JP2024541727A5 - - Google Patents

Info

Publication number
JP2024541727A5
JP2024541727A5 JP2024529881A JP2024529881A JP2024541727A5 JP 2024541727 A5 JP2024541727 A5 JP 2024541727A5 JP 2024529881 A JP2024529881 A JP 2024529881A JP 2024529881 A JP2024529881 A JP 2024529881A JP 2024541727 A5 JP2024541727 A5 JP 2024541727A5
Authority
JP
Japan
Prior art keywords
edge ring
edge
ring according
reference plane
protruding section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024529881A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024541727A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2022/080276 external-priority patent/WO2023092135A1/en
Publication of JP2024541727A publication Critical patent/JP2024541727A/ja
Publication of JP2024541727A5 publication Critical patent/JP2024541727A5/ja
Pending legal-status Critical Current

Links

JP2024529881A 2021-11-22 2022-11-21 半導体処理操作におけるエッジ均一性向上のためのエッジリング Pending JP2024541727A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163264437P 2021-11-22 2021-11-22
US63/264,437 2021-11-22
PCT/US2022/080276 WO2023092135A1 (en) 2021-11-22 2022-11-21 Edge rings for improved edge uniformity in semiconductor processing operations

Publications (2)

Publication Number Publication Date
JP2024541727A JP2024541727A (ja) 2024-11-11
JP2024541727A5 true JP2024541727A5 (https=) 2025-11-18

Family

ID=86397905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024529881A Pending JP2024541727A (ja) 2021-11-22 2022-11-21 半導体処理操作におけるエッジ均一性向上のためのエッジリング

Country Status (6)

Country Link
US (1) US20250014938A1 (https=)
JP (1) JP2024541727A (https=)
KR (1) KR20240105478A (https=)
CN (1) CN118302849A (https=)
TW (1) TW202341341A (https=)
WO (1) WO2023092135A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11202010375QA (en) 2018-04-20 2020-11-27 Lam Res Corp Edge exclusion control
KR20220012999A (ko) 2020-02-11 2022-02-04 램 리써치 코포레이션 웨이퍼 베벨/에지 상의 증착을 제어하기 위한 캐리어 링 설계들

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5676360A (en) * 1995-07-11 1997-10-14 Boucher; John N. Machine tool rotary table locking apparatus
US6547559B1 (en) * 2002-05-20 2003-04-15 Veeco Instruments, Inc. Clamping of a semiconductor substrate for gas-assisted heat transfer in a vacuum chamber
US20070065597A1 (en) * 2005-09-15 2007-03-22 Asm Japan K.K. Plasma CVD film formation apparatus provided with mask
US9997381B2 (en) * 2013-02-18 2018-06-12 Lam Research Corporation Hybrid edge ring for plasma wafer processing
US20160002778A1 (en) * 2014-07-03 2016-01-07 Applied Materials, Inc. Substrate support with more uniform edge purge
GB201419210D0 (en) * 2014-10-29 2014-12-10 Spts Technologies Ltd Clamp assembly
KR102037168B1 (ko) * 2017-11-06 2019-10-28 세메스 주식회사 기판 처리 장치 및 기판 지지 유닛
SG11202010375QA (en) * 2018-04-20 2020-11-27 Lam Res Corp Edge exclusion control
WO2021179000A1 (en) * 2020-03-06 2021-09-10 Lam Research Corporation Ring structure with compliant centering fingers
US20230126912A1 (en) * 2021-10-27 2023-04-27 Asm Ip Holding B.V. Plasma cvd apparatus with a bevel mask with a planar inner edge

Similar Documents

Publication Publication Date Title
JP2024541727A5 (https=)
JP2020509861A5 (https=)
CN204959030U (zh) 用于安置基板的装置
JP2015506557A5 (https=)
JP2023513154A5 (https=)
US8757632B2 (en) Sliding ring
CN1832807A (zh) 具有一个包括碟片组件的离心滚筒的分离器
JP6797815B2 (ja) ブレード
JP2025506189A5 (https=)
JP2023169249A5 (ja) ハードディスクドライブ装置
FI3023540T3 (fi) Segmentoitu roottorin kansikokoonpano
US11846039B2 (en) Vapor deposition device and method for manufacturing epitaxial silicon wafer
CN206232802U (zh) 用于在cvd或pvd反应器的过程室中固持至少一个基材的设备
JP2008188762A5 (https=)
JP2019022931A5 (https=)
CN114761615B (zh) 一种晶圆承载盘及化学气相淀积设备
JP2015140909A5 (ja) スラスト軸受及びスラストフォイル軸受
WO2022136511A1 (en) Bump foil used in thrust bearings and corresponding thrust bearing and device
JP2007519039A (ja) カラーホイールセグメントを製造するための方法
USD965032S1 (en) Pivotal yarn support base
CN109420357B (zh) 传质机
JPWO2021255893A5 (https=)
JP2022099094A5 (https=)
JP6934335B2 (ja) 真空吸着部材
KR102840206B1 (ko) 리프트 핀 및 이를 갖는 반도체 소자 제조 장치