JP2024531348A5 - - Google Patents

Info

Publication number
JP2024531348A5
JP2024531348A5 JP2024509429A JP2024509429A JP2024531348A5 JP 2024531348 A5 JP2024531348 A5 JP 2024531348A5 JP 2024509429 A JP2024509429 A JP 2024509429A JP 2024509429 A JP2024509429 A JP 2024509429A JP 2024531348 A5 JP2024531348 A5 JP 2024531348A5
Authority
JP
Japan
Prior art keywords
replaced
cases
release layer
cases replaced
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024509429A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024531348A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2022/075086 external-priority patent/WO2023023554A1/en
Publication of JP2024531348A publication Critical patent/JP2024531348A/ja
Publication of JP2024531348A5 publication Critical patent/JP2024531348A5/ja
Pending legal-status Critical Current

Links

JP2024509429A 2021-08-18 2022-08-17 部品の転写のための剥離層組成物 Pending JP2024531348A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163234406P 2021-08-18 2021-08-18
US63/234,406 2021-08-18
PCT/US2022/075086 WO2023023554A1 (en) 2021-08-18 2022-08-17 Release layer composition for transfer of components

Publications (2)

Publication Number Publication Date
JP2024531348A JP2024531348A (ja) 2024-08-29
JP2024531348A5 true JP2024531348A5 (https=) 2025-09-05

Family

ID=84044196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024509429A Pending JP2024531348A (ja) 2021-08-18 2022-08-17 部品の転写のための剥離層組成物

Country Status (4)

Country Link
US (1) US20230130004A1 (https=)
EP (1) EP4388029A1 (https=)
JP (1) JP2024531348A (https=)
WO (1) WO2023023554A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12596306B2 (en) * 2021-11-11 2026-04-07 Terecircuits Corporation Photochemical and thermal release layer processes and uses in device manufacturing
TWI883847B (zh) * 2024-03-05 2025-05-11 聚嶸科技股份有限公司 晶片移轉的方法與晶片移轉系統

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6187130B2 (ja) * 2013-01-09 2017-08-30 株式会社リコー 分解性ポリマー
US10479915B2 (en) * 2016-04-22 2019-11-19 Georgia Tech Research Corporation Transient adhesives, methods of making, and methods of use
CN108130003A (zh) * 2017-12-19 2018-06-08 江苏斯瑞达新材料科技有限公司 电子元器件用防水耐热保护膜

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