JP2024157941A5 - - Google Patents

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Publication number
JP2024157941A5
JP2024157941A5 JP2023072621A JP2023072621A JP2024157941A5 JP 2024157941 A5 JP2024157941 A5 JP 2024157941A5 JP 2023072621 A JP2023072621 A JP 2023072621A JP 2023072621 A JP2023072621 A JP 2023072621A JP 2024157941 A5 JP2024157941 A5 JP 2024157941A5
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JP
Japan
Prior art keywords
layer
silicon carbide
conductivity type
gate
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023072621A
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English (en)
Japanese (ja)
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JP2024157941A (ja
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Publication date
Application filed filed Critical
Priority to JP2023072621A priority Critical patent/JP2024157941A/ja
Priority claimed from JP2023072621A external-priority patent/JP2024157941A/ja
Priority to CN202480026118.3A priority patent/CN121003031A/zh
Priority to PCT/JP2024/016352 priority patent/WO2024225407A1/ja
Publication of JP2024157941A publication Critical patent/JP2024157941A/ja
Publication of JP2024157941A5 publication Critical patent/JP2024157941A5/ja
Priority to US19/365,566 priority patent/US20260047129A1/en
Pending legal-status Critical Current

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JP2023072621A 2023-04-26 2023-04-26 炭化珪素半導体装置 Pending JP2024157941A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2023072621A JP2024157941A (ja) 2023-04-26 2023-04-26 炭化珪素半導体装置
CN202480026118.3A CN121003031A (zh) 2023-04-26 2024-04-25 碳化硅半导体装置
PCT/JP2024/016352 WO2024225407A1 (ja) 2023-04-26 2024-04-25 炭化珪素半導体装置
US19/365,566 US20260047129A1 (en) 2023-04-26 2025-10-22 Silicon carbide semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023072621A JP2024157941A (ja) 2023-04-26 2023-04-26 炭化珪素半導体装置

Publications (2)

Publication Number Publication Date
JP2024157941A JP2024157941A (ja) 2024-11-08
JP2024157941A5 true JP2024157941A5 (https=) 2025-04-01

Family

ID=93256764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023072621A Pending JP2024157941A (ja) 2023-04-26 2023-04-26 炭化珪素半導体装置

Country Status (4)

Country Link
US (1) US20260047129A1 (https=)
JP (1) JP2024157941A (https=)
CN (1) CN121003031A (https=)
WO (1) WO2024225407A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111052393B (zh) * 2018-02-14 2023-11-14 富士电机株式会社 半导体装置
JP7635524B2 (ja) * 2020-09-08 2025-02-26 富士電機株式会社 半導体装置および半導体装置の製造方法
JP7647239B2 (ja) * 2021-03-30 2025-03-18 富士電機株式会社 半導体装置
JP7593225B2 (ja) * 2021-05-14 2024-12-03 株式会社デンソー 炭化珪素半導体装置
JP7643179B2 (ja) * 2021-05-24 2025-03-11 富士電機株式会社 炭化珪素半導体装置

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