JP2024516742A5 - - Google Patents

Info

Publication number
JP2024516742A5
JP2024516742A5 JP2023568590A JP2023568590A JP2024516742A5 JP 2024516742 A5 JP2024516742 A5 JP 2024516742A5 JP 2023568590 A JP2023568590 A JP 2023568590A JP 2023568590 A JP2023568590 A JP 2023568590A JP 2024516742 A5 JP2024516742 A5 JP 2024516742A5
Authority
JP
Japan
Prior art keywords
coating
insulator
package assembly
flange
microelectronics package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023568590A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024516742A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2022/027846 external-priority patent/WO2022235914A1/en
Publication of JP2024516742A publication Critical patent/JP2024516742A/ja
Publication of JP2024516742A5 publication Critical patent/JP2024516742A5/ja
Pending legal-status Critical Current

Links

JP2023568590A 2021-05-07 2022-05-05 マイクロエレクトロニクスパッケージアセンブリおよび作製方法 Pending JP2024516742A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163185768P 2021-05-07 2021-05-07
US63/185,768 2021-05-07
PCT/US2022/027846 WO2022235914A1 (en) 2021-05-07 2022-05-05 Microelectronics package assemblies and processes for making

Publications (2)

Publication Number Publication Date
JP2024516742A JP2024516742A (ja) 2024-04-16
JP2024516742A5 true JP2024516742A5 (enExample) 2025-05-07

Family

ID=81927461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023568590A Pending JP2024516742A (ja) 2021-05-07 2022-05-05 マイクロエレクトロニクスパッケージアセンブリおよび作製方法

Country Status (6)

Country Link
US (1) US12074099B2 (enExample)
JP (1) JP2024516742A (enExample)
KR (1) KR102914493B1 (enExample)
CN (1) CN117280457A (enExample)
TW (1) TW202249583A (enExample)
WO (1) WO2022235914A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12224218B2 (en) * 2022-02-11 2025-02-11 Wolfspeed, Inc. Semiconductor packages with increased power handling
USD1056862S1 (en) 2022-08-24 2025-01-07 Wolfspeed, Inc. Semiconductor package
GB2635648A (en) * 2023-10-17 2025-05-28 Trak Microwave Ltd Radio frequency components and manufacturing of radio-frequency components
TWI866712B (zh) * 2023-12-21 2024-12-11 矽品精密工業股份有限公司 散熱結構及其電子封裝件

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819385B2 (ja) * 1974-09-04 1983-04-18 日本電気株式会社 ロウヅケホウホウ
EP0074378A4 (en) * 1981-03-23 1985-04-25 Motorola Inc SEMICONDUCTOR DEVICE INCLUDING A HOUSING WITHOUT PLATING.
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
US6903013B2 (en) * 2003-05-16 2005-06-07 Chartered Semiconductor Manufacturing Ltd. Method to fill a trench and tunnel by using ALD seed layer and electroless plating
US7731078B2 (en) * 2004-11-13 2010-06-08 Stats Chippac Ltd. Semiconductor system with fine pitch lead fingers
JP2006196810A (ja) * 2005-01-17 2006-07-27 Kyocera Corp セラミック回路基板および電子部品モジュール
JP4816049B2 (ja) * 2005-12-13 2011-11-16 大日本印刷株式会社 センサーパッケージおよびその製造方法
US8617926B2 (en) * 2010-09-09 2013-12-31 Advanced Micro Devices, Inc. Semiconductor chip device with polymeric filler trench
SG11201507552WA (en) 2013-03-15 2015-10-29 Materion Corp Gold containing die bond sheet preform spot-welded to a semiconductor bond site on a semiconductor package and corresponding manufacturing method
US10211115B2 (en) 2014-05-21 2019-02-19 Materion Corporation Method of making a ceramic combo lid with selective and edge metallizations
US20170069560A1 (en) 2014-05-23 2017-03-09 Materion Corporation Air cavity package
US9543170B2 (en) * 2014-08-22 2017-01-10 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor packages and methods of forming the same
WO2017201260A1 (en) 2016-05-20 2017-11-23 Materion Corporation Copper flanged air cavity packages for high frequency devices
US11646255B2 (en) * 2021-03-18 2023-05-09 Taiwan Semiconductor Manufacturing Company Limited Chip package structure including a silicon substrate interposer and methods for forming the same

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