DE102021100675B4 - Verfahren zum Zerteilen eines transparenten Werkstücks - Google Patents

Verfahren zum Zerteilen eines transparenten Werkstücks Download PDF

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Publication number
DE102021100675B4
DE102021100675B4 DE102021100675.9A DE102021100675A DE102021100675B4 DE 102021100675 B4 DE102021100675 B4 DE 102021100675B4 DE 102021100675 A DE102021100675 A DE 102021100675A DE 102021100675 B4 DE102021100675 B4 DE 102021100675B4
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DE
Germany
Prior art keywords
workpiece
laser radiation
convergence zone
beam convergence
volume
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102021100675.9A
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German (de)
English (en)
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DE102021100675A1 (de
Inventor
Markus Blothe
Maxime Chambonneau
Stefan Nolte
Malte Kumkar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Friedrich Schiller Universtaet Jena FSU
Trumpf Laser und Systemtechnik GmbH
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Friedrich Schiller Universtaet Jena FSU
Trumpf Laser und Systemtechnik GmbH
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to DE102021100675.9A priority Critical patent/DE102021100675B4/de
Application filed by Friedrich Schiller Universtaet Jena FSU, Trumpf Laser und Systemtechnik GmbH, Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical Friedrich Schiller Universtaet Jena FSU
Priority to EP22701879.3A priority patent/EP4277764A1/de
Priority to PCT/EP2022/050305 priority patent/WO2022152637A1/de
Priority to JP2023542970A priority patent/JP2024504652A/ja
Priority to KR1020237027585A priority patent/KR20230130097A/ko
Priority to CA3204948A priority patent/CA3204948A1/en
Priority to CN202280017510.2A priority patent/CN117222493A/zh
Publication of DE102021100675A1 publication Critical patent/DE102021100675A1/de
Application granted granted Critical
Publication of DE102021100675B4 publication Critical patent/DE102021100675B4/de
Priority to US18/221,501 priority patent/US20230377970A1/en
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Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Electromagnetism (AREA)
DE102021100675.9A 2021-01-14 2021-01-14 Verfahren zum Zerteilen eines transparenten Werkstücks Active DE102021100675B4 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE102021100675.9A DE102021100675B4 (de) 2021-01-14 2021-01-14 Verfahren zum Zerteilen eines transparenten Werkstücks
PCT/EP2022/050305 WO2022152637A1 (de) 2021-01-14 2022-01-10 Verfahren zum zerteilen eines transparenten werkstücks
JP2023542970A JP2024504652A (ja) 2021-01-14 2022-01-10 透明なワークピースを分割する方法
KR1020237027585A KR20230130097A (ko) 2021-01-14 2022-01-10 투명 작업물을 분할하기 위한 방법
EP22701879.3A EP4277764A1 (de) 2021-01-14 2022-01-10 Verfahren zum zerteilen eines transparenten werkstücks
CA3204948A CA3204948A1 (en) 2021-01-14 2022-01-10 Method for dividing a transparent workpiece
CN202280017510.2A CN117222493A (zh) 2021-01-14 2022-01-10 用于分割透明工件的方法
US18/221,501 US20230377970A1 (en) 2021-01-14 2023-07-13 Method for dividing a transparent workpiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102021100675.9A DE102021100675B4 (de) 2021-01-14 2021-01-14 Verfahren zum Zerteilen eines transparenten Werkstücks

Publications (2)

Publication Number Publication Date
DE102021100675A1 DE102021100675A1 (de) 2022-07-14
DE102021100675B4 true DE102021100675B4 (de) 2022-08-04

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DE102021100675.9A Active DE102021100675B4 (de) 2021-01-14 2021-01-14 Verfahren zum Zerteilen eines transparenten Werkstücks

Country Status (8)

Country Link
US (1) US20230377970A1 (cg-RX-API-DMAC7.html)
EP (1) EP4277764A1 (cg-RX-API-DMAC7.html)
JP (1) JP2024504652A (cg-RX-API-DMAC7.html)
KR (1) KR20230130097A (cg-RX-API-DMAC7.html)
CN (1) CN117222493A (cg-RX-API-DMAC7.html)
CA (1) CA3204948A1 (cg-RX-API-DMAC7.html)
DE (1) DE102021100675B4 (cg-RX-API-DMAC7.html)
WO (1) WO2022152637A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2036015B1 (en) * 2023-10-12 2025-04-30 Micronit Holding B V A method of manufacturing a nozzle assembly, comprising weakening a wafer at at least two focal zones in the depth direction by focusing a laser beam

Citations (9)

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DE102007028042B3 (de) 2007-06-14 2008-08-07 Universität Zu Lübeck Verfahren zur Laserbearbeitung transparenter Materialien
US20130126573A1 (en) 2010-07-12 2013-05-23 Filaser Inc. Method of material processing by laser filamentation
WO2013138802A1 (en) 2012-03-16 2013-09-19 Ipg Microsystems Llc Laser scribing with extended depth affectation into a workpiece
US20150246415A1 (en) 2014-02-28 2015-09-03 Rofin-Sinar Technologies Inc. Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses
WO2016059449A1 (en) 2014-10-13 2016-04-21 Evana Technologies, Uab Method of laser processing for substrate cleaving or dicing through forming "spike-like" shaped damage structures
EP2931467B1 (de) 2012-11-14 2017-06-14 Schott AG Verfahren zur herstellung von linienförmig aufgereihten schädigungsstellen durch ultrakurz fokussierter gepulster laserstrahlung ; verfahren und vorrichtung zum trennen eines werkstückes mittels ultrakurz fokussierter laserstrahlung unter verwendung einer schutzgasatmosphäre
US20170252859A1 (en) 2014-11-19 2017-09-07 Trumpf Laser- Und Systemtechnik Gmbh System for asymmetric optical beam shaping
DE102017121140A1 (de) 2017-09-01 2019-03-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Laserbearbeitung eines transparenten Werkstücks
EP3597353A1 (en) 2016-09-30 2020-01-22 Corning Incorporated Apparatuses for laser processing transparent workpieces using non-axisymmetric beam spots

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JP5784273B2 (ja) * 2007-04-05 2015-09-24 チャーム エンジニアリング株式会社 レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法
WO2014079478A1 (en) * 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) * 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
US9102007B2 (en) * 2013-08-02 2015-08-11 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser filamentation within transparent materials
US9676167B2 (en) * 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
CN107073641B (zh) * 2014-07-14 2020-11-10 康宁股份有限公司 接口块；用于使用这种接口块切割在波长范围内透明的衬底的系统和方法
JP6466369B2 (ja) * 2016-06-14 2019-02-06 イムラ アメリカ インコーポレイテッド 超短パルスレーザでの透明材料処理
WO2019079417A2 (en) * 2017-10-20 2019-04-25 Corning Incorporated METHODS FOR LASER PROCESSING OF TRANSPARENT PARTS USING PULSED LASER BEAM FOCAL LINES AND CHEMICAL ETCHING SOLUTIONS
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Publication number Priority date Publication date Assignee Title
DE102007028042B3 (de) 2007-06-14 2008-08-07 Universität Zu Lübeck Verfahren zur Laserbearbeitung transparenter Materialien
US20130126573A1 (en) 2010-07-12 2013-05-23 Filaser Inc. Method of material processing by laser filamentation
WO2013138802A1 (en) 2012-03-16 2013-09-19 Ipg Microsystems Llc Laser scribing with extended depth affectation into a workpiece
EP2931467B1 (de) 2012-11-14 2017-06-14 Schott AG Verfahren zur herstellung von linienförmig aufgereihten schädigungsstellen durch ultrakurz fokussierter gepulster laserstrahlung ; verfahren und vorrichtung zum trennen eines werkstückes mittels ultrakurz fokussierter laserstrahlung unter verwendung einer schutzgasatmosphäre
US20150246415A1 (en) 2014-02-28 2015-09-03 Rofin-Sinar Technologies Inc. Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses
WO2016059449A1 (en) 2014-10-13 2016-04-21 Evana Technologies, Uab Method of laser processing for substrate cleaving or dicing through forming "spike-like" shaped damage structures
US20170252859A1 (en) 2014-11-19 2017-09-07 Trumpf Laser- Und Systemtechnik Gmbh System for asymmetric optical beam shaping
EP3597353A1 (en) 2016-09-30 2020-01-22 Corning Incorporated Apparatuses for laser processing transparent workpieces using non-axisymmetric beam spots
DE102017121140A1 (de) 2017-09-01 2019-03-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Laserbearbeitung eines transparenten Werkstücks

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Maxime Chambonneau, Markus Blothe, Vladimir Yu. Fedorov, Tobias Heuermann, Gabor Matthäus, Alessandro Alberucci, Jens Limpert, Stylianos Tzortzakis, and Stefan Nolte: Processing bulk silicon with femtosecond laser pulses at 2-µm wavelength (Conference Presentation). In: Proc. SPIE, 11270, 2020, 112700E . https://doi.org/10.1117/12.2545820

Also Published As

Publication number Publication date
KR20230130097A (ko) 2023-09-11
JP2024504652A (ja) 2024-02-01
CA3204948A1 (en) 2022-07-21
WO2022152637A1 (de) 2022-07-21
DE102021100675A1 (de) 2022-07-14
EP4277764A1 (de) 2023-11-22
US20230377970A1 (en) 2023-11-23
CN117222493A (zh) 2023-12-12

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Owner name: TRUMPF LASER- UND SYSTEMTECHNIK GMBH, DE

Free format text: FORMER OWNERS: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG EINGETRAGENER VEREIN, 80686 MUENCHEN, DE; FRIEDRICH-SCHILLER-UNIVERSITAET JENA KOERPERSCHAFT DES OEFFENTLICHEN RECHTS, 07743 JENA, DE; TRUMPF GMBH + CO. KG, 71254 DITZINGEN, DE

Owner name: FRIEDRICH-SCHILLER-UNIVERSITAET JENA KOERPERSC, DE

Free format text: FORMER OWNERS: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG EINGETRAGENER VEREIN, 80686 MUENCHEN, DE; FRIEDRICH-SCHILLER-UNIVERSITAET JENA KOERPERSCHAFT DES OEFFENTLICHEN RECHTS, 07743 JENA, DE; TRUMPF GMBH + CO. KG, 71254 DITZINGEN, DE

Owner name: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANG, DE

Free format text: FORMER OWNERS: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG EINGETRAGENER VEREIN, 80686 MUENCHEN, DE; FRIEDRICH-SCHILLER-UNIVERSITAET JENA KOERPERSCHAFT DES OEFFENTLICHEN RECHTS, 07743 JENA, DE; TRUMPF GMBH + CO. KG, 71254 DITZINGEN, DE

R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final