JP2024055539A - エッチング液 - Google Patents

エッチング液 Download PDF

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Publication number
JP2024055539A
JP2024055539A JP2022162558A JP2022162558A JP2024055539A JP 2024055539 A JP2024055539 A JP 2024055539A JP 2022162558 A JP2022162558 A JP 2022162558A JP 2022162558 A JP2022162558 A JP 2022162558A JP 2024055539 A JP2024055539 A JP 2024055539A
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JP
Japan
Prior art keywords
etching
film
etching solution
silicon nitride
compound
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Pending
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JP2022162558A
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English (en)
Japanese (ja)
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JP2024055539A5 (enExample
Inventor
寛司 佐藤
Kanji Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
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Kao Corp
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Priority to JP2022162558A priority Critical patent/JP2024055539A/ja
Publication of JP2024055539A publication Critical patent/JP2024055539A/ja
Publication of JP2024055539A5 publication Critical patent/JP2024055539A5/ja
Pending legal-status Critical Current

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JP2022162558A 2022-10-07 2022-10-07 エッチング液 Pending JP2024055539A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022162558A JP2024055539A (ja) 2022-10-07 2022-10-07 エッチング液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022162558A JP2024055539A (ja) 2022-10-07 2022-10-07 エッチング液

Publications (2)

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JP2024055539A true JP2024055539A (ja) 2024-04-18
JP2024055539A5 JP2024055539A5 (enExample) 2025-09-30

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ID=90716629

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JP2022162558A Pending JP2024055539A (ja) 2022-10-07 2022-10-07 エッチング液

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JP (1) JP2024055539A (enExample)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03115202A (ja) * 1989-04-17 1991-05-16 Monsanto Co 水溶性の向上した農薬
JP2014099480A (ja) * 2012-11-13 2014-05-29 Fujifilm Corp 半導体基板のエッチング方法及び半導体素子の製造方法
JP2018207108A (ja) * 2017-06-05 2018-12-27 バーサム マテリアルズ ユーエス，リミティド ライアビリティ カンパニー 半導体デバイスの製造中に窒化ケイ素を選択的に除去するためのエッチング溶液
US20210108140A1 (en) * 2019-10-09 2021-04-15 Entegris, Inc. Wet etching composition and method
JP2021086943A (ja) * 2019-11-28 2021-06-03 花王株式会社 エッチング液
JP2022048714A (ja) * 2020-09-15 2022-03-28 キオクシア株式会社 ケイ素窒化物用エッチング組成物及び半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03115202A (ja) * 1989-04-17 1991-05-16 Monsanto Co 水溶性の向上した農薬
JP2014099480A (ja) * 2012-11-13 2014-05-29 Fujifilm Corp 半導体基板のエッチング方法及び半導体素子の製造方法
JP2018207108A (ja) * 2017-06-05 2018-12-27 バーサム マテリアルズ ユーエス，リミティド ライアビリティ カンパニー 半導体デバイスの製造中に窒化ケイ素を選択的に除去するためのエッチング溶液
US20210108140A1 (en) * 2019-10-09 2021-04-15 Entegris, Inc. Wet etching composition and method
JP2021086943A (ja) * 2019-11-28 2021-06-03 花王株式会社 エッチング液
JP2022048714A (ja) * 2020-09-15 2022-03-28 キオクシア株式会社 ケイ素窒化物用エッチング組成物及び半導体装置の製造方法

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