JP2024538550A5 - - Google Patents

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Publication number
JP2024538550A5
JP2024538550A5 JP2024518383A JP2024518383A JP2024538550A5 JP 2024538550 A5 JP2024538550 A5 JP 2024538550A5 JP 2024518383 A JP2024518383 A JP 2024518383A JP 2024518383 A JP2024518383 A JP 2024518383A JP 2024538550 A5 JP2024538550 A5 JP 2024538550A5
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JP
Japan
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mass
composition
composition according
approximately
amount
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2024518383A
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English (en)
Japanese (ja)
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JP2024538550A (ja
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Priority claimed from PCT/US2022/076685 external-priority patent/WO2023049688A1/en
Publication of JP2024538550A publication Critical patent/JP2024538550A/ja
Publication of JP2024538550A5 publication Critical patent/JP2024538550A5/ja
Withdrawn legal-status Critical Current

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JP2024518383A 2021-09-23 2022-09-20 ポストドライエッチングフォトレジストおよび金属含有残渣の除去配合物 Withdrawn JP2024538550A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163247347P 2021-09-23 2021-09-23
US63/247,347 2021-09-23
PCT/US2022/076685 WO2023049688A1 (en) 2021-09-23 2022-09-20 Post-dry etching photoresist and metal containing residue removal formulation

Publications (2)

Publication Number Publication Date
JP2024538550A JP2024538550A (ja) 2024-10-23
JP2024538550A5 true JP2024538550A5 (enExample) 2025-09-30

Family

ID=83996417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024518383A Withdrawn JP2024538550A (ja) 2021-09-23 2022-09-20 ポストドライエッチングフォトレジストおよび金属含有残渣の除去配合物

Country Status (7)

Country Link
US (1) US20240392194A1 (enExample)
EP (1) EP4388069A1 (enExample)
JP (1) JP2024538550A (enExample)
KR (1) KR20240076803A (enExample)
CN (1) CN118159635A (enExample)
TW (1) TW202313946A (enExample)
WO (1) WO2023049688A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240117280A1 (en) * 2022-09-16 2024-04-11 Tokyo Ohka Kogyo Co., Ltd. Metal residue removing liquid, metal residue removing method, and metal wiring manufacturing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6828289B2 (en) * 1999-01-27 2004-12-07 Air Products And Chemicals, Inc. Low surface tension, low viscosity, aqueous, acidic compositions containing fluoride and organic, polar solvents for removal of photoresist and organic and inorganic etch residues at room temperature
US20030022800A1 (en) * 2001-06-14 2003-01-30 Peters Darryl W. Aqueous buffered fluoride-containing etch residue removers and cleaners
US6677286B1 (en) * 2002-07-10 2004-01-13 Air Products And Chemicals, Inc. Compositions for removing etching residue and use thereof
US7166419B2 (en) * 2002-09-26 2007-01-23 Air Products And Chemicals, Inc. Compositions substrate for removing etching residue and use thereof

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