JP2025520676A - 半導体光デバイスの光軸と基板上の光回路の光軸とをアクティブアライメントするための接合構造、フォトニック集積回路、及び方法 - Google Patents

半導体光デバイスの光軸と基板上の光回路の光軸とをアクティブアライメントするための接合構造、フォトニック集積回路、及び方法 Download PDF

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Publication number
JP2025520676A
JP2025520676A JP2024575355A JP2024575355A JP2025520676A JP 2025520676 A JP2025520676 A JP 2025520676A JP 2024575355 A JP2024575355 A JP 2024575355A JP 2024575355 A JP2024575355 A JP 2024575355A JP 2025520676 A JP2025520676 A JP 2025520676A
Authority
JP
Japan
Prior art keywords
substrate
bonding
optical device
semiconductor optical
joining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024575355A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025520676A5 (https=
Inventor
イ、チェ－ウォン
ハルヤンネ、ミッコ
ハッシネン、トミ
アールト、ティモ
デルロッソ、ジョヴァンニ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VTT Technical Research Centre of Finland Ltd
Original Assignee
VTT Technical Research Centre of Finland Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VTT Technical Research Centre of Finland Ltd filed Critical VTT Technical Research Centre of Finland Ltd
Publication of JP2025520676A publication Critical patent/JP2025520676A/ja
Publication of JP2025520676A5 publication Critical patent/JP2025520676A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4226—Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/62—Optical apparatus specially adapted for adjusting optical elements during the assembly of optical systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/003—Alignment of optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02375—Positioning of the laser chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4244—Mounting of the optical elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Light Receiving Elements (AREA)
  • Die Bonding (AREA)
JP2024575355A 2022-06-29 2023-05-31 半導体光デバイスの光軸と基板上の光回路の光軸とをアクティブアライメントするための接合構造、フォトニック集積回路、及び方法 Pending JP2025520676A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI20225594A FI20225594A1 (en) 2022-06-29 2022-06-29 Connector structure, optical integrated circuit, and method for actively aligning an optical axis of an optical semiconductor device and an optical axis of an optical circuit on a substrate
FI20225594 2022-06-29
PCT/FI2023/050304 WO2024003442A1 (en) 2022-06-29 2023-05-31 Bonding structure, photonic integrated circuit, and method for active alignment of optical axis of semiconductor optical device with optical axis of optical circuit on substrate

Publications (2)

Publication Number Publication Date
JP2025520676A true JP2025520676A (ja) 2025-07-03
JP2025520676A5 JP2025520676A5 (https=) 2025-08-26

Family

ID=86732556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024575355A Pending JP2025520676A (ja) 2022-06-29 2023-05-31 半導体光デバイスの光軸と基板上の光回路の光軸とをアクティブアライメントするための接合構造、フォトニック集積回路、及び方法

Country Status (4)

Country Link
EP (1) EP4548139A1 (https=)
JP (1) JP2025520676A (https=)
FI (1) FI20225594A1 (https=)
WO (1) WO2024003442A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5568892A (en) * 1994-06-16 1996-10-29 Lucent Technologies Inc. Alignment and bonding techniques
JP3447690B2 (ja) * 2000-12-04 2003-09-16 日本電気株式会社 半導体チップの積層実装方法
JP2004012803A (ja) * 2002-06-06 2004-01-15 Fujitsu Ltd 光伝送用プリント板ユニット及び実装方法
US8934259B2 (en) * 2011-06-08 2015-01-13 Semprius, Inc. Substrates with transferable chiplets
US10998297B1 (en) * 2018-05-15 2021-05-04 Facebook Technologies, Llc Nano-porous metal interconnect for light sources

Also Published As

Publication number Publication date
EP4548139A1 (en) 2025-05-07
WO2024003442A1 (en) 2024-01-04
FI20225594A1 (en) 2023-12-30

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