JP2025506818A5 - - Google Patents
Info
- Publication number
- JP2025506818A5 JP2025506818A5 JP2024550200A JP2024550200A JP2025506818A5 JP 2025506818 A5 JP2025506818 A5 JP 2025506818A5 JP 2024550200 A JP2024550200 A JP 2024550200A JP 2024550200 A JP2024550200 A JP 2024550200A JP 2025506818 A5 JP2025506818 A5 JP 2025506818A5
- Authority
- JP
- Japan
- Prior art keywords
- structure according
- conductive contact
- bonding structure
- contact
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202263313639P | 2022-02-24 | 2022-02-24 | |
| US63/313,639 | 2022-02-24 | ||
| PCT/US2023/063147 WO2023164564A1 (en) | 2022-02-24 | 2023-02-23 | Bonded structures |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025506818A JP2025506818A (ja) | 2025-03-13 |
| JP2025506818A5 true JP2025506818A5 (cg-RX-API-DMAC10.html) | 2026-03-04 |
Family
ID=87574555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024550200A Pending JP2025506818A (ja) | 2022-02-24 | 2023-02-23 | 接合構造 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4483406A4 (cg-RX-API-DMAC10.html) |
| JP (1) | JP2025506818A (cg-RX-API-DMAC10.html) |
| KR (1) | KR20240156613A (cg-RX-API-DMAC10.html) |
| CN (1) | CN119013777A (cg-RX-API-DMAC10.html) |
| TW (1) | TW202343714A (cg-RX-API-DMAC10.html) |
| WO (1) | WO2023164564A1 (cg-RX-API-DMAC10.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12652810B2 (en) * | 2022-03-18 | 2026-06-09 | Intel Corporation | Inductors for hybrid bonding interconnect architectures |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6552425B1 (en) * | 1998-12-18 | 2003-04-22 | Intel Corporation | Integrated circuit package |
| US20140038357A1 (en) * | 2012-08-06 | 2014-02-06 | Apple Inc. | Singulated ic stiffener and de-bond process |
| US10510603B2 (en) * | 2017-08-31 | 2019-12-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Conductive vias in semiconductor packages and methods of forming same |
| US10727219B2 (en) * | 2018-02-15 | 2020-07-28 | Invensas Bonding Technologies, Inc. | Techniques for processing devices |
| CN111916354B (zh) * | 2019-05-07 | 2022-08-30 | 欣兴电子股份有限公司 | 线路载板及其制作方法 |
| MY202540A (en) * | 2019-06-11 | 2024-05-06 | Intel Corp | Multi-faceted integrated-circuit dice and packages |
| DE102020114141B4 (de) * | 2019-10-18 | 2024-03-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integriertes schaltungspackage und verfahren |
| US11264362B2 (en) * | 2020-05-28 | 2022-03-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structure and method of fabricating the same |
| US11631647B2 (en) * | 2020-06-30 | 2023-04-18 | Adeia Semiconductor Bonding Technologies Inc. | Integrated device packages with integrated device die and dummy element |
-
2023
- 2023-02-23 WO PCT/US2023/063147 patent/WO2023164564A1/en not_active Ceased
- 2023-02-23 CN CN202380031728.8A patent/CN119013777A/zh active Pending
- 2023-02-23 EP EP23760929.2A patent/EP4483406A4/en active Pending
- 2023-02-23 KR KR1020247031827A patent/KR20240156613A/ko active Pending
- 2023-02-23 JP JP2024550200A patent/JP2025506818A/ja active Pending
- 2023-02-24 TW TW112106994A patent/TW202343714A/zh unknown
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