JP2024500368A - フォトレジスト除去剤組成物 - Google Patents

フォトレジスト除去剤組成物 Download PDF

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Publication number
JP2024500368A
JP2024500368A JP2023535670A JP2023535670A JP2024500368A JP 2024500368 A JP2024500368 A JP 2024500368A JP 2023535670 A JP2023535670 A JP 2023535670A JP 2023535670 A JP2023535670 A JP 2023535670A JP 2024500368 A JP2024500368 A JP 2024500368A
Authority
JP
Japan
Prior art keywords
mixture
hydrate
alkylene
solvent
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023535670A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024500368A5 (https=
Inventor
ウー・ヘンペン
レニー・デイヴィッド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Merck Patent GmbH
Original Assignee
Merck Patent GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent GmbH filed Critical Merck Patent GmbH
Publication of JP2024500368A publication Critical patent/JP2024500368A/ja
Publication of JP2024500368A5 publication Critical patent/JP2024500368A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/34—Organic compounds containing sulfur
    • C11D3/3418—Toluene -, xylene -, cumene -, benzene - or naphthalene sulfonates or sulfates
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/34—Organic compounds containing sulfur
    • C11D3/3472—Organic compounds containing sulfur additionally containing -COOH groups or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/43—Solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/264—Aldehydes; Ketones; Acetals or ketals
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5031—Azeotropic mixtures of non-halogenated solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Materials Engineering (AREA)
  • Detergent Compositions (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2023535670A 2020-12-15 2021-12-13 フォトレジスト除去剤組成物 Pending JP2024500368A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063125666P 2020-12-15 2020-12-15
US63/125,666 2020-12-15
PCT/EP2021/085370 WO2022128844A1 (en) 2020-12-15 2021-12-13 Photoresist remover compositions

Publications (2)

Publication Number Publication Date
JP2024500368A true JP2024500368A (ja) 2024-01-09
JP2024500368A5 JP2024500368A5 (https=) 2024-10-09

Family

ID=79259327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023535670A Pending JP2024500368A (ja) 2020-12-15 2021-12-13 フォトレジスト除去剤組成物

Country Status (7)

Country Link
US (1) US20240004303A1 (https=)
EP (1) EP4263776A1 (https=)
JP (1) JP2024500368A (https=)
KR (1) KR20230120663A (https=)
CN (1) CN116568794B (https=)
TW (1) TW202232252A (https=)
WO (1) WO2022128844A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001242641A (ja) * 2000-02-29 2001-09-07 Kanto Chem Co Inc フォトレジスト剥離液組成物およびそれを用いた半導体基板処理方法
JP2010535422A (ja) * 2007-08-02 2010-11-18 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド マイクロ電子デバイスから残渣を除去するための非フッ化物含有組成物

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2652942C3 (de) * 1976-11-22 1979-05-31 Hoechst Ag, 6000 Frankfurt Zweikomponenten-Diazotypiematerial
SU901265A1 (ru) * 1980-04-04 1982-01-30 Предприятие П/Я Р-6561 Раствор дл одновременного травлени и обезжиривани металлов
US5411595A (en) * 1993-07-13 1995-05-02 Mcgean-Rohco, Inc. Post-etch, printed circuit board cleaning process
RU2061101C1 (ru) * 1994-01-10 1996-05-27 Молохина Лариса Аркадьевна Раствор для одновременного травления и обезжиривания металлов
US6284721B1 (en) * 1997-01-21 2001-09-04 Ki Won Lee Cleaning and etching compositions
US6576394B1 (en) 2000-06-16 2003-06-10 Clariant Finance (Bvi) Limited Negative-acting chemically amplified photoresist composition
US6551973B1 (en) 2001-10-09 2003-04-22 General Chemical Corporation Stable metal-safe stripper for removing cured negative-tone novolak and acrylic photoresists and post-etch residue
JP4620680B2 (ja) * 2003-10-29 2011-01-26 マリンクロッド・ベイカー・インコーポレイテッド ハロゲン化金属の腐食阻害剤を含有するアルカリ性のプラズマエッチング／灰化後の残渣の除去剤およびフォトレジスト剥離組成物
KR20070023004A (ko) * 2005-08-23 2007-02-28 곽병훈 픽셀층 및 포토레지스트 제거액
KR100791687B1 (ko) * 2006-02-27 2008-01-03 채종근 결정성 클로피도그렐 설포살리실산 염을 포함하는 제제
US8288330B2 (en) * 2006-05-26 2012-10-16 Air Products And Chemicals, Inc. Composition and method for photoresist removal
SG177915A1 (en) * 2006-12-21 2012-02-28 Advanced Tech Materials Liquid cleaner for the removal of post-etch residues
WO2010091045A2 (en) * 2009-02-05 2010-08-12 Advanced Technology Materials, Inc. Non-fluoride containing composition for the removal of polymers and other organic material from a surface
FR2976290B1 (fr) * 2011-06-09 2014-08-15 Jerome Daviot Composition de solutions et conditions d'utilisation permettant le retrait et la dissolution complete de resines photo-lithographiques
US10613442B2 (en) 2015-03-12 2020-04-07 Merck Patent Gmbh Compositions and methods that promote charge complexing copper protection during low pKa driven polymer stripping
EP3251737A1 (en) * 2016-05-31 2017-12-06 Evonik Degussa GmbH Membrane-based processes for purification of cashew nut shell liquid
KR102499429B1 (ko) * 2017-02-10 2023-02-13 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 세정 제형
JP7759807B2 (ja) * 2018-12-21 2025-10-24 インテグリス・インコーポレーテッド コバルト基板のｃｍｐ後洗浄のための組成物及び方法
US11456170B2 (en) * 2019-04-15 2022-09-27 Taiwan Semiconductor Manufacturing Co., Ltd. Cleaning solution and method of cleaning wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001242641A (ja) * 2000-02-29 2001-09-07 Kanto Chem Co Inc フォトレジスト剥離液組成物およびそれを用いた半導体基板処理方法
JP2010535422A (ja) * 2007-08-02 2010-11-18 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド マイクロ電子デバイスから残渣を除去するための非フッ化物含有組成物

Also Published As

Publication number Publication date
KR20230120663A (ko) 2023-08-17
EP4263776A1 (en) 2023-10-25
US20240004303A1 (en) 2024-01-04
CN116568794A (zh) 2023-08-08
WO2022128844A1 (en) 2022-06-23
TW202232252A (zh) 2022-08-16
CN116568794B (zh) 2025-07-25

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