JP2024518226A5 - - Google Patents

Info

Publication number
JP2024518226A5
JP2024518226A5 JP2023555579A JP2023555579A JP2024518226A5 JP 2024518226 A5 JP2024518226 A5 JP 2024518226A5 JP 2023555579 A JP2023555579 A JP 2023555579A JP 2023555579 A JP2023555579 A JP 2023555579A JP 2024518226 A5 JP2024518226 A5 JP 2024518226A5
Authority
JP
Japan
Prior art keywords
target
layer
features
subtarget
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023555579A
Other languages
English (en)
Japanese (ja)
Other versions
JP7597947B2 (ja
JP2024518226A (ja
Filing date
Publication date
Priority claimed from US17/351,137 external-priority patent/US11726410B2/en
Application filed filed Critical
Publication of JP2024518226A publication Critical patent/JP2024518226A/ja
Publication of JP2024518226A5 publication Critical patent/JP2024518226A5/ja
Priority to JP2024207254A priority Critical patent/JP2025023083A/ja
Application granted granted Critical
Publication of JP7597947B2 publication Critical patent/JP7597947B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2023555579A 2021-04-20 2021-08-10 マルチ分解能オーバーレイ計測ターゲット Active JP7597947B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024207254A JP2025023083A (ja) 2021-04-20 2024-11-28 マルチ分解能オーバーレイ計測ターゲット

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202163176888P 2021-04-20 2021-04-20
US63/176,888 2021-04-20
US17/351,137 2021-06-17
US17/351,137 US11726410B2 (en) 2021-04-20 2021-06-17 Multi-resolution overlay metrology targets
PCT/US2021/045292 WO2022225544A1 (en) 2021-04-20 2021-08-10 Multi-resolution overlay metrology targets

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024207254A Division JP2025023083A (ja) 2021-04-20 2024-11-28 マルチ分解能オーバーレイ計測ターゲット

Publications (3)

Publication Number Publication Date
JP2024518226A JP2024518226A (ja) 2024-05-01
JP2024518226A5 true JP2024518226A5 (https=) 2024-06-21
JP7597947B2 JP7597947B2 (ja) 2024-12-10

Family

ID=83601313

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023555579A Active JP7597947B2 (ja) 2021-04-20 2021-08-10 マルチ分解能オーバーレイ計測ターゲット
JP2024207254A Pending JP2025023083A (ja) 2021-04-20 2024-11-28 マルチ分解能オーバーレイ計測ターゲット

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024207254A Pending JP2025023083A (ja) 2021-04-20 2024-11-28 マルチ分解能オーバーレイ計測ターゲット

Country Status (6)

Country Link
US (1) US11726410B2 (https=)
JP (2) JP7597947B2 (https=)
KR (1) KR102733393B1 (https=)
CN (1) CN116997863B (https=)
TW (1) TWI865808B (https=)
WO (1) WO2022225544A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102875946B1 (ko) * 2021-11-27 2025-10-23 케이엘에이 코포레이션 회절 기반 오버레이 오차 계측을 위한 개선된 타겟
KR102554833B1 (ko) * 2023-02-14 2023-07-13 (주)오로스 테크놀로지 오버레이 계측 장치 및 오버레이 계측 방법
CN116991032A (zh) * 2023-07-19 2023-11-03 南方科技大学 一种极紫外光刻胶性能检测装置及方法
CN119725327B (zh) * 2025-02-28 2025-06-06 荣芯半导体(宁波)有限公司 一种对准标记版图及其操作方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1314198B1 (en) * 2000-08-30 2017-03-08 KLA-Tencor Corporation Overlay marks, methods of overlay mark design and methods of overlay measurements
US6778275B2 (en) 2002-02-20 2004-08-17 Micron Technology, Inc. Aberration mark and method for estimating overlay error and optical aberrations
US20040066517A1 (en) 2002-09-05 2004-04-08 Hsu-Ting Huang Interferometry-based method and apparatus for overlay metrology
US7440105B2 (en) 2002-12-05 2008-10-21 Kla-Tencor Technologies Corporation Continuously varying offset mark and methods of determining overlay
JP4538782B2 (ja) * 2004-01-09 2010-09-08 株式会社ニコン 撮像装置
US7065737B2 (en) * 2004-03-01 2006-06-20 Advanced Micro Devices, Inc Multi-layer overlay measurement and correction technique for IC manufacturing
KR100612410B1 (ko) 2005-08-01 2006-08-16 나노메트릭스코리아 주식회사 오버레이 키, 이를 이용한 오버레이 측정방법 및 측정장치
US9709903B2 (en) * 2011-11-01 2017-07-18 Kla-Tencor Corporation Overlay target geometry for measuring multiple pitches
JP2013120872A (ja) * 2011-12-08 2013-06-17 Toshiba Corp 重ね合わせ計測方法
US8913237B2 (en) * 2012-06-26 2014-12-16 Kla-Tencor Corporation Device-like scatterometry overlay targets
KR102094974B1 (ko) 2013-03-08 2020-03-30 삼성전자주식회사 오버레이 계측 방법
WO2015196168A1 (en) * 2014-06-21 2015-12-23 Kla-Tencor Corporation Compound imaging metrology targets
KR102295507B1 (ko) * 2014-08-29 2021-09-01 에이에스엠엘 네델란즈 비.브이. 메트롤로지 방법, 타겟 및 기판
JP6421237B2 (ja) 2014-08-29 2018-11-07 エーエスエムエル ネザーランズ ビー．ブイ． メトロロジー方法、ターゲット、及び基板
NL2017466A (en) * 2015-09-30 2017-04-05 Asml Netherlands Bv Metrology method, target and substrate
CN109478023B (zh) * 2016-07-15 2021-09-10 Asml荷兰有限公司 用于量测目标场的设计的方法和设备
WO2018033342A1 (en) * 2016-08-17 2018-02-22 Asml Netherlands B.V. Substrate measurement recipe design of, or for, a target including a latent image
EP3321738A1 (en) * 2016-11-10 2018-05-16 ASML Netherlands B.V. Method of measuring a parameter of a device manufacturing process, metrology apparatus, substrate, target, device manufacturing system, and device manufacturing method
US11112369B2 (en) * 2017-06-19 2021-09-07 Kla-Tencor Corporation Hybrid overlay target design for imaging-based overlay and scatterometry-based overlay

Similar Documents

Publication Publication Date Title
JP2024518226A5 (https=)
TWI766381B (zh) 蒸鍍遮罩、附有框架之蒸鍍遮罩、有機半導體元件之製造方法、蒸鍍遮罩之製造方法及圖案之形成方法
TWI712854B (zh) 雷射用遮罩、蒸鍍遮罩之製造方法、蒸鍍遮罩製造裝置及有機半導體元件之製造方法
US12480198B2 (en) Mask, and manufacturing method for mask
CN107742623B (zh) 显示基板、有机发光器件及膜层蒸镀检测方法、显示装置
CN111886357B (zh) 一种蒸镀掩模及其制造方法
US9978595B2 (en) Photo mask and exposure system
CN102629613B (zh) 一种x射线传感器的制作方法
JP6326885B2 (ja) 蒸着マスク、蒸着マスク準備体、及び有機半導体素子の製造方法
CN104755648A (zh) 成膜掩膜
CN106367716B (zh) 掩模板及显示面板的制作方法
CN114761605B (zh) 掩膜板及其制备方法、显示面板及其制备方法、显示装置
CN109642823A (zh) 限制图像传感器中的串扰的方法
CN111188008B (zh) 一种金属掩膜条、金属掩膜板及其制作方法以及玻璃光罩
CN109324439B (zh) 一种显示面板及其制作方法，以及显示装置
JP2020037742A (ja) 蒸着マスク、フレーム付き蒸着マスク、有機半導体素子の製造方法、及び蒸着マスクの製造方法
JP6347112B2 (ja) 蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、パターンの製造方法、フレーム付き蒸着マスク、及び有機半導体素子の製造方法
TWI489223B (zh) 基板上的圖案化方法
CN111103767A (zh) 一种半导体器件及其制作方法和电子设备
JP6529329B2 (ja) タッチパネル製造方法、タッチパネルのガラス基板及びタッチパネル製造用マスク
JP6879461B2 (ja) 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、有機半導体素子の製造方法、および有機ｅｌディスプレイの製造方法
WO2020118834A1 (zh) 掩膜版组合和使用掩膜版组合将半导体薄膜图形化的方法
JP2011248306A (ja) 階段状およびレンズ形状レジスト構造の製造方法
TWI652812B (zh) Pixel arrangement structure, special-shaped display screen body and preparation method of special-shaped display screen body
JP2023115863A5 (https=)