JP2024539676A5 - - Google Patents
Info
- Publication number
- JP2024539676A5 JP2024539676A5 JP2024523453A JP2024523453A JP2024539676A5 JP 2024539676 A5 JP2024539676 A5 JP 2024539676A5 JP 2024523453 A JP2024523453 A JP 2024523453A JP 2024523453 A JP2024523453 A JP 2024523453A JP 2024539676 A5 JP2024539676 A5 JP 2024539676A5
- Authority
- JP
- Japan
- Prior art keywords
- acid
- approximately
- metal
- containing film
- halogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163257244P | 2021-10-19 | 2021-10-19 | |
| US63/257,244 | 2021-10-19 | ||
| US202263366860P | 2022-06-23 | 2022-06-23 | |
| US63/366,860 | 2022-06-23 | ||
| PCT/EP2022/078797 WO2023066847A1 (en) | 2021-10-19 | 2022-10-17 | Selective thermal atomic layer etching |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024539676A JP2024539676A (ja) | 2024-10-29 |
| JP2024539676A5 true JP2024539676A5 (https=) | 2025-10-22 |
Family
ID=84360255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024523453A Pending JP2024539676A (ja) | 2021-10-19 | 2022-10-17 | 選択的熱原子層エッチング |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12590374B2 (https=) |
| EP (1) | EP4419732A1 (https=) |
| JP (1) | JP2024539676A (https=) |
| KR (1) | KR20240089749A (https=) |
| IL (1) | IL311977A (https=) |
| TW (1) | TW202335134A (https=) |
| WO (1) | WO2023066847A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202335134A (zh) | 2021-10-19 | 2023-09-01 | 德商馬克專利公司 | 選擇性的熱原子層蝕刻 |
| CN121153106A (zh) * | 2023-04-14 | 2025-12-16 | 弗萨姆材料美国有限责任公司 | 含金属材料的气相蚀刻 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5259125B2 (ja) | 2006-08-24 | 2013-08-07 | 富士通セミコンダクター株式会社 | 基板処理方法、半導体装置の製造方法、基板処理装置および記録媒体 |
| US9490145B2 (en) | 2015-02-23 | 2016-11-08 | Asm Ip Holding B.V. | Removal of surface passivation |
| US9620627B1 (en) * | 2015-12-15 | 2017-04-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Field-effect transistors having black phosphorus channel and methods of making the same |
| WO2017213842A2 (en) * | 2016-05-23 | 2017-12-14 | The Regents Of The University Of Colorado, A Body Corporate | Enhancement of thermal atomic layer etching |
| KR102805391B1 (ko) * | 2016-12-09 | 2025-05-12 | 에이에스엠 아이피 홀딩 비.브이. | 열적 원자층 식각 공정 |
| JP2022090148A (ja) * | 2019-04-02 | 2022-06-17 | 株式会社Adeka | 原子層エッチング法用エッチング材料 |
| US11574813B2 (en) * | 2019-12-10 | 2023-02-07 | Asm Ip Holding B.V. | Atomic layer etching |
| US20240030037A1 (en) | 2020-09-01 | 2024-01-25 | Adeka Corporation | Etching method |
| TW202335134A (zh) | 2021-10-19 | 2023-09-01 | 德商馬克專利公司 | 選擇性的熱原子層蝕刻 |
-
2022
- 2022-10-17 TW TW111139238A patent/TW202335134A/zh unknown
- 2022-10-17 KR KR1020247015988A patent/KR20240089749A/ko active Pending
- 2022-10-17 WO PCT/EP2022/078797 patent/WO2023066847A1/en not_active Ceased
- 2022-10-17 US US18/693,555 patent/US12590374B2/en active Active
- 2022-10-17 JP JP2024523453A patent/JP2024539676A/ja active Pending
- 2022-10-17 IL IL311977A patent/IL311977A/en unknown
- 2022-10-17 EP EP22808619.5A patent/EP4419732A1/en active Pending
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