TW202505318A - 聚合物去除組成物及去除方法 - Google Patents

聚合物去除組成物及去除方法 Download PDF

Info

Publication number
TW202505318A
TW202505318A TW113123954A TW113123954A TW202505318A TW 202505318 A TW202505318 A TW 202505318A TW 113123954 A TW113123954 A TW 113123954A TW 113123954 A TW113123954 A TW 113123954A TW 202505318 A TW202505318 A TW 202505318A
Authority
TW
Taiwan
Prior art keywords
composition
substrate
resist
residues
present
Prior art date
Application number
TW113123954A
Other languages
English (en)
Chinese (zh)
Inventor
佐佐木遼
伊藤翼
清水壽和
Original Assignee
日商關東化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商關東化學股份有限公司 filed Critical 日商關東化學股份有限公司
Publication of TW202505318A publication Critical patent/TW202505318A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Emergency Medicine (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW113123954A 2023-06-28 2024-06-27 聚合物去除組成物及去除方法 TW202505318A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-105693 2023-06-28
JP2023105693A JP2025005509A (ja) 2023-06-28 2023-06-28 ポリマー除去組成物および除去方法

Publications (1)

Publication Number Publication Date
TW202505318A true TW202505318A (zh) 2025-02-01

Family

ID=93939181

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113123954A TW202505318A (zh) 2023-06-28 2024-06-27 聚合物去除組成物及去除方法

Country Status (3)

Country Link
JP (1) JP2025005509A (https=)
TW (1) TW202505318A (https=)
WO (1) WO2025005178A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4310624B2 (ja) * 2003-05-30 2009-08-12 三菱瓦斯化学株式会社 表面処理液
JP5195063B2 (ja) * 2008-06-19 2013-05-08 東ソー株式会社 レジスト剥離液
KR102213779B1 (ko) * 2014-08-26 2021-02-08 동우 화인켐 주식회사 레지스트 박리액 조성물 및 이를 이용한 레지스트의 박리방법
TWI690780B (zh) * 2014-12-30 2020-04-11 美商富士軟片電子材料美國股份有限公司 用於自半導體基板去除光阻之剝離組成物
KR102051346B1 (ko) * 2016-06-03 2019-12-03 후지필름 가부시키가이샤 처리액, 기판 세정 방법 및 레지스트의 제거 방법

Also Published As

Publication number Publication date
WO2025005178A1 (ja) 2025-01-02
JP2025005509A (ja) 2025-01-17

Similar Documents

Publication Publication Date Title
KR101131228B1 (ko) ＣｏＷＰ 및 다공성 유전체를 위한 습식 세정 조성물
KR101435736B1 (ko) 웨이퍼-수준 패키징에서 포토레지스트의 박리 및 잔류물의 제거를 위한 조성물 및 방법
JP3441715B2 (ja) 水性リンス組成物及びそれを用いた方法
US6379875B2 (en) Stripper pretreatment
JP2002184743A (ja) ストリッピング組成物
JP2002038197A (ja) ポリマーリムーバー
CN100543590C (zh) 剥离聚合物的组合物
US6713440B2 (en) Resist and etching by-product removing composition and resist removing method using the same
US6432209B2 (en) Composition and method for removing resist and etching residues using hydroxylazmmonium carboxylates
CN101750911A (zh) 一种光刻胶清洗剂组合物
JP2010153851A (ja) フォトレジストパターン除去用組成物及びこれを利用した金属パターンの形成方法
KR100640107B1 (ko) 레지스트 제거용 세정액 및 반도체 장치의 제조 방법
CN101223265A (zh) 剥离剂组合物
TW202505318A (zh) 聚合物去除組成物及去除方法
JP2008541426A (ja) エッチングおよび灰化後のフォトレジスト残渣およびバルクのフォトレジストを除去するための組成物
JP2024177132A (ja) 樹脂マスク剥離用洗浄剤組成物
TW202424173A (zh) 半水基晶圓基底清洗液組合物及其使用方法
JP2004287288A (ja) レジスト剥離用組成物及びレジスト剥離方法
KR100552591B1 (ko) 패드 형성을 위한 포토레지스트 제거용 조성물 및 이의제조 방법
JP5206177B2 (ja) レジスト剥離液組成物およびそれを用いた半導体素子の製造方法
KR20040083157A (ko) 포토레지스트용 스트리퍼 조성물
JP7795927B2 (ja) フォトレジスト剥離組成物
KR102572751B1 (ko) 레지스트 박리액 조성물 및 이를 이용한 레지스트의 박리방법
JP7752541B2 (ja) フォトレジスト剥離組成物
CN120966574A (zh) 一种羟胺基清洗液及其在半导体铝互连制程中的应用