |
JP4816194B2 (ja) * | 2006-03-29 | 2011-11-16 | パナソニック株式会社 | 電子部品実装システムおよび電子部品搭載装置ならびに電子部品実装方法 |
US8048479B2 (en) | 2006-08-01 | 2011-11-01 | Qimonda Ag | Method for placing material onto a target board by means of a transfer board |
JP4800900B2 (ja) * | 2006-10-31 | 2011-10-26 | ハリマ化成株式会社 | はんだペースト組成物 |
US7644871B2 (en) | 2006-12-29 | 2010-01-12 | Intel Corporation | Flux spray atomization and splash control |
US7576434B2 (en) * | 2007-06-26 | 2009-08-18 | Intel Corporation | Wafer-level solder bumps |
-
2009
- 2009-06-11 US US12/482,668 patent/US8371497B2/en active Active
-
2010
- 2010-06-11 CN CN201080025844.1A patent/CN102804371B/zh active Active
- 2010-06-11 WO PCT/US2010/038344 patent/WO2010144823A2/en active Search and Examination
- 2010-06-11 JP JP2012515188A patent/JP2012529776A/ja active Pending
- 2010-06-11 EP EP10724673A patent/EP2441087A2/en not_active Ceased
- 2010-06-11 TW TW099119160A patent/TW201110252A/zh unknown
-
2014
- 2014-01-23 JP JP2014010331A patent/JP2014123752A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61159270A (ja) * | 1984-12-20 | 1986-07-18 | ハロルド・ジエイ・エンゲル | 半田ペ−ストの供給装置 |
JP2002026505A (ja) * | 2000-07-07 | 2002-01-25 | Ueno Seiki Kk | ペースト材料の転写装置 |
JP2008205321A (ja) * | 2007-02-22 | 2008-09-04 | Fujitsu Ltd | 電子部品および電子装置の製造方法 |
JP2009117530A (ja) * | 2007-11-05 | 2009-05-28 | Alps Electric Co Ltd | 電子回路モジュール及び電子回路モジュールの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201110252A (en) | 2011-03-16 |
WO2010144823A3 (en) | 2011-11-10 |
JP2014123752A (ja) | 2014-07-03 |
EP2441087A2 (en) | 2012-04-18 |
US20100314433A1 (en) | 2010-12-16 |
CN102804371A (zh) | 2012-11-28 |
US8371497B2 (en) | 2013-02-12 |
CN102804371B (zh) | 2015-05-13 |
WO2010144823A2 (en) | 2010-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4618260B2 (ja) | 導体パターンの形成方法、半導体装置の製造方法、並びに半導体装置 | |
US8541291B2 (en) | Thermo-compression bonded electrical interconnect structure and method | |
JP3829325B2 (ja) | 半導体素子およびその製造方法並びに半導体装置の製造方法 | |
JP4605155B2 (ja) | 半導体装置及びその製造方法 | |
TWI431701B (zh) | 可熔i/o互連系統與涉及基板安裝之柱狀凸塊的覆晶封裝方法 | |
TWI459505B (zh) | 電互連結構及方法 | |
US7868457B2 (en) | Thermo-compression bonded electrical interconnect structure and method | |
JP5645592B2 (ja) | 半導体装置の製造方法 | |
JP5018155B2 (ja) | 配線基板、電子部品の実装構造、及び半導体装置 | |
US8222748B2 (en) | Packaged electronic devices having die attach regions with selective thin dielectric layer | |
JP6004441B2 (ja) | 基板接合方法、バンプ形成方法及び半導体装置 | |
JP2006279062A (ja) | 半導体素子および半導体装置 | |
JP2014123752A (ja) | タイトピッチのフリップチップ集積回路のパッケージを作る方法 | |
KR100592121B1 (ko) | 플립 칩 조립을 위한 무세정 플럭스 | |
US20080284015A1 (en) | Bump on via-packaging and methodologies | |
US7494924B2 (en) | Method for forming reinforced interconnects on a substrate | |
JPH11168116A (ja) | 半導体チップ用電極バンプ | |
US20090065931A1 (en) | Packaged integrated circuit and method of forming thereof | |
JPH09213702A (ja) | 半導体装置及び半導体装置の実装方法 | |
JP2023179100A (ja) | 半導体装置 | |
JP2000332060A (ja) | 半導体装置およびその製造方法 | |
JP2002217232A (ja) | 半導体装置の製造方法 | |
US20090170244A1 (en) | Method for manufacturing a flip chip package |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130424 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130507 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130807 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20130924 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140616 |