JP2023544991A - 耐高温バインダ - Google Patents
耐高温バインダ Download PDFInfo
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- JP2023544991A JP2023544991A JP2023519612A JP2023519612A JP2023544991A JP 2023544991 A JP2023544991 A JP 2023544991A JP 2023519612 A JP2023519612 A JP 2023519612A JP 2023519612 A JP2023519612 A JP 2023519612A JP 2023544991 A JP2023544991 A JP 2023544991A
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- Prior art keywords
- inorganic binder
- solution
- gel
- silica sol
- binder according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000011230 binding agent Substances 0.000 title claims abstract description 74
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 76
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 32
- 238000006243 chemical reaction Methods 0.000 claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 6
- 239000002904 solvent Substances 0.000 claims description 37
- 239000000945 filler Substances 0.000 claims description 22
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 18
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 16
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 12
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 11
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 9
- 239000002952 polymeric resin Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 6
- 229910021485 fumed silica Inorganic materials 0.000 claims description 5
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 4
- 239000004115 Sodium Silicate Substances 0.000 claims description 4
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims description 4
- 229910001634 calcium fluoride Inorganic materials 0.000 claims description 4
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 claims description 4
- 229910001635 magnesium fluoride Inorganic materials 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 4
- 229920002545 silicone oil Polymers 0.000 claims description 4
- 229920002050 silicone resin Polymers 0.000 claims description 4
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 4
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 4
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 claims description 4
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 claims description 4
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims description 3
- 229920003169 water-soluble polymer Polymers 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 2
- 239000004606 Fillers/Extenders Substances 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 19
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 239000000499 gel Substances 0.000 description 33
- 230000005284 excitation Effects 0.000 description 19
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 239000007822 coupling agent Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000002270 dispersing agent Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000004970 Chain extender Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003981 capillary liquid chromatography Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- -1 phosphors Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229940024463 silicone emollient and protective product Drugs 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J1/00—Adhesives based on inorganic constituents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2033—LED or laser light sources
- G03B21/204—LED or laser light sources using secondary light emission, e.g. luminescence or fluorescence
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Luminescent Compositions (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Optical Filters (AREA)
Abstract
Description
Claims (15)
- 無機バインダであって、
シリカゾルゲルと水とを含むシリカゾルゲル溶液と、
シランカップリング剤と、
アルコール可溶性溶媒と、
充填剤と、
を備える、無機バインダ。 - 前記シリカゾルゲルは、ナノ酸性であり、約4~5のPH値を有する、請求項1に記載の無機バインダ。
- 前記シランカップリング剤は、トリメトキシシラン、トリエトキシシラン、テトラメチルシリケート、テトラエチルシリケートのうちの1つ以上からなる、請求項1又は2に記載の無機バインダ。
- 前記アルコール可溶性溶媒は、水、エタノール、イソプロピルアルコール、エチレングリコール、プロピレングリコールのうちの1つ以上からなる、請求項1~3のいずれか1項に記載の無機バインダ。
- 前記充填剤は、水酸基変性シリコーン樹脂、水酸基変性ポリマー樹脂、マイクロ・ナノフッ化カルシウム、マイクロ・ナノフッ化マグネシウム、マイクロ・ナノ石英、マイクロ・ナノ低融点ガラス粉、フュームドシリカ、ケイ酸ナトリウム、シラン鎖延長剤、水酸基変性シリコーンオイル、テトラエチルオルソシリケート、水溶性ポリマー樹脂のうちの1つ以上からなる、請求項1~4のいずれか1項に記載の無機バインダ。
- 前記シリカゾルゲル液、シランカップリング剤、アルコール可溶性溶媒、及び充填剤は、PH値が約4.5である、請求項1~5のいずれか1項に記載の無機バインダ。
- 無機バインダの製造方法であって、
容器にアルコール可溶性溶媒とシランカップリング剤とを添加し、前記アルコール可溶性溶媒とシランカップリング剤とを混合し、第1の溶液を形成し、
前記第1の溶液にシリカゾルゲルを添加し、前記シリカゾルゲルと前記第1の溶液とを混合し、第2の溶液を形成し、
前記第2の溶液に充填剤を添加し、前記充填剤と前記第2の溶液との間の化学反応が完了するまで前記充填剤と前記第2の溶液とを混合し、第3の溶液を形成し、
前記第3の溶液から余分な水分を除去する、無機バインダの製造方法。 - 前記アルコール可溶性溶媒と、前記シランカップリング剤とを、4℃~約20℃、好ましくは10℃~約20℃で、約2分~30分間混合する、請求項7に記載の無機バインダの製造方法。
- 前記シリカゾルゲルと前記第1の溶液とを4℃~約20℃、好ましくは10℃~約20℃で約1時間~約3時間混合する、請求項7又は8に記載の無機バインダの製造方法。
- 前記充填剤と前記第2の溶液とを4℃~約20℃、好ましくは10℃~約20℃で約2時間~約48時間混合する、請求項7~9のいずれか1項に記載の無機バインダの製造方法。
- 前記シリカゾルゲルは、ナノ酸性であり、約4~5のPH値を有する、請求項7~10のいずれか1項に記載の無機バインダの製造方法。
- 前記シランカップリング剤は、トリメトキシシラン、トリエトキシシラン、テトラメチルシリケート、及びテトラエチルシリケートのうちの1つ以上からなる、請求項7~11のいずれか1項に記載の無機バインダの製造方法。
- 前記アルコール可溶性溶媒は、水、エタノール、イソプロピルアルコール、エチレングリコール、プロピレングリコールのうちの1つ以上からなる、請求項7~13のいずれか1項に記載の無機バインダの製造方法。
- 前記充填剤は、水酸基変性シリコーン樹脂、水酸基変性ポリマー樹脂、マイクロ・ナノフッ化カルシウム、マイクロ・ナノフッ化マグネシウム、マイクロ・ナノ石英、マイクロ・ナノ低融点ガラス粉、ヒュームドシリカ、ケイ酸ナトリウム、シラン鎖延長剤、水酸基変性シリコーンオイル、テトラエチルオルソシリケート、水溶性ポリマー樹脂のうちの1つ以上からなる、請求項7~14のいずれか1項に記載の無機バインダの製造方法。
- 前記第3の溶液から水を除去する前に、前記第3の溶液のPHを試験し、値を4.5に調整する、請求項7~11のいずれか1項に記載の無機バインダの製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2020/119443 WO2022067685A1 (en) | 2020-09-30 | 2020-09-30 | High temperature resistant binder |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2023544991A true JP2023544991A (ja) | 2023-10-26 |
Family
ID=81000015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023519612A Pending JP2023544991A (ja) | 2020-09-30 | 2020-09-30 | 耐高温バインダ |
Country Status (6)
Country | Link |
---|---|
US (1) | US20230279267A1 (ja) |
EP (1) | EP4222229A1 (ja) |
JP (1) | JP2023544991A (ja) |
CN (1) | CN116419957A (ja) |
TW (1) | TW202214796A (ja) |
WO (1) | WO2022067685A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115584212B (zh) * | 2022-10-27 | 2023-11-03 | 盛吉盛(宁波)半导体科技有限公司 | 一种硅材料粘接剂及其制备方法和使用方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04145178A (ja) * | 1990-10-05 | 1992-05-19 | Tokiwa Denki:Kk | 接着剤 |
EP2634163A4 (en) * | 2010-10-26 | 2014-04-16 | Sumitomo Chemical Co | SEALING MATERIAL AND METHOD FOR MANUFACTURING A CERAMIC BONE BODY OF BEES |
CN102533130B (zh) * | 2010-12-07 | 2013-10-02 | 上海务宝机电科技有限公司 | 防水自固化无机型导热胶泥 |
JP4814402B1 (ja) * | 2011-03-18 | 2011-11-16 | ニチアス株式会社 | 無機繊維用接着剤 |
CN111149432B (zh) * | 2017-09-20 | 2023-05-12 | 美题隆精密光学(上海)有限公司 | 具有无机粘结剂的荧光轮 |
WO2019056208A1 (en) * | 2017-09-20 | 2019-03-28 | Materion Precision Optics (Shanghai) Limited | ENHANCED INORGANIC BINDER LIGHT CONVERTING DEVICE |
-
2020
- 2020-09-30 JP JP2023519612A patent/JP2023544991A/ja active Pending
- 2020-09-30 WO PCT/CN2020/119443 patent/WO2022067685A1/en unknown
- 2020-09-30 US US18/018,941 patent/US20230279267A1/en active Pending
- 2020-09-30 CN CN202080105668.6A patent/CN116419957A/zh active Pending
- 2020-09-30 EP EP20955710.7A patent/EP4222229A1/en active Pending
- 2020-11-03 TW TW109138172A patent/TW202214796A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP4222229A1 (en) | 2023-08-09 |
WO2022067685A1 (en) | 2022-04-07 |
TW202214796A (zh) | 2022-04-16 |
US20230279267A1 (en) | 2023-09-07 |
CN116419957A (zh) | 2023-07-11 |
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