WO2022152637A1 - Verfahren zum zerteilen eines transparenten werkstücks - Google Patents

Verfahren zum zerteilen eines transparenten werkstücks Download PDF

Info

Publication number
WO2022152637A1
WO2022152637A1 PCT/EP2022/050305 EP2022050305W WO2022152637A1 WO 2022152637 A1 WO2022152637 A1 WO 2022152637A1 EP 2022050305 W EP2022050305 W EP 2022050305W WO 2022152637 A1 WO2022152637 A1 WO 2022152637A1
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
laser radiation
convergence zone
beam convergence
volume
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2022/050305
Other languages
German (de)
English (en)
French (fr)
Inventor
Markus Blothe
Maxime CHAMBONNEAU
Stefan Nolte
Malte Kumkar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Friedrich Schiller Universtaet Jena FSU
Trumpf Laser und Systemtechnik GmbH
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Friedrich Schiller Universtaet Jena FSU
Trumpf Laser und Systemtechnik GmbH
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Friedrich Schiller Universtaet Jena FSU, Trumpf Laser und Systemtechnik GmbH, Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical Friedrich Schiller Universtaet Jena FSU
Priority to JP2023542970A priority Critical patent/JP2024504652A/ja
Priority to KR1020237027585A priority patent/KR20230130097A/ko
Priority to EP22701879.3A priority patent/EP4277764A1/de
Priority to CA3204948A priority patent/CA3204948A1/en
Priority to CN202280017510.2A priority patent/CN117222493A/zh
Publication of WO2022152637A1 publication Critical patent/WO2022152637A1/de
Priority to US18/221,501 priority patent/US20230377970A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Definitions

  • the invention solves this problem based on a method of the type specified at the outset in that non-linear propagation of the laser radiation in the volume of the workpiece is achieved by selecting the duration of the energy input generated by the non-linear absorption of the pulsed laser radiation in the beam convergence zone and/or by spatial beam shaping is suppressed outside the beam convergence zone.
  • the extent of the beam convergence zone should be greater transversely to the beam axis in the direction parallel to the plane of attenuation than perpendicular to it.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Electromagnetism (AREA)
PCT/EP2022/050305 2021-01-14 2022-01-10 Verfahren zum zerteilen eines transparenten werkstücks Ceased WO2022152637A1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2023542970A JP2024504652A (ja) 2021-01-14 2022-01-10 透明なワークピースを分割する方法
KR1020237027585A KR20230130097A (ko) 2021-01-14 2022-01-10 투명 작업물을 분할하기 위한 방법
EP22701879.3A EP4277764A1 (de) 2021-01-14 2022-01-10 Verfahren zum zerteilen eines transparenten werkstücks
CA3204948A CA3204948A1 (en) 2021-01-14 2022-01-10 Method for dividing a transparent workpiece
CN202280017510.2A CN117222493A (zh) 2021-01-14 2022-01-10 用于分割透明工件的方法
US18/221,501 US20230377970A1 (en) 2021-01-14 2023-07-13 Method for dividing a transparent workpiece

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021100675.9A DE102021100675B4 (de) 2021-01-14 2021-01-14 Verfahren zum Zerteilen eines transparenten Werkstücks
DE102021100675.9 2021-01-14

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/221,501 Continuation US20230377970A1 (en) 2021-01-14 2023-07-13 Method for dividing a transparent workpiece

Publications (1)

Publication Number Publication Date
WO2022152637A1 true WO2022152637A1 (de) 2022-07-21

Family

ID=80119358

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2022/050305 Ceased WO2022152637A1 (de) 2021-01-14 2022-01-10 Verfahren zum zerteilen eines transparenten werkstücks

Country Status (8)

Country Link
US (1) US20230377970A1 (cg-RX-API-DMAC7.html)
EP (1) EP4277764A1 (cg-RX-API-DMAC7.html)
JP (1) JP2024504652A (cg-RX-API-DMAC7.html)
KR (1) KR20230130097A (cg-RX-API-DMAC7.html)
CN (1) CN117222493A (cg-RX-API-DMAC7.html)
CA (1) CA3204948A1 (cg-RX-API-DMAC7.html)
DE (1) DE102021100675B4 (cg-RX-API-DMAC7.html)
WO (1) WO2022152637A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2036015B1 (en) * 2023-10-12 2025-04-30 Micronit Holding B V A method of manufacturing a nozzle assembly, comprising weakening a wafer at at least two focal zones in the depth direction by focusing a laser beam

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150034613A1 (en) * 2013-08-02 2015-02-05 Rofin-Sinar Technologies Inc. System for performing laser filamentation within transparent materials
US20150165562A1 (en) * 2013-12-17 2015-06-18 Corning Incorporated Laser processing of sapphire substrate and related applications
WO2016059449A1 (en) 2014-10-13 2016-04-21 Evana Technologies, Uab Method of laser processing for substrate cleaving or dicing through forming "spike-like" shaped damage structures
US20200010351A1 (en) * 2014-07-14 2020-01-09 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5784273B2 (ja) * 2007-04-05 2015-09-24 チャーム エンジニアリング株式会社 レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法
DE102007028042B3 (de) 2007-06-14 2008-08-07 Universität Zu Lübeck Verfahren zur Laserbearbeitung transparenter Materialien
RU2013102422A (ru) 2010-07-12 2014-08-20 ФАЙЛЭЙСЕР ЮЭс-Эй ЭлЭлСи Способ обработки материалов с использованием филаментации
TW201343296A (zh) 2012-03-16 2013-11-01 Ipg Microsystems Llc 使一工件中具有延伸深度虛飾之雷射切割系統及方法
DE102012110971B4 (de) 2012-11-14 2025-03-20 Schott Ag Verfahren zur Herstellung von linienförmig aufgereihten Schädigungsstellen in einem transparenten Werkstück sowie Verfahren und Vorrichtung zum Trennen eines Werkstücks
WO2014079478A1 (en) * 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) * 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
US9938187B2 (en) 2014-02-28 2018-04-10 Rofin-Sinar Technologies Llc Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses
EP3221727B1 (de) 2014-11-19 2021-03-17 Trumpf Laser- und Systemtechnik GmbH System zur asymmetrischen optischen strahlformung
JP6466369B2 (ja) * 2016-06-14 2019-02-06 イムラ アメリカ インコーポレイテッド 超短パルスレーザでの透明材料処理
EP3597353A1 (en) 2016-09-30 2020-01-22 Corning Incorporated Apparatuses for laser processing transparent workpieces using non-axisymmetric beam spots
DE102017121140A1 (de) * 2017-09-01 2019-03-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Laserbearbeitung eines transparenten Werkstücks
WO2019079417A2 (en) * 2017-10-20 2019-04-25 Corning Incorporated METHODS FOR LASER PROCESSING OF TRANSPARENT PARTS USING PULSED LASER BEAM FOCAL LINES AND CHEMICAL ETCHING SOLUTIONS
US20190233321A1 (en) * 2018-01-26 2019-08-01 Corning Incorporated Liquid-assisted laser micromachining of transparent dielectrics
US20200283325A1 (en) * 2019-03-05 2020-09-10 Corning Incorporated Methods for linear laser processing of transparent workpieces using pulsed laser beam focal lines and chemical etching solutions
US20220168847A1 (en) * 2019-06-10 2022-06-02 Electro Scientific Industries, Inc. Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150034613A1 (en) * 2013-08-02 2015-02-05 Rofin-Sinar Technologies Inc. System for performing laser filamentation within transparent materials
US20150165562A1 (en) * 2013-12-17 2015-06-18 Corning Incorporated Laser processing of sapphire substrate and related applications
US20200010351A1 (en) * 2014-07-14 2020-01-09 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
WO2016059449A1 (en) 2014-10-13 2016-04-21 Evana Technologies, Uab Method of laser processing for substrate cleaving or dicing through forming "spike-like" shaped damage structures

Also Published As

Publication number Publication date
KR20230130097A (ko) 2023-09-11
JP2024504652A (ja) 2024-02-01
CA3204948A1 (en) 2022-07-21
DE102021100675A1 (de) 2022-07-14
EP4277764A1 (de) 2023-11-22
DE102021100675B4 (de) 2022-08-04
US20230377970A1 (en) 2023-11-23
CN117222493A (zh) 2023-12-12

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