JP2025005509A - ポリマー除去組成物および除去方法 - Google Patents

ポリマー除去組成物および除去方法 Download PDF

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Publication number
JP2025005509A
JP2025005509A JP2023105693A JP2023105693A JP2025005509A JP 2025005509 A JP2025005509 A JP 2025005509A JP 2023105693 A JP2023105693 A JP 2023105693A JP 2023105693 A JP2023105693 A JP 2023105693A JP 2025005509 A JP2025005509 A JP 2025005509A
Authority
JP
Japan
Prior art keywords
resist
substrate
composition
residues
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023105693A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025005509A5 (https=
Inventor
遼 佐々木
Haruka Sasaki
翼 伊藤
Tsubasa Ito
寿和 清水
Toshikazu Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanto Chemical Co Inc
Original Assignee
Kanto Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Chemical Co Inc filed Critical Kanto Chemical Co Inc
Priority to JP2023105693A priority Critical patent/JP2025005509A/ja
Priority to PCT/JP2024/023322 priority patent/WO2025005178A1/ja
Priority to TW113123954A priority patent/TW202505318A/zh
Publication of JP2025005509A publication Critical patent/JP2025005509A/ja
Publication of JP2025005509A5 publication Critical patent/JP2025005509A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Emergency Medicine (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2023105693A 2023-06-28 2023-06-28 ポリマー除去組成物および除去方法 Pending JP2025005509A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2023105693A JP2025005509A (ja) 2023-06-28 2023-06-28 ポリマー除去組成物および除去方法
PCT/JP2024/023322 WO2025005178A1 (ja) 2023-06-28 2024-06-27 ポリマー除去組成物および除去方法
TW113123954A TW202505318A (zh) 2023-06-28 2024-06-27 聚合物去除組成物及去除方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023105693A JP2025005509A (ja) 2023-06-28 2023-06-28 ポリマー除去組成物および除去方法

Publications (2)

Publication Number Publication Date
JP2025005509A true JP2025005509A (ja) 2025-01-17
JP2025005509A5 JP2025005509A5 (https=) 2026-03-25

Family

ID=93939181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023105693A Pending JP2025005509A (ja) 2023-06-28 2023-06-28 ポリマー除去組成物および除去方法

Country Status (3)

Country Link
JP (1) JP2025005509A (https=)
TW (1) TW202505318A (https=)
WO (1) WO2025005178A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4310624B2 (ja) * 2003-05-30 2009-08-12 三菱瓦斯化学株式会社 表面処理液
JP5195063B2 (ja) * 2008-06-19 2013-05-08 東ソー株式会社 レジスト剥離液
KR102213779B1 (ko) * 2014-08-26 2021-02-08 동우 화인켐 주식회사 레지스트 박리액 조성물 및 이를 이용한 레지스트의 박리방법
TWI690780B (zh) * 2014-12-30 2020-04-11 美商富士軟片電子材料美國股份有限公司 用於自半導體基板去除光阻之剝離組成物
KR102051346B1 (ko) * 2016-06-03 2019-12-03 후지필름 가부시키가이샤 처리액, 기판 세정 방법 및 레지스트의 제거 방법

Also Published As

Publication number Publication date
WO2025005178A1 (ja) 2025-01-02
TW202505318A (zh) 2025-02-01

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