CN118302849A - 用于改善半导体处理操作的边缘均匀度的边缘环 - Google Patents
用于改善半导体处理操作的边缘均匀度的边缘环 Download PDFInfo
- Publication number
- CN118302849A CN118302849A CN202280077579.4A CN202280077579A CN118302849A CN 118302849 A CN118302849 A CN 118302849A CN 202280077579 A CN202280077579 A CN 202280077579A CN 118302849 A CN118302849 A CN 118302849A
- Authority
- CN
- China
- Prior art keywords
- edge
- edge ring
- reference plane
- ring
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163264437P | 2021-11-22 | 2021-11-22 | |
| US63/264,437 | 2021-11-22 | ||
| PCT/US2022/080276 WO2023092135A1 (en) | 2021-11-22 | 2022-11-21 | Edge rings for improved edge uniformity in semiconductor processing operations |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118302849A true CN118302849A (zh) | 2024-07-05 |
Family
ID=86397905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280077579.4A Pending CN118302849A (zh) | 2021-11-22 | 2022-11-21 | 用于改善半导体处理操作的边缘均匀度的边缘环 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250014938A1 (https=) |
| JP (1) | JP2024541727A (https=) |
| KR (1) | KR20240105478A (https=) |
| CN (1) | CN118302849A (https=) |
| TW (1) | TW202341341A (https=) |
| WO (1) | WO2023092135A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11202010375QA (en) | 2018-04-20 | 2020-11-27 | Lam Res Corp | Edge exclusion control |
| KR20220012999A (ko) | 2020-02-11 | 2022-02-04 | 램 리써치 코포레이션 | 웨이퍼 베벨/에지 상의 증착을 제어하기 위한 캐리어 링 설계들 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5676360A (en) * | 1995-07-11 | 1997-10-14 | Boucher; John N. | Machine tool rotary table locking apparatus |
| US6547559B1 (en) * | 2002-05-20 | 2003-04-15 | Veeco Instruments, Inc. | Clamping of a semiconductor substrate for gas-assisted heat transfer in a vacuum chamber |
| US20070065597A1 (en) * | 2005-09-15 | 2007-03-22 | Asm Japan K.K. | Plasma CVD film formation apparatus provided with mask |
| US9997381B2 (en) * | 2013-02-18 | 2018-06-12 | Lam Research Corporation | Hybrid edge ring for plasma wafer processing |
| US20160002778A1 (en) * | 2014-07-03 | 2016-01-07 | Applied Materials, Inc. | Substrate support with more uniform edge purge |
| GB201419210D0 (en) * | 2014-10-29 | 2014-12-10 | Spts Technologies Ltd | Clamp assembly |
| KR102037168B1 (ko) * | 2017-11-06 | 2019-10-28 | 세메스 주식회사 | 기판 처리 장치 및 기판 지지 유닛 |
| SG11202010375QA (en) * | 2018-04-20 | 2020-11-27 | Lam Res Corp | Edge exclusion control |
| WO2021179000A1 (en) * | 2020-03-06 | 2021-09-10 | Lam Research Corporation | Ring structure with compliant centering fingers |
| US20230126912A1 (en) * | 2021-10-27 | 2023-04-27 | Asm Ip Holding B.V. | Plasma cvd apparatus with a bevel mask with a planar inner edge |
-
2022
- 2022-11-21 CN CN202280077579.4A patent/CN118302849A/zh active Pending
- 2022-11-21 US US18/712,211 patent/US20250014938A1/en active Pending
- 2022-11-21 KR KR1020247020476A patent/KR20240105478A/ko active Pending
- 2022-11-21 WO PCT/US2022/080276 patent/WO2023092135A1/en not_active Ceased
- 2022-11-21 JP JP2024529881A patent/JP2024541727A/ja active Pending
- 2022-11-21 TW TW111144329A patent/TW202341341A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US20250014938A1 (en) | 2025-01-09 |
| JP2024541727A (ja) | 2024-11-11 |
| WO2023092135A1 (en) | 2023-05-25 |
| KR20240105478A (ko) | 2024-07-05 |
| TW202341341A (zh) | 2023-10-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |