JP2024531348A - 部品の転写のための剥離層組成物 - Google Patents

部品の転写のための剥離層組成物 Download PDF

Info

Publication number
JP2024531348A
JP2024531348A JP2024509429A JP2024509429A JP2024531348A JP 2024531348 A JP2024531348 A JP 2024531348A JP 2024509429 A JP2024509429 A JP 2024509429A JP 2024509429 A JP2024509429 A JP 2024509429A JP 2024531348 A JP2024531348 A JP 2024531348A
Authority
JP
Japan
Prior art keywords
release layer
possibly replaced
independently
mol
layer composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024509429A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024531348A5 (https=
Inventor
エム． ラヴ，ディロン
Original Assignee
テレサーキッツ コーポレーション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by テレサーキッツ コーポレーション filed Critical テレサーキッツ コーポレーション
Publication of JP2024531348A publication Critical patent/JP2024531348A/ja
Publication of JP2024531348A5 publication Critical patent/JP2024531348A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
    • C08G64/02—Aliphatic polycarbonates
    • C08G64/0208—Aliphatic polycarbonates saturated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
    • C08G64/02—Aliphatic polycarbonates
    • C08G64/0291—Aliphatic polycarbonates unsaturated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
    • C08G64/20—General preparatory processes
    • C08G64/30—General preparatory processes using carbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
    • C08G64/20—General preparatory processes
    • C08G64/30—General preparatory processes using carbonates
    • C08G64/305—General preparatory processes using carbonates and alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
    • C08G64/20—General preparatory processes
    • C08G64/38—General preparatory processes using other monomers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J169/00—Adhesives based on polycarbonates; Adhesives based on derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Polyethers (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
JP2024509429A 2021-08-18 2022-08-17 部品の転写のための剥離層組成物 Pending JP2024531348A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163234406P 2021-08-18 2021-08-18
US63/234,406 2021-08-18
PCT/US2022/075086 WO2023023554A1 (en) 2021-08-18 2022-08-17 Release layer composition for transfer of components

Publications (2)

Publication Number Publication Date
JP2024531348A true JP2024531348A (ja) 2024-08-29
JP2024531348A5 JP2024531348A5 (https=) 2025-09-05

Family

ID=84044196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024509429A Pending JP2024531348A (ja) 2021-08-18 2022-08-17 部品の転写のための剥離層組成物

Country Status (4)

Country Link
US (1) US20230130004A1 (https=)
EP (1) EP4388029A1 (https=)
JP (1) JP2024531348A (https=)
WO (1) WO2023023554A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12596306B2 (en) * 2021-11-11 2026-04-07 Terecircuits Corporation Photochemical and thermal release layer processes and uses in device manufacturing
TWI883847B (zh) * 2024-03-05 2025-05-11 聚嶸科技股份有限公司 晶片移轉的方法與晶片移轉系統

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6187130B2 (ja) * 2013-01-09 2017-08-30 株式会社リコー 分解性ポリマー
US10479915B2 (en) * 2016-04-22 2019-11-19 Georgia Tech Research Corporation Transient adhesives, methods of making, and methods of use
CN108130003A (zh) * 2017-12-19 2018-06-08 江苏斯瑞达新材料科技有限公司 电子元器件用防水耐热保护膜

Also Published As

Publication number Publication date
US20230130004A1 (en) 2023-04-27
EP4388029A1 (en) 2024-06-26
WO2023023554A1 (en) 2023-02-23

Similar Documents

Publication Publication Date Title
CN113993906B (zh) 通过双色光聚合来局部聚合起始材料的方法和设备以及成形体的体积打印方法
JP2024531348A (ja) 部品の転写のための剥離層組成物
JP3944669B2 (ja) エステル化合物
EP1583740B1 (en) Fluoroarylsulfonium photoacid generators
Crivello et al. Free radical induced acceleration of cationic photopolymerization
US8704348B2 (en) Polyol photosensitizers, carrier gas UV laser ablation sensitizers, and other additives and methods for making and using same
KR20140033027A (ko) 안정화된 산 증폭제
JP2002534568A (ja) 光重合性ビニルエ−テルを基剤にした単量体配合物及び新規のスピロオルトカ−ボネ−ト含有の重合性組成物
JP2019085533A (ja) 硬化性組成物及びそれを用いた光学素子
JP2005518476A (ja) フッ素化された分子並びに、その製造及び使用法
WO2025148802A1 (zh) 甲酰甲酸酯香豆素化合物、其制备方法和用途以及包含其的光引发剂组合物
TWI228131B (en) Acetal compound, polymer, resist material and method for forming pattern
KR20140042753A (ko) 안정화된 산 증폭제
JP4814454B2 (ja) フォトクロミック材料の製造方法
JP5803025B2 (ja) フォトクロミック分子
TWI472509B (zh) 光酸產生劑及其製備方法、以及含有該光酸產生劑的抗蝕劑組成物及化合物
JP4469080B2 (ja) 脂環構造を有する新規第三級アルコール化合物
JP5240352B2 (ja) 接着剤
TW200306458A (en) New acid generator and thin film composition containing the same
EP4011864A1 (en) Photobase generator, compound, photoreactive composition, and reaction product
EP4567515A2 (en) Composition comprising naphthopyran photoswitchable photoinitiators and thiols for locally polymerizing a starting material by dual color photopolymerization
JP2006348199A (ja) 接着剤組成物およびそれを用いた接着フィルム、接着物の製造方法
JP4645075B2 (ja) 硬化型粘接着材料
JP2003306470A (ja) カリックスアレーン誘導体およびその製造方法、シクロデキストリン誘導体およびその製造方法並びに屈折率変換材料および光−熱エネルギー変換蓄積材料
CN115557982A (zh) 一种碳硼烷类化合物及其制备方法和应用

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250814

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250828