KR20220092790A - 기판 건조 방법 및 기판 건조 장치 - Google Patents

기판 건조 방법 및 기판 건조 장치 Download PDF

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Publication number
KR20220092790A
KR20220092790A KR1020210177312A KR20210177312A KR20220092790A KR 20220092790 A KR20220092790 A KR 20220092790A KR 1020210177312 A KR1020210177312 A KR 1020210177312A KR 20210177312 A KR20210177312 A KR 20210177312A KR 20220092790 A KR20220092790 A KR 20220092790A
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KR
South Korea
Prior art keywords
processing
pressure
substrate
valve
supply line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020210177312A
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English (en)
Korean (ko)
Inventor
겐타로 고시
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20220092790A publication Critical patent/KR20220092790A/ko
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H01L21/02057—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/005—Drying solid materials or objects by processes not involving the application of heat by dipping them into or mixing them with a chemical liquid, e.g. organic; chemical, e.g. organic, dewatering aids
    • H01L21/67034—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/80—Cleaning only by supercritical fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020210177312A 2020-12-25 2021-12-13 기판 건조 방법 및 기판 건조 장치 Pending KR20220092790A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020217062A JP7598240B2 (ja) 2020-12-25 2020-12-25 基板乾燥方法および基板乾燥装置
JPJP-P-2020-217062 2020-12-25

Publications (1)

Publication Number Publication Date
KR20220092790A true KR20220092790A (ko) 2022-07-04

Family

ID=82119126

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210177312A Pending KR20220092790A (ko) 2020-12-25 2021-12-13 기판 건조 방법 및 기판 건조 장치

Country Status (4)

Country Link
US (2) US12374565B2 (https=)
JP (3) JP7598240B2 (https=)
KR (1) KR20220092790A (https=)
CN (1) CN114695181A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240213049A1 (en) * 2022-12-27 2024-06-27 Semes Co., Ltd. Substrate processing apparatus and substrate processing method
KR20240106659A (ko) * 2022-12-29 2024-07-08 세메스 주식회사 유체 공급 장치 및 이를 포함하는 기판 처리 장치
KR20250003219A (ko) * 2023-06-30 2025-01-07 주식회사 테스 기판처리방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117716476A (zh) * 2021-08-05 2024-03-15 东京毅力科创株式会社 基板处理方法和基板处理装置
KR102643365B1 (ko) * 2021-09-03 2024-03-07 세메스 주식회사 기판 처리 장치 및 방법
KR102761703B1 (ko) * 2022-10-27 2025-02-03 세메스 주식회사 기판 처리 장치
US20260107726A1 (en) * 2024-10-11 2026-04-16 Tokyo Electron Limited Method for processing substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013251550A (ja) 2012-05-31 2013-12-12 Semes Co Ltd 基板乾燥装置及び基板乾燥方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007175559A (ja) 2005-12-27 2007-07-12 Dainippon Screen Mfg Co Ltd 高圧処理装置および高圧処理方法
JP2007234862A (ja) 2006-03-01 2007-09-13 Dainippon Screen Mfg Co Ltd 高圧処理装置および高圧処理方法
KR20170133694A (ko) 2016-05-26 2017-12-06 세메스 주식회사 유체 공급 유닛, 이를 가지는 기판 처리 장치 및 방법
KR20180006716A (ko) 2016-07-11 2018-01-19 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP6755776B2 (ja) 2016-11-04 2020-09-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体
JP6740098B2 (ja) 2016-11-17 2020-08-12 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6840001B2 (ja) 2017-03-14 2021-03-10 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7109989B2 (ja) 2017-08-09 2022-08-01 東京エレクトロン株式会社 基板処理方法、記憶媒体及び基板処理システム
JP7197396B2 (ja) 2019-02-06 2022-12-27 東京エレクトロン株式会社 基板処理装置及び基板処理方法
KR20220037632A (ko) 2020-09-18 2022-03-25 세메스 주식회사 기판 처리 장치 및 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013251550A (ja) 2012-05-31 2013-12-12 Semes Co Ltd 基板乾燥装置及び基板乾燥方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240213049A1 (en) * 2022-12-27 2024-06-27 Semes Co., Ltd. Substrate processing apparatus and substrate processing method
KR20240106659A (ko) * 2022-12-29 2024-07-08 세메스 주식회사 유체 공급 장치 및 이를 포함하는 기판 처리 장치
KR20250003219A (ko) * 2023-06-30 2025-01-07 주식회사 테스 기판처리방법

Also Published As

Publication number Publication date
US20250285881A1 (en) 2025-09-11
JP2026012494A (ja) 2026-01-23
JP2022102372A (ja) 2022-07-07
CN114695181A (zh) 2022-07-01
JP7782007B2 (ja) 2025-12-08
JP2025023084A (ja) 2025-02-14
TW202242954A (zh) 2022-11-01
US20220208566A1 (en) 2022-06-30
US12374565B2 (en) 2025-07-29
JP7598240B2 (ja) 2024-12-11

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