JP2024145744A5 - - Google Patents
Info
- Publication number
- JP2024145744A5 JP2024145744A5 JP2023058228A JP2023058228A JP2024145744A5 JP 2024145744 A5 JP2024145744 A5 JP 2024145744A5 JP 2023058228 A JP2023058228 A JP 2023058228A JP 2023058228 A JP2023058228 A JP 2023058228A JP 2024145744 A5 JP2024145744 A5 JP 2024145744A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- oxide semiconductor
- semiconductor layer
- less
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023058228A JP2024145744A (ja) | 2023-03-31 | 2023-03-31 | 半導体装置及び半導体装置の作製方法 |
| DE102024202026.5A DE102024202026A1 (de) | 2023-03-31 | 2024-03-05 | Halbleitervorrichtung und verfahren zum herstellen einer halbleitervorrichtung |
| TW113108275A TWI915754B (zh) | 2023-03-31 | 2024-03-07 | 半導體裝置及半導體裝置之製作方法 |
| US18/604,840 US20240332427A1 (en) | 2023-03-31 | 2024-03-14 | Semiconductor device and method of manufacturing semiconductor device |
| KR1020240035649A KR102947069B1 (ko) | 2023-03-31 | 2024-03-14 | 반도체 장치 및 반도체 장치의 제작 방법 |
| CN202410326788.9A CN118738138A (zh) | 2023-03-31 | 2024-03-21 | 半导体装置及半导体装置的制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023058228A JP2024145744A (ja) | 2023-03-31 | 2023-03-31 | 半導体装置及び半導体装置の作製方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024145744A JP2024145744A (ja) | 2024-10-15 |
| JP2024145744A5 true JP2024145744A5 (https=) | 2026-04-06 |
Family
ID=92712874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023058228A Pending JP2024145744A (ja) | 2023-03-31 | 2023-03-31 | 半導体装置及び半導体装置の作製方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240332427A1 (https=) |
| JP (1) | JP2024145744A (https=) |
| KR (1) | KR102947069B1 (https=) |
| CN (1) | CN118738138A (https=) |
| DE (1) | DE102024202026A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8871565B2 (en) | 2010-09-13 | 2014-10-28 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| SG11201505225TA (en) | 2012-08-03 | 2015-08-28 | Semiconductor Energy Lab | Oxide semiconductor stacked film and semiconductor device |
| TWI761605B (zh) | 2012-09-14 | 2022-04-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| KR102220279B1 (ko) | 2012-10-19 | 2021-02-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 산화물 반도체막을 포함하는 다층막 및 반도체 장치의 제작 방법 |
| US9425217B2 (en) | 2013-09-23 | 2016-08-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2017137869A1 (en) | 2016-02-12 | 2017-08-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the semiconductor device |
-
2023
- 2023-03-31 JP JP2023058228A patent/JP2024145744A/ja active Pending
-
2024
- 2024-03-05 DE DE102024202026.5A patent/DE102024202026A1/de active Pending
- 2024-03-14 KR KR1020240035649A patent/KR102947069B1/ko active Active
- 2024-03-14 US US18/604,840 patent/US20240332427A1/en active Pending
- 2024-03-21 CN CN202410326788.9A patent/CN118738138A/zh active Pending
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