JP2024510657A5 - - Google Patents
Info
- Publication number
- JP2024510657A5 JP2024510657A5 JP2023557439A JP2023557439A JP2024510657A5 JP 2024510657 A5 JP2024510657 A5 JP 2024510657A5 JP 2023557439 A JP2023557439 A JP 2023557439A JP 2023557439 A JP2023557439 A JP 2023557439A JP 2024510657 A5 JP2024510657 A5 JP 2024510657A5
- Authority
- JP
- Japan
- Prior art keywords
- duty cycle
- approximately
- supplying
- substrate
- process gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/208,719 US11955333B2 (en) | 2021-03-22 | 2021-03-22 | Methods and apparatus for processing a substrate |
| US17/208,719 | 2021-03-22 | ||
| PCT/US2022/015222 WO2022203767A1 (en) | 2021-03-22 | 2022-02-04 | Methods and apparatus for processing a substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024510657A JP2024510657A (ja) | 2024-03-08 |
| JP2024510657A5 true JP2024510657A5 (https=) | 2025-02-12 |
Family
ID=83284174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023557439A Pending JP2024510657A (ja) | 2021-03-22 | 2022-02-04 | 基板を処理するための方法及び装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11955333B2 (https=) |
| JP (1) | JP2024510657A (https=) |
| KR (1) | KR20230159564A (https=) |
| CN (1) | CN116897409A (https=) |
| TW (1) | TW202300689A (https=) |
| WO (1) | WO2022203767A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230173016A (ko) * | 2022-06-16 | 2023-12-26 | 에이에스엠 아이피 홀딩 비.브이. | 실리콘 산화물을 포함한 층을 형성하기 위한 방법 및 시스템 |
| US12467144B2 (en) * | 2022-10-27 | 2025-11-11 | Applied Materials, Inc. | Methods of correlating zones of processing chambers, and related systems and methods |
| US20240312770A1 (en) * | 2023-03-16 | 2024-09-19 | Applied Materials, Inc. | Apparatus and methods for controlling substrate temperature during processing |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6055927A (en) * | 1997-01-14 | 2000-05-02 | Applied Komatsu Technology, Inc. | Apparatus and method for white powder reduction in silicon nitride deposition using remote plasma source cleaning technology |
| US7084832B2 (en) | 2001-10-09 | 2006-08-01 | Plasma Control Systems, Llc | Plasma production device and method and RF driver circuit with adjustable duty cycle |
| US6854479B2 (en) | 2002-08-26 | 2005-02-15 | Alden Harwood | Sump liner |
| US20080268154A1 (en) * | 2007-04-30 | 2008-10-30 | Shreyas Kher | Methods for depositing a high-k dielectric material using chemical vapor deposition process |
| US7943531B2 (en) | 2007-10-22 | 2011-05-17 | Applied Materials, Inc. | Methods for forming a silicon oxide layer over a substrate |
| KR101315950B1 (ko) * | 2009-06-24 | 2013-10-08 | 엘지전자 주식회사 | 플라즈마 증착 장치 및 이 장치를 이용한 박막 제조 방법 |
| US20110065276A1 (en) | 2009-09-11 | 2011-03-17 | Applied Materials, Inc. | Apparatus and Methods for Cyclical Oxidation and Etching |
| US9309594B2 (en) | 2010-04-26 | 2016-04-12 | Advanced Energy Industries, Inc. | System, method and apparatus for controlling ion energy distribution of a projected plasma |
| TWI496932B (zh) | 2012-03-09 | 2015-08-21 | 氣體產品及化學品股份公司 | 用於顯示裝置的阻絕物材料 |
| US9484191B2 (en) | 2013-03-08 | 2016-11-01 | Asm Ip Holding B.V. | Pulsed remote plasma method and system |
| CN105321869A (zh) | 2014-07-18 | 2016-02-10 | 联华电子股份有限公司 | 填沟介电层及其制作方法与应用 |
| US10566187B2 (en) * | 2015-03-20 | 2020-02-18 | Lam Research Corporation | Ultrathin atomic layer deposition film accuracy thickness control |
| US20170051405A1 (en) * | 2015-08-18 | 2017-02-23 | Asm Ip Holding B.V. | Method for forming sin or sicn film in trenches by peald |
| US11114306B2 (en) * | 2018-09-17 | 2021-09-07 | Applied Materials, Inc. | Methods for depositing dielectric material |
| WO2020223737A2 (en) | 2019-05-02 | 2020-11-05 | Lotus Applied Technology, Llc | High voltage, low pressure plasma enhanced atomic layer deposition |
| JP2022534793A (ja) | 2019-06-07 | 2022-08-03 | ラム リサーチ コーポレーション | 原子層堆積時における膜特性の原位置制御 |
-
2021
- 2021-03-22 US US17/208,719 patent/US11955333B2/en active Active
-
2022
- 2022-02-04 CN CN202280016117.1A patent/CN116897409A/zh active Pending
- 2022-02-04 JP JP2023557439A patent/JP2024510657A/ja active Pending
- 2022-02-04 WO PCT/US2022/015222 patent/WO2022203767A1/en not_active Ceased
- 2022-02-04 KR KR1020237036106A patent/KR20230159564A/ko active Pending
- 2022-03-01 TW TW111107241A patent/TW202300689A/zh unknown
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