JP2024081802A5 - - Google Patents
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- Publication number
- JP2024081802A5 JP2024081802A5 JP2024065083A JP2024065083A JP2024081802A5 JP 2024081802 A5 JP2024081802 A5 JP 2024081802A5 JP 2024065083 A JP2024065083 A JP 2024065083A JP 2024065083 A JP2024065083 A JP 2024065083A JP 2024081802 A5 JP2024081802 A5 JP 2024081802A5
- Authority
- JP
- Japan
- Prior art keywords
- thermal connector
- bar
- thermal
- face
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762561408P | 2017-09-21 | 2017-09-21 | |
| US62/561,408 | 2017-09-21 | ||
| PCT/US2018/051725 WO2019060402A1 (en) | 2017-09-21 | 2018-09-19 | ELECTRICALLY INSULATING THERMAL CONNECTOR HAVING LOW THERMAL RESISTIVITY |
| JP2020516542A JP7547199B2 (ja) | 2017-09-21 | 2018-09-19 | 低い熱抵抗率を有する電気絶縁性サーマルコネクタ |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020516542A Division JP7547199B2 (ja) | 2017-09-21 | 2018-09-19 | 低い熱抵抗率を有する電気絶縁性サーマルコネクタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024081802A JP2024081802A (ja) | 2024-06-18 |
| JP2024081802A5 true JP2024081802A5 (enExample) | 2025-03-06 |
Family
ID=65720947
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020516542A Active JP7547199B2 (ja) | 2017-09-21 | 2018-09-19 | 低い熱抵抗率を有する電気絶縁性サーマルコネクタ |
| JP2024065083A Pending JP2024081802A (ja) | 2017-09-21 | 2024-04-15 | 低い熱抵抗率を有する電気絶縁性サーマルコネクタ |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020516542A Active JP7547199B2 (ja) | 2017-09-21 | 2018-09-19 | 低い熱抵抗率を有する電気絶縁性サーマルコネクタ |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US10660238B2 (enExample) |
| EP (2) | EP3685643B1 (enExample) |
| JP (2) | JP7547199B2 (enExample) |
| CN (1) | CN111108818B (enExample) |
| WO (1) | WO2019060402A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT521919B1 (de) * | 2018-12-13 | 2022-07-15 | Johann Kuebel Ing | Vorrichtung zur Abgabe von Licht |
| CN117461395A (zh) * | 2021-06-28 | 2024-01-26 | 京瓷Avx元器件公司 | 可嵌入的电绝缘热连接器、以及包括其的电路板 |
| US12177960B2 (en) | 2021-09-09 | 2024-12-24 | KYOCERA AVX Components Corporation | High frequency and high power thin film component |
| US20230076503A1 (en) * | 2021-09-09 | 2023-03-09 | KYOCERA AVX Components Corporation | Electronically Insulating Thermal Connector having a Low Thermal Resistivity |
| WO2024189135A1 (en) * | 2023-03-14 | 2024-09-19 | Lotus Microsystems Aps | A thermal conductor component |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS523977Y2 (enExample) * | 1972-07-15 | 1977-01-27 | ||
| US5262834A (en) * | 1988-12-06 | 1993-11-16 | Canon Kabushiki Kaisha | Image fixing apparatus |
| JPH0582715A (ja) * | 1991-09-24 | 1993-04-02 | Hitachi Denshi Ltd | チツプ状電子部品 |
| JPH07147467A (ja) * | 1993-11-25 | 1995-06-06 | Hitachi Ltd | 電子部品の放熱方法 |
| KR0143870B1 (ko) | 1993-12-27 | 1998-07-01 | 사토 후미오 | 고열전도성 질화규소 구조부재 및 반도체 패키지, 히터, 서멀헤드 |
| US5787976A (en) | 1996-07-01 | 1998-08-04 | Digital Equipment Corporation | Interleaved-fin thermal connector |
| JPH11288838A (ja) * | 1998-03-31 | 1999-10-19 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
| CA2337218C (en) | 1998-07-15 | 2009-04-28 | Thermon Manufacturing Company | Thermally-conductive, electrically non-conductive heat transfer material and articles made thereof |
| JP2000261271A (ja) * | 1999-03-04 | 2000-09-22 | Murata Mfg Co Ltd | 積層型ローパスフィルタ |
| JP4139634B2 (ja) * | 2002-06-28 | 2008-08-27 | 松下電器産業株式会社 | Ｌｅｄ照明装置およびその製造方法 |
| US20050168941A1 (en) | 2003-10-22 | 2005-08-04 | Sokol John L. | System and apparatus for heat removal |
| JP4862371B2 (ja) * | 2005-11-30 | 2012-01-25 | Ｔｄｋ株式会社 | 薄膜電子部品及びその製造方法 |
| JP2008270325A (ja) * | 2007-04-17 | 2008-11-06 | Matsushita Electric Ind Co Ltd | 静電気対策部品およびこれを用いた発光ダイオードモジュール |
| JP2010245563A (ja) * | 2010-07-16 | 2010-10-28 | Panasonic Corp | 部品ユニット |
| US8803183B2 (en) * | 2010-10-13 | 2014-08-12 | Ho Cheng Industrial Co., Ltd. | LED heat-conducting substrate and its thermal module |
| JP5408187B2 (ja) * | 2011-05-13 | 2014-02-05 | Ｔｄｋ株式会社 | アンテナ装置及びこれを用いた無線通信機器 |
| US9386725B2 (en) * | 2011-09-01 | 2016-07-05 | Hewlett-Packard Development Company, L.P. | Heat sinking |
| JP5496975B2 (ja) * | 2011-09-07 | 2014-05-21 | スタンレー電気株式会社 | 半導体装置モジュール |
| JP5741416B2 (ja) * | 2011-12-08 | 2015-07-01 | Tdk株式会社 | 電子部品の実装構造 |
| EP2800925B1 (en) * | 2012-01-03 | 2015-07-08 | Koninklijke Philips N.V. | A lighting assembly, a light source and a luminaire |
| JP5915350B2 (ja) * | 2012-04-19 | 2016-05-11 | 富士電機株式会社 | パワー半導体モジュール |
| DE102012215673A1 (de) * | 2012-09-04 | 2014-03-06 | Zf Friedrichshafen Ag | Anordnung eines elektrischen Steuergeräts an eine Schaltplatte |
| US9634214B2 (en) * | 2012-11-05 | 2017-04-25 | Ledengin, Inc. | Graphite-containing substrates for LED packages |
| US9304253B2 (en) * | 2013-03-07 | 2016-04-05 | Seagate Technology Llc | Near-field transducer with flare peg |
| JP6210720B2 (ja) * | 2013-05-02 | 2017-10-11 | シチズン電子株式会社 | Ｌｅｄパッケージ |
| EP2994947A1 (en) * | 2013-05-07 | 2016-03-16 | Boston-Power, Inc. | Device to prevent cell-to-cell thermal runaway propagation in a battery pack |
| JP6176218B2 (ja) * | 2014-10-06 | 2017-08-09 | トヨタ自動車株式会社 | フィルムコンデンサ |
| JP2017011142A (ja) * | 2015-06-24 | 2017-01-12 | Tdk株式会社 | セラミック電子部品 |
| US9839159B1 (en) * | 2015-09-01 | 2017-12-05 | Xilinx, Inc. | Dispense pattern for thermal interface material for a high aspect ratio thermal interface |
| US10123460B2 (en) * | 2015-11-13 | 2018-11-06 | Covidien LLP | System and method for thermal management of electronic devices |
| US9841772B2 (en) * | 2015-12-03 | 2017-12-12 | Te Connectivity Corporation | Temperature responsive thermal bridge |
| JP6686499B2 (ja) * | 2016-02-12 | 2020-04-22 | 株式会社村田製作所 | 半導体集積回路素子の放熱構造、ならびに、半導体集積回路素子及びその製造方法 |
| CN106058124A (zh) * | 2016-05-29 | 2016-10-26 | 合肥国轩高科动力能源有限公司 | 一种锂离子电池隔膜的制造方法 |
-
2018
- 2018-09-19 EP EP18859707.4A patent/EP3685643B1/en active Active
- 2018-09-19 EP EP25171931.6A patent/EP4567877A3/en active Pending
- 2018-09-19 US US16/135,303 patent/US10660238B2/en active Active
- 2018-09-19 WO PCT/US2018/051725 patent/WO2019060402A1/en not_active Ceased
- 2018-09-19 JP JP2020516542A patent/JP7547199B2/ja active Active
- 2018-09-19 CN CN201880060795.1A patent/CN111108818B/zh active Active
-
2020
- 2020-04-24 US US16/857,249 patent/US11116109B2/en active Active
-
2024
- 2024-04-15 JP JP2024065083A patent/JP2024081802A/ja active Pending
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