JP2024504652A - 透明なワークピースを分割する方法 - Google Patents

透明なワークピースを分割する方法 Download PDF

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Publication number
JP2024504652A
JP2024504652A JP2023542970A JP2023542970A JP2024504652A JP 2024504652 A JP2024504652 A JP 2024504652A JP 2023542970 A JP2023542970 A JP 2023542970A JP 2023542970 A JP2023542970 A JP 2023542970A JP 2024504652 A JP2024504652 A JP 2024504652A
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JP
Japan
Prior art keywords
workpiece
laser radiation
zone
volume
pulse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2023542970A
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English (en)
Japanese (ja)
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JP2024504652A5 (cg-RX-API-DMAC7.html
Inventor
ブロス，マルクス
シャンボノー，マクシム
ノルテ，シュテファン
クムカル，マルテ
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Trumpf Laser und Systemtechnik GmbH
Original Assignee
Trumpf Laser und Systemtechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trumpf Laser und Systemtechnik GmbH filed Critical Trumpf Laser und Systemtechnik GmbH
Publication of JP2024504652A publication Critical patent/JP2024504652A/ja
Publication of JP2024504652A5 publication Critical patent/JP2024504652A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Electromagnetism (AREA)
JP2023542970A 2021-01-14 2022-01-10 透明なワークピースを分割する方法 Pending JP2024504652A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102021100675.9A DE102021100675B4 (de) 2021-01-14 2021-01-14 Verfahren zum Zerteilen eines transparenten Werkstücks
DE102021100675.9 2021-01-14
PCT/EP2022/050305 WO2022152637A1 (de) 2021-01-14 2022-01-10 Verfahren zum zerteilen eines transparenten werkstücks

Publications (2)

Publication Number Publication Date
JP2024504652A true JP2024504652A (ja) 2024-02-01
JP2024504652A5 JP2024504652A5 (cg-RX-API-DMAC7.html) 2024-12-17

Family

ID=80119358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023542970A Pending JP2024504652A (ja) 2021-01-14 2022-01-10 透明なワークピースを分割する方法

Country Status (8)

Country Link
US (1) US20230377970A1 (cg-RX-API-DMAC7.html)
EP (1) EP4277764A1 (cg-RX-API-DMAC7.html)
JP (1) JP2024504652A (cg-RX-API-DMAC7.html)
KR (1) KR20230130097A (cg-RX-API-DMAC7.html)
CN (1) CN117222493A (cg-RX-API-DMAC7.html)
CA (1) CA3204948A1 (cg-RX-API-DMAC7.html)
DE (1) DE102021100675B4 (cg-RX-API-DMAC7.html)
WO (1) WO2022152637A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2036015B1 (en) * 2023-10-12 2025-04-30 Micronit Holding B V A method of manufacturing a nozzle assembly, comprising weakening a wafer at at least two focal zones in the depth direction by focusing a laser beam

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013223886A (ja) * 2007-04-05 2013-10-31 Charm Engineering Co Ltd レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法
US20170252859A1 (en) * 2014-11-19 2017-09-07 Trumpf Laser- Und Systemtechnik Gmbh System for asymmetric optical beam shaping
JP2017528323A (ja) * 2014-07-14 2017-09-28 コーニング インコーポレイテッド 界面ブロック、そのような界面ブロックを使用する、ある波長範囲内で透過する基板を切断するためのシステムおよび方法

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Publication number Priority date Publication date Assignee Title
DE102007028042B3 (de) 2007-06-14 2008-08-07 Universität Zu Lübeck Verfahren zur Laserbearbeitung transparenter Materialien
RU2013102422A (ru) 2010-07-12 2014-08-20 ФАЙЛЭЙСЕР ЮЭс-Эй ЭлЭлСи Способ обработки материалов с использованием филаментации
TW201343296A (zh) 2012-03-16 2013-11-01 Ipg Microsystems Llc 使一工件中具有延伸深度虛飾之雷射切割系統及方法
DE102012110971B4 (de) 2012-11-14 2025-03-20 Schott Ag Verfahren zur Herstellung von linienförmig aufgereihten Schädigungsstellen in einem transparenten Werkstück sowie Verfahren und Vorrichtung zum Trennen eines Werkstücks
WO2014079478A1 (en) * 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) * 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
US9102007B2 (en) * 2013-08-02 2015-08-11 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser filamentation within transparent materials
US9676167B2 (en) * 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9938187B2 (en) 2014-02-28 2018-04-10 Rofin-Sinar Technologies Llc Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses
CN107073653B (zh) 2014-10-13 2019-11-26 艾维纳科技有限责任公司 用于劈开或切割基板的激光加工方法
JP6466369B2 (ja) * 2016-06-14 2019-02-06 イムラ アメリカ インコーポレイテッド 超短パルスレーザでの透明材料処理
EP3597353A1 (en) 2016-09-30 2020-01-22 Corning Incorporated Apparatuses for laser processing transparent workpieces using non-axisymmetric beam spots
DE102017121140A1 (de) * 2017-09-01 2019-03-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Laserbearbeitung eines transparenten Werkstücks
WO2019079417A2 (en) * 2017-10-20 2019-04-25 Corning Incorporated METHODS FOR LASER PROCESSING OF TRANSPARENT PARTS USING PULSED LASER BEAM FOCAL LINES AND CHEMICAL ETCHING SOLUTIONS
US20190233321A1 (en) * 2018-01-26 2019-08-01 Corning Incorporated Liquid-assisted laser micromachining of transparent dielectrics
US20200283325A1 (en) * 2019-03-05 2020-09-10 Corning Incorporated Methods for linear laser processing of transparent workpieces using pulsed laser beam focal lines and chemical etching solutions
US20220168847A1 (en) * 2019-06-10 2022-06-02 Electro Scientific Industries, Inc. Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013223886A (ja) * 2007-04-05 2013-10-31 Charm Engineering Co Ltd レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法
JP2017528323A (ja) * 2014-07-14 2017-09-28 コーニング インコーポレイテッド 界面ブロック、そのような界面ブロックを使用する、ある波長範囲内で透過する基板を切断するためのシステムおよび方法
US20170252859A1 (en) * 2014-11-19 2017-09-07 Trumpf Laser- Und Systemtechnik Gmbh System for asymmetric optical beam shaping

Also Published As

Publication number Publication date
KR20230130097A (ko) 2023-09-11
CA3204948A1 (en) 2022-07-21
WO2022152637A1 (de) 2022-07-21
DE102021100675A1 (de) 2022-07-14
EP4277764A1 (de) 2023-11-22
DE102021100675B4 (de) 2022-08-04
US20230377970A1 (en) 2023-11-23
CN117222493A (zh) 2023-12-12

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