TW202341341A - 用於改善半導體處理操作的邊緣均勻度之邊緣環 - Google Patents

用於改善半導體處理操作的邊緣均勻度之邊緣環 Download PDF

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Publication number
TW202341341A
TW202341341A TW111144329A TW111144329A TW202341341A TW 202341341 A TW202341341 A TW 202341341A TW 111144329 A TW111144329 A TW 111144329A TW 111144329 A TW111144329 A TW 111144329A TW 202341341 A TW202341341 A TW 202341341A
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TW
Taiwan
Prior art keywords
edge
edge ring
wafer
diameter
thickness
Prior art date
Application number
TW111144329A
Other languages
English (en)
Chinese (zh)
Inventor
阿南德 嘉德瑞什卡
偉峰 許
山武門 川
賈理德 艾哈邁德 李
勞爾 維亞斯
劉剛
賈斯敏 林
Original Assignee
美商蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商蘭姆研究公司 filed Critical 美商蘭姆研究公司
Publication of TW202341341A publication Critical patent/TW202341341A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
TW111144329A 2021-11-22 2022-11-21 用於改善半導體處理操作的邊緣均勻度之邊緣環 TW202341341A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163264437P 2021-11-22 2021-11-22
US63/264,437 2021-11-22

Publications (1)

Publication Number Publication Date
TW202341341A true TW202341341A (zh) 2023-10-16

Family

ID=86397905

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111144329A TW202341341A (zh) 2021-11-22 2022-11-21 用於改善半導體處理操作的邊緣均勻度之邊緣環

Country Status (6)

Country Link
US (1) US20250014938A1 (https=)
JP (1) JP2024541727A (https=)
KR (1) KR20240105478A (https=)
CN (1) CN118302849A (https=)
TW (1) TW202341341A (https=)
WO (1) WO2023092135A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11202010375QA (en) 2018-04-20 2020-11-27 Lam Res Corp Edge exclusion control
KR20220012999A (ko) 2020-02-11 2022-02-04 램 리써치 코포레이션 웨이퍼 베벨/에지 상의 증착을 제어하기 위한 캐리어 링 설계들

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5676360A (en) * 1995-07-11 1997-10-14 Boucher; John N. Machine tool rotary table locking apparatus
US6547559B1 (en) * 2002-05-20 2003-04-15 Veeco Instruments, Inc. Clamping of a semiconductor substrate for gas-assisted heat transfer in a vacuum chamber
US20070065597A1 (en) * 2005-09-15 2007-03-22 Asm Japan K.K. Plasma CVD film formation apparatus provided with mask
US9997381B2 (en) * 2013-02-18 2018-06-12 Lam Research Corporation Hybrid edge ring for plasma wafer processing
US20160002778A1 (en) * 2014-07-03 2016-01-07 Applied Materials, Inc. Substrate support with more uniform edge purge
GB201419210D0 (en) * 2014-10-29 2014-12-10 Spts Technologies Ltd Clamp assembly
KR102037168B1 (ko) * 2017-11-06 2019-10-28 세메스 주식회사 기판 처리 장치 및 기판 지지 유닛
SG11202010375QA (en) * 2018-04-20 2020-11-27 Lam Res Corp Edge exclusion control
WO2021179000A1 (en) * 2020-03-06 2021-09-10 Lam Research Corporation Ring structure with compliant centering fingers
US20230126912A1 (en) * 2021-10-27 2023-04-27 Asm Ip Holding B.V. Plasma cvd apparatus with a bevel mask with a planar inner edge

Also Published As

Publication number Publication date
US20250014938A1 (en) 2025-01-09
JP2024541727A (ja) 2024-11-11
WO2023092135A1 (en) 2023-05-25
CN118302849A (zh) 2024-07-05
KR20240105478A (ko) 2024-07-05

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