JP2024046683A5 - - Google Patents
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- Publication number
- JP2024046683A5 JP2024046683A5 JP2024022512A JP2024022512A JP2024046683A5 JP 2024046683 A5 JP2024046683 A5 JP 2024046683A5 JP 2024022512 A JP2024022512 A JP 2024022512A JP 2024022512 A JP2024022512 A JP 2024022512A JP 2024046683 A5 JP2024046683 A5 JP 2024046683A5
- Authority
- JP
- Japan
- Prior art keywords
- plate
- holding
- shaped portion
- holding device
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024022512A JP2024046683A (ja) | 2021-09-15 | 2024-02-19 | 保持装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021150177A JP7458353B2 (ja) | 2021-09-15 | 2021-09-15 | 保持装置 |
| JP2024022512A JP2024046683A (ja) | 2021-09-15 | 2024-02-19 | 保持装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021150177A Division JP7458353B2 (ja) | 2021-09-15 | 2021-09-15 | 保持装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024046683A JP2024046683A (ja) | 2024-04-03 |
| JP2024046683A5 true JP2024046683A5 (enExample) | 2024-05-10 |
Family
ID=85724112
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021150177A Active JP7458353B2 (ja) | 2021-09-15 | 2021-09-15 | 保持装置 |
| JP2024022512A Pending JP2024046683A (ja) | 2021-09-15 | 2024-02-19 | 保持装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021150177A Active JP7458353B2 (ja) | 2021-09-15 | 2021-09-15 | 保持装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP7458353B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2024219229A1 (enExample) * | 2023-04-18 | 2024-10-24 | ||
| JP2025011772A (ja) * | 2023-07-11 | 2025-01-24 | 住友大阪セメント株式会社 | 静電チャック装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217508A (ja) * | 2001-01-19 | 2002-08-02 | Fuji Electric Co Ltd | 金属ベース基板およびその製造方法 |
| JP4727434B2 (ja) | 2006-01-18 | 2011-07-20 | 住友大阪セメント株式会社 | 静電チャック装置 |
| US8449786B2 (en) * | 2007-12-19 | 2013-05-28 | Lam Research Corporation | Film adhesive for semiconductor vacuum processing apparatus |
| US9520314B2 (en) * | 2008-12-19 | 2016-12-13 | Applied Materials, Inc. | High temperature electrostatic chuck bonding adhesive |
| JP5267603B2 (ja) * | 2010-03-24 | 2013-08-21 | Ｔｏｔｏ株式会社 | 静電チャック |
| JP6950148B2 (ja) | 2016-03-31 | 2021-10-13 | 三菱ケミカル株式会社 | 窒化アルミニウム−窒化ホウ素複合凝集粒子およびその製造方法 |
| JP6892811B2 (ja) * | 2017-10-02 | 2021-06-23 | 富士フイルム株式会社 | 組成物、熱伝導材料、熱伝導層付きデバイス |
| JP6886439B2 (ja) * | 2018-08-07 | 2021-06-16 | 日本特殊陶業株式会社 | 複合部材および接着剤組成物 |
| JP6899362B2 (ja) * | 2018-09-19 | 2021-07-07 | 日本特殊陶業株式会社 | 保持装置 |
| JP7261027B2 (ja) | 2019-02-06 | 2023-04-19 | 株式会社トクヤマ | シリコーン樹脂用窒化アルミニウムフィラー |
-
2021
- 2021-09-15 JP JP2021150177A patent/JP7458353B2/ja active Active
-
2024
- 2024-02-19 JP JP2024022512A patent/JP2024046683A/ja active Pending
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