JP2025023084A5 - - Google Patents

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Publication number
JP2025023084A5
JP2025023084A5 JP2024207261A JP2024207261A JP2025023084A5 JP 2025023084 A5 JP2025023084 A5 JP 2025023084A5 JP 2024207261 A JP2024207261 A JP 2024207261A JP 2024207261 A JP2024207261 A JP 2024207261A JP 2025023084 A5 JP2025023084 A5 JP 2025023084A5
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JP
Japan
Prior art keywords
processing
supply line
substrate
valve
discharge
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JP2024207261A
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English (en)
Japanese (ja)
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JP7782007B2 (ja
JP2025023084A (ja
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Priority claimed from JP2020217062A external-priority patent/JP7598240B2/ja
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Priority to JP2024207261A priority Critical patent/JP7782007B2/ja
Publication of JP2025023084A publication Critical patent/JP2025023084A/ja
Publication of JP2025023084A5 publication Critical patent/JP2025023084A5/ja
Priority to JP2025192601A priority patent/JP2026012494A/ja
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JP2024207261A 2020-12-25 2024-11-28 基板処理方法および基板処理装置 Active JP7782007B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2024207261A JP7782007B2 (ja) 2020-12-25 2024-11-28 基板処理方法および基板処理装置
JP2025192601A JP2026012494A (ja) 2020-12-25 2025-11-12 基板処理方法および基板処理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020217062A JP7598240B2 (ja) 2020-12-25 2020-12-25 基板乾燥方法および基板乾燥装置
JP2024207261A JP7782007B2 (ja) 2020-12-25 2024-11-28 基板処理方法および基板処理装置

Related Parent Applications (1)

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JP2020217062A Division JP7598240B2 (ja) 2020-12-25 2020-12-25 基板乾燥方法および基板乾燥装置

Related Child Applications (1)

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JP2025192601A Division JP2026012494A (ja) 2020-12-25 2025-11-12 基板処理方法および基板処理装置

Publications (3)

Publication Number Publication Date
JP2025023084A JP2025023084A (ja) 2025-02-14
JP2025023084A5 true JP2025023084A5 (https=) 2025-04-30
JP7782007B2 JP7782007B2 (ja) 2025-12-08

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ID=82119126

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2020217062A Active JP7598240B2 (ja) 2020-12-25 2020-12-25 基板乾燥方法および基板乾燥装置
JP2024207261A Active JP7782007B2 (ja) 2020-12-25 2024-11-28 基板処理方法および基板処理装置
JP2025192601A Pending JP2026012494A (ja) 2020-12-25 2025-11-12 基板処理方法および基板処理装置

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JP2020217062A Active JP7598240B2 (ja) 2020-12-25 2020-12-25 基板乾燥方法および基板乾燥装置

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JP2025192601A Pending JP2026012494A (ja) 2020-12-25 2025-11-12 基板処理方法および基板処理装置

Country Status (4)

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US (2) US12374565B2 (https=)
JP (3) JP7598240B2 (https=)
KR (1) KR20220092790A (https=)
CN (1) CN114695181A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117716476A (zh) * 2021-08-05 2024-03-15 东京毅力科创株式会社 基板处理方法和基板处理装置
KR102643365B1 (ko) * 2021-09-03 2024-03-07 세메스 주식회사 기판 처리 장치 및 방법
KR102761703B1 (ko) * 2022-10-27 2025-02-03 세메스 주식회사 기판 처리 장치
KR102780098B1 (ko) * 2022-12-27 2025-03-11 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR102779275B1 (ko) * 2022-12-29 2025-03-11 세메스 주식회사 유체 공급 장치 및 이를 포함하는 기판 처리 장치
KR102789694B1 (ko) * 2023-06-30 2025-04-03 주식회사 테스 기판처리방법
US20260107726A1 (en) * 2024-10-11 2026-04-16 Tokyo Electron Limited Method for processing substrate

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007175559A (ja) 2005-12-27 2007-07-12 Dainippon Screen Mfg Co Ltd 高圧処理装置および高圧処理方法
JP2007234862A (ja) 2006-03-01 2007-09-13 Dainippon Screen Mfg Co Ltd 高圧処理装置および高圧処理方法
US9587880B2 (en) 2012-05-31 2017-03-07 Semes Co., Ltd. Apparatus and method for drying substrate
KR20170133694A (ko) 2016-05-26 2017-12-06 세메스 주식회사 유체 공급 유닛, 이를 가지는 기판 처리 장치 및 방법
KR20180006716A (ko) 2016-07-11 2018-01-19 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP6755776B2 (ja) 2016-11-04 2020-09-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体
JP6740098B2 (ja) 2016-11-17 2020-08-12 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6840001B2 (ja) 2017-03-14 2021-03-10 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7109989B2 (ja) 2017-08-09 2022-08-01 東京エレクトロン株式会社 基板処理方法、記憶媒体及び基板処理システム
JP7197396B2 (ja) 2019-02-06 2022-12-27 東京エレクトロン株式会社 基板処理装置及び基板処理方法
KR20220037632A (ko) 2020-09-18 2022-03-25 세메스 주식회사 기판 처리 장치 및 방법

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