JP2024541727A - 半導体処理操作におけるエッジ均一性向上のためのエッジリング - Google Patents

半導体処理操作におけるエッジ均一性向上のためのエッジリング Download PDF

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Publication number
JP2024541727A
JP2024541727A JP2024529881A JP2024529881A JP2024541727A JP 2024541727 A JP2024541727 A JP 2024541727A JP 2024529881 A JP2024529881 A JP 2024529881A JP 2024529881 A JP2024529881 A JP 2024529881A JP 2024541727 A JP2024541727 A JP 2024541727A
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JP
Japan
Prior art keywords
edge
edge ring
section
reference plane
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024529881A
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English (en)
Japanese (ja)
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JP2024541727A5 (https=
Inventor
チャンドラシェカー・アナンダ
ホー・レオナルド・ワイ・フン
トラン・ソン・ボー・ナン
リー・ジャレド・アーマド
ヴァス・ラウル
リュー・ガン
リン・ジャスミン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2024541727A publication Critical patent/JP2024541727A/ja
Publication of JP2024541727A5 publication Critical patent/JP2024541727A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
JP2024529881A 2021-11-22 2022-11-21 半導体処理操作におけるエッジ均一性向上のためのエッジリング Pending JP2024541727A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163264437P 2021-11-22 2021-11-22
US63/264,437 2021-11-22
PCT/US2022/080276 WO2023092135A1 (en) 2021-11-22 2022-11-21 Edge rings for improved edge uniformity in semiconductor processing operations

Publications (2)

Publication Number Publication Date
JP2024541727A true JP2024541727A (ja) 2024-11-11
JP2024541727A5 JP2024541727A5 (https=) 2025-11-18

Family

ID=86397905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024529881A Pending JP2024541727A (ja) 2021-11-22 2022-11-21 半導体処理操作におけるエッジ均一性向上のためのエッジリング

Country Status (6)

Country Link
US (1) US20250014938A1 (https=)
JP (1) JP2024541727A (https=)
KR (1) KR20240105478A (https=)
CN (1) CN118302849A (https=)
TW (1) TW202341341A (https=)
WO (1) WO2023092135A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11202010375QA (en) 2018-04-20 2020-11-27 Lam Res Corp Edge exclusion control
KR20220012999A (ko) 2020-02-11 2022-02-04 램 리써치 코포레이션 웨이퍼 베벨/에지 상의 증착을 제어하기 위한 캐리어 링 설계들

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5676360A (en) * 1995-07-11 1997-10-14 Boucher; John N. Machine tool rotary table locking apparatus
US6547559B1 (en) * 2002-05-20 2003-04-15 Veeco Instruments, Inc. Clamping of a semiconductor substrate for gas-assisted heat transfer in a vacuum chamber
US20070065597A1 (en) * 2005-09-15 2007-03-22 Asm Japan K.K. Plasma CVD film formation apparatus provided with mask
US9997381B2 (en) * 2013-02-18 2018-06-12 Lam Research Corporation Hybrid edge ring for plasma wafer processing
US20160002778A1 (en) * 2014-07-03 2016-01-07 Applied Materials, Inc. Substrate support with more uniform edge purge
GB201419210D0 (en) * 2014-10-29 2014-12-10 Spts Technologies Ltd Clamp assembly
KR102037168B1 (ko) * 2017-11-06 2019-10-28 세메스 주식회사 기판 처리 장치 및 기판 지지 유닛
SG11202010375QA (en) * 2018-04-20 2020-11-27 Lam Res Corp Edge exclusion control
WO2021179000A1 (en) * 2020-03-06 2021-09-10 Lam Research Corporation Ring structure with compliant centering fingers
US20230126912A1 (en) * 2021-10-27 2023-04-27 Asm Ip Holding B.V. Plasma cvd apparatus with a bevel mask with a planar inner edge

Also Published As

Publication number Publication date
US20250014938A1 (en) 2025-01-09
WO2023092135A1 (en) 2023-05-25
CN118302849A (zh) 2024-07-05
KR20240105478A (ko) 2024-07-05
TW202341341A (zh) 2023-10-16

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