KR20240105478A - 반도체 프로세싱 작업에서의 개선된 에지 균일성을 위한 에지 링 - Google Patents

반도체 프로세싱 작업에서의 개선된 에지 균일성을 위한 에지 링 Download PDF

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Publication number
KR20240105478A
KR20240105478A KR1020247020476A KR20247020476A KR20240105478A KR 20240105478 A KR20240105478 A KR 20240105478A KR 1020247020476 A KR1020247020476 A KR 1020247020476A KR 20247020476 A KR20247020476 A KR 20247020476A KR 20240105478 A KR20240105478 A KR 20240105478A
Authority
KR
South Korea
Prior art keywords
edge
edge ring
section
ring
recessed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247020476A
Other languages
English (en)
Korean (ko)
Inventor
아난드 찬드라셰카르
레오나르드 와이 펑 코
손 보 남 트란
자레드 아마드 리
라울 비야스
강 리우
자스마인 린
Original Assignee
램 리써치 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 램 리써치 코포레이션 filed Critical 램 리써치 코포레이션
Publication of KR20240105478A publication Critical patent/KR20240105478A/ko
Pending legal-status Critical Current

Links

Classifications

    • H01L21/68735—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020247020476A 2021-11-22 2022-11-21 반도체 프로세싱 작업에서의 개선된 에지 균일성을 위한 에지 링 Pending KR20240105478A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163264437P 2021-11-22 2021-11-22
US63/264,437 2021-11-22
PCT/US2022/080276 WO2023092135A1 (en) 2021-11-22 2022-11-21 Edge rings for improved edge uniformity in semiconductor processing operations

Publications (1)

Publication Number Publication Date
KR20240105478A true KR20240105478A (ko) 2024-07-05

Family

ID=86397905

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247020476A Pending KR20240105478A (ko) 2021-11-22 2022-11-21 반도체 프로세싱 작업에서의 개선된 에지 균일성을 위한 에지 링

Country Status (6)

Country Link
US (1) US20250014938A1 (https=)
JP (1) JP2024541727A (https=)
KR (1) KR20240105478A (https=)
CN (1) CN118302849A (https=)
TW (1) TW202341341A (https=)
WO (1) WO2023092135A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11202010375QA (en) 2018-04-20 2020-11-27 Lam Res Corp Edge exclusion control
KR20220012999A (ko) 2020-02-11 2022-02-04 램 리써치 코포레이션 웨이퍼 베벨/에지 상의 증착을 제어하기 위한 캐리어 링 설계들

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5676360A (en) * 1995-07-11 1997-10-14 Boucher; John N. Machine tool rotary table locking apparatus
US6547559B1 (en) * 2002-05-20 2003-04-15 Veeco Instruments, Inc. Clamping of a semiconductor substrate for gas-assisted heat transfer in a vacuum chamber
US20070065597A1 (en) * 2005-09-15 2007-03-22 Asm Japan K.K. Plasma CVD film formation apparatus provided with mask
US9997381B2 (en) * 2013-02-18 2018-06-12 Lam Research Corporation Hybrid edge ring for plasma wafer processing
US20160002778A1 (en) * 2014-07-03 2016-01-07 Applied Materials, Inc. Substrate support with more uniform edge purge
GB201419210D0 (en) * 2014-10-29 2014-12-10 Spts Technologies Ltd Clamp assembly
KR102037168B1 (ko) * 2017-11-06 2019-10-28 세메스 주식회사 기판 처리 장치 및 기판 지지 유닛
SG11202010375QA (en) * 2018-04-20 2020-11-27 Lam Res Corp Edge exclusion control
WO2021179000A1 (en) * 2020-03-06 2021-09-10 Lam Research Corporation Ring structure with compliant centering fingers
US20230126912A1 (en) * 2021-10-27 2023-04-27 Asm Ip Holding B.V. Plasma cvd apparatus with a bevel mask with a planar inner edge

Also Published As

Publication number Publication date
US20250014938A1 (en) 2025-01-09
JP2024541727A (ja) 2024-11-11
WO2023092135A1 (en) 2023-05-25
CN118302849A (zh) 2024-07-05
TW202341341A (zh) 2023-10-16

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