JP2024020745A - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
- Publication number
- JP2024020745A JP2024020745A JP2022123167A JP2022123167A JP2024020745A JP 2024020745 A JP2024020745 A JP 2024020745A JP 2022123167 A JP2022123167 A JP 2022123167A JP 2022123167 A JP2022123167 A JP 2022123167A JP 2024020745 A JP2024020745 A JP 2024020745A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- gas
- opening
- airflow
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012545 processing Methods 0.000 title claims abstract description 148
- 239000000758 substrate Substances 0.000 title claims abstract description 142
- 239000007788 liquid Substances 0.000 claims abstract description 104
- 238000007664 blowing Methods 0.000 claims abstract description 12
- 230000003068 static effect Effects 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 6
- 238000009792 diffusion process Methods 0.000 claims description 4
- 239000012141 concentrate Substances 0.000 abstract description 7
- 239000007789 gas Substances 0.000 description 117
- 238000010586 diagram Methods 0.000 description 10
- 239000003595 mist Substances 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000007599 discharging Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 238000005192 partition Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 238000007667 floating Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000000834 fixative Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
- H05F3/06—Carrying-off electrostatic charges by means of ionising radiation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022123167A JP2024020745A (ja) | 2022-08-02 | 2022-08-02 | 基板処理装置 |
CN202310872827.0A CN117497446A (zh) | 2022-08-02 | 2023-07-17 | 基板处理装置 |
KR1020230092994A KR20240018364A (ko) | 2022-08-02 | 2023-07-18 | 기판 처리 장치 |
TW112127657A TW202407793A (zh) | 2022-08-02 | 2023-07-25 | 基板處理裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022123167A JP2024020745A (ja) | 2022-08-02 | 2022-08-02 | 基板処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2024020745A true JP2024020745A (ja) | 2024-02-15 |
Family
ID=89667826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022123167A Pending JP2024020745A (ja) | 2022-08-02 | 2022-08-02 | 基板処理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2024020745A (ko) |
KR (1) | KR20240018364A (ko) |
CN (1) | CN117497446A (ko) |
TW (1) | TW202407793A (ko) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6045840B2 (ja) | 2012-07-30 | 2016-12-14 | 株式会社Screenホールディングス | 基板処理装置 |
-
2022
- 2022-08-02 JP JP2022123167A patent/JP2024020745A/ja active Pending
-
2023
- 2023-07-17 CN CN202310872827.0A patent/CN117497446A/zh active Pending
- 2023-07-18 KR KR1020230092994A patent/KR20240018364A/ko unknown
- 2023-07-25 TW TW112127657A patent/TW202407793A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20240018364A (ko) | 2024-02-13 |
CN117497446A (zh) | 2024-02-02 |
TW202407793A (zh) | 2024-02-16 |
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